JPS59177951A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59177951A
JPS59177951A JP58051492A JP5149283A JPS59177951A JP S59177951 A JPS59177951 A JP S59177951A JP 58051492 A JP58051492 A JP 58051492A JP 5149283 A JP5149283 A JP 5149283A JP S59177951 A JPS59177951 A JP S59177951A
Authority
JP
Japan
Prior art keywords
terminal
resin
notches
zigzag
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58051492A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0151058B2 (cg-RX-API-DMAC10.html
Inventor
Shinjiro Kojima
小島　伸次郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58051492A priority Critical patent/JPS59177951A/ja
Publication of JPS59177951A publication Critical patent/JPS59177951A/ja
Publication of JPH0151058B2 publication Critical patent/JPH0151058B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58051492A 1983-03-29 1983-03-29 半導体装置 Granted JPS59177951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58051492A JPS59177951A (ja) 1983-03-29 1983-03-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58051492A JPS59177951A (ja) 1983-03-29 1983-03-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS59177951A true JPS59177951A (ja) 1984-10-08
JPH0151058B2 JPH0151058B2 (cg-RX-API-DMAC10.html) 1989-11-01

Family

ID=12888462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58051492A Granted JPS59177951A (ja) 1983-03-29 1983-03-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS59177951A (cg-RX-API-DMAC10.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193553A (ja) * 1987-01-21 1988-08-10 シーメンス、アクチエンゲゼルシヤフト 半導体装置
JPH03212962A (ja) * 1990-01-18 1991-09-18 Toshiba Corp 半導体装置用部品
JPH0515450U (ja) * 1991-08-06 1993-02-26 株式会社三社電機製作所 電力用半導体モジユール
JPH062714U (ja) * 1992-06-03 1994-01-14 株式会社三社電機製作所 電力用半導体モジュール
JP2003204037A (ja) * 2001-12-24 2003-07-18 Abb Res Ltd モジュールハウジング及び電力半導体モジュール
JP2007252433A (ja) * 2006-03-20 2007-10-04 Olympia:Kk 遊技機用メモリチップソケット
JP2015213408A (ja) * 2014-05-07 2015-11-26 株式会社日立製作所 半導体パワーモジュール、電力変換装置、およびこれを用いた移動体
WO2017208941A1 (ja) * 2016-06-01 2017-12-07 三菱電機株式会社 半導体装置及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717156A (en) * 1980-03-26 1982-01-28 Thomson Csf Sealing box for power module of hybrid circuit
JPS5758781U (cg-RX-API-DMAC10.html) * 1980-09-25 1982-04-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717156A (en) * 1980-03-26 1982-01-28 Thomson Csf Sealing box for power module of hybrid circuit
JPS5758781U (cg-RX-API-DMAC10.html) * 1980-09-25 1982-04-07

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193553A (ja) * 1987-01-21 1988-08-10 シーメンス、アクチエンゲゼルシヤフト 半導体装置
JPH03212962A (ja) * 1990-01-18 1991-09-18 Toshiba Corp 半導体装置用部品
JPH0515450U (ja) * 1991-08-06 1993-02-26 株式会社三社電機製作所 電力用半導体モジユール
JPH062714U (ja) * 1992-06-03 1994-01-14 株式会社三社電機製作所 電力用半導体モジュール
JP2003204037A (ja) * 2001-12-24 2003-07-18 Abb Res Ltd モジュールハウジング及び電力半導体モジュール
JP2007252433A (ja) * 2006-03-20 2007-10-04 Olympia:Kk 遊技機用メモリチップソケット
JP2015213408A (ja) * 2014-05-07 2015-11-26 株式会社日立製作所 半導体パワーモジュール、電力変換装置、およびこれを用いた移動体
WO2017208941A1 (ja) * 2016-06-01 2017-12-07 三菱電機株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPH0151058B2 (cg-RX-API-DMAC10.html) 1989-11-01

Similar Documents

Publication Publication Date Title
JP2548350B2 (ja) テープ自動結合に使用される熱放散相互接続テープ
US20030000082A1 (en) IC package with dual heat spreaders
JP2001217354A (ja) 半導体チップの実装構造、および半導体装置
JP3764687B2 (ja) 電力半導体装置及びその製造方法
JPH0777258B2 (ja) 半導体装置
JPS59177951A (ja) 半導体装置
JPS62202548A (ja) 半導体装置
KR100526667B1 (ko) 수지밀봉형반도체장치및그제조방법
JPH05259334A (ja) 半導体装置
JP2710986B2 (ja) 電子装置
JPH06268086A (ja) 半導体集積回路装置およびそれが装着されるプリント基板
JP3295457B2 (ja) 半導体装置
JP3238906B2 (ja) 半導体装置
KR100321149B1 (ko) 칩사이즈 패키지
JP2705281B2 (ja) 半導体装置の実装構造
JP3036484B2 (ja) 半導体装置とその製造方法
JPS6329960A (ja) 樹脂封止型半導体装置用リ−ドフレ−ム
JPS62276836A (ja) 半導体装置
JPH04320052A (ja) 半導体装置
JPH0448769A (ja) 半導体装置
JPH11150208A (ja) 半導体素子の実装方法
JPS61242053A (ja) 半導体装置
JPS59107546A (ja) 集積回路装置
JPH02244746A (ja) 樹脂封止型半導体装置
JPH03109755A (ja) 樹脂封止型ｉｃ