JPS59180450U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS59180450U
JPS59180450U JP7583983U JP7583983U JPS59180450U JP S59180450 U JPS59180450 U JP S59180450U JP 7583983 U JP7583983 U JP 7583983U JP 7583983 U JP7583983 U JP 7583983U JP S59180450 U JPS59180450 U JP S59180450U
Authority
JP
Japan
Prior art keywords
lead
resin
semiconductor device
sealed
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7583983U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0419805Y2 (enrdf_load_stackoverflow
Inventor
進 林
岡村　富雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP7583983U priority Critical patent/JPS59180450U/ja
Publication of JPS59180450U publication Critical patent/JPS59180450U/ja
Application granted granted Critical
Publication of JPH0419805Y2 publication Critical patent/JPH0419805Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7583983U 1983-05-20 1983-05-20 樹脂封止型半導体装置 Granted JPS59180450U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7583983U JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7583983U JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS59180450U true JPS59180450U (ja) 1984-12-01
JPH0419805Y2 JPH0419805Y2 (enrdf_load_stackoverflow) 1992-05-06

Family

ID=30205898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7583983U Granted JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS59180450U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074511A (ja) * 2010-09-28 2012-04-12 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074511A (ja) * 2010-09-28 2012-04-12 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0419805Y2 (enrdf_load_stackoverflow) 1992-05-06

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