JPS5893345A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5893345A
JPS5893345A JP19254481A JP19254481A JPS5893345A JP S5893345 A JPS5893345 A JP S5893345A JP 19254481 A JP19254481 A JP 19254481A JP 19254481 A JP19254481 A JP 19254481A JP S5893345 A JPS5893345 A JP S5893345A
Authority
JP
Japan
Prior art keywords
piece
pieces
layer
single crystal
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19254481A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0341984B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Yuji Okuto
奥戸 雄二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP19254481A priority Critical patent/JPS5893345A/ja
Publication of JPS5893345A publication Critical patent/JPS5893345A/ja
Publication of JPH0341984B2 publication Critical patent/JPH0341984B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP19254481A 1981-11-30 1981-11-30 半導体装置の製造方法 Granted JPS5893345A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19254481A JPS5893345A (ja) 1981-11-30 1981-11-30 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19254481A JPS5893345A (ja) 1981-11-30 1981-11-30 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5893345A true JPS5893345A (ja) 1983-06-03
JPH0341984B2 JPH0341984B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-06-25

Family

ID=16293038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19254481A Granted JPS5893345A (ja) 1981-11-30 1981-11-30 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5893345A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948950A (ja) * 1982-09-13 1984-03-21 Agency Of Ind Science & Technol 三次元集積回路構造体の製造方法
JPS6052047A (ja) * 1983-06-27 1985-03-23 テレタイプ コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052046A (ja) * 1983-06-27 1985-03-23 テレタイプ コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052048A (ja) * 1983-06-27 1985-03-23 テレタイプ コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS62272556A (ja) * 1986-05-20 1987-11-26 Fujitsu Ltd 三次元半導体集積回路装置及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423484A (en) * 1977-07-25 1979-02-22 Hitachi Ltd Semiconductor integrated circuit and its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5423484A (en) * 1977-07-25 1979-02-22 Hitachi Ltd Semiconductor integrated circuit and its manufacture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948950A (ja) * 1982-09-13 1984-03-21 Agency Of Ind Science & Technol 三次元集積回路構造体の製造方法
JPS6052047A (ja) * 1983-06-27 1985-03-23 テレタイプ コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052046A (ja) * 1983-06-27 1985-03-23 テレタイプ コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS6052048A (ja) * 1983-06-27 1985-03-23 テレタイプ コ−ポレ−シヨン 集積回路デバイスの製作方法
JPS62272556A (ja) * 1986-05-20 1987-11-26 Fujitsu Ltd 三次元半導体集積回路装置及びその製造方法

Also Published As

Publication number Publication date
JPH0341984B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-06-25

Similar Documents

Publication Publication Date Title
JPS5853822A (ja) 積層半導体装置
JPS5893345A (ja) 半導体装置の製造方法
JPH02199860A (ja) 高密度半導体構造体及びその製造方法
JPH03270162A (ja) 半導体装置の製造方法
JPS5842227A (ja) 半導体装置の製造方法
JPS59232440A (ja) 半導体装置の製造方法
JPS5890724A (ja) 積層半導体装置の製造方法
JPS59114829A (ja) 窒化シリコン膜の製造方法
JPH11154708A (ja) プログラミング可能な半導体装置
CN104576516B (zh) 金属互连结构的制造方法
TW201126679A (en) Coreless packaging substrate and method for manufacturing the same
JPS58143559A (ja) 多層構造半導体集積回路装置およびその製造方法
JPH03104276A (ja) 半導体装置の製造方法
JPH01202876A (ja) ジョセフソン接合素子の作製方法
JPH01118435A (ja) アルミニュウムとモリブデンの複合材料及びその製造方法
JPH03104190A (ja) 多層配線板およびその製造方法
JPS58182247A (ja) 半導体装置の突起電極の形成方法
JPH05208899A (ja) 性状が異なる領域を有する酸化物超電導薄膜と作製方法
JPS59130482A (ja) 半導体装置の製造方法
JPS6151821A (ja) 半導体装置の製造方法
JPS63293948A (ja) 層間絶縁膜の形成方法
JPS62124753A (ja) 絶縁層分離基板の製法
JPH01253228A (ja) 半導体装置の製造方法
JPS60161653A (ja) 半導体立体回路素子の製造方法
JPS59215746A (ja) 半導体装置の製造方法