JPS5891662A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS5891662A JPS5891662A JP56190294A JP19029481A JPS5891662A JP S5891662 A JPS5891662 A JP S5891662A JP 56190294 A JP56190294 A JP 56190294A JP 19029481 A JP19029481 A JP 19029481A JP S5891662 A JPS5891662 A JP S5891662A
- Authority
- JP
- Japan
- Prior art keywords
- blocking material
- polyimide
- ray blocking
- contact angle
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W42/25—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/884—
-
- H10W74/00—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190294A JPS5891662A (ja) | 1981-11-27 | 1981-11-27 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56190294A JPS5891662A (ja) | 1981-11-27 | 1981-11-27 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5891662A true JPS5891662A (ja) | 1983-05-31 |
| JPS6211508B2 JPS6211508B2 (enExample) | 1987-03-12 |
Family
ID=16255770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56190294A Granted JPS5891662A (ja) | 1981-11-27 | 1981-11-27 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5891662A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63221630A (ja) * | 1987-03-10 | 1988-09-14 | Mitsubishi Electric Corp | 半導体装置 |
| US5171716A (en) * | 1986-12-19 | 1992-12-15 | North American Philips Corp. | Method of manufacturing semiconductor device with reduced packaging stress |
| JP2005510084A (ja) * | 2001-11-23 | 2005-04-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体デバイス、及び集積回路を包む方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5776869U (enExample) * | 1980-10-29 | 1982-05-12 | ||
| JPS5860545A (ja) * | 1981-10-06 | 1983-04-11 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
-
1981
- 1981-11-27 JP JP56190294A patent/JPS5891662A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5776869U (enExample) * | 1980-10-29 | 1982-05-12 | ||
| JPS5860545A (ja) * | 1981-10-06 | 1983-04-11 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5171716A (en) * | 1986-12-19 | 1992-12-15 | North American Philips Corp. | Method of manufacturing semiconductor device with reduced packaging stress |
| JPS63221630A (ja) * | 1987-03-10 | 1988-09-14 | Mitsubishi Electric Corp | 半導体装置 |
| JP2005510084A (ja) * | 2001-11-23 | 2005-04-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体デバイス、及び集積回路を包む方法 |
| JP2010147500A (ja) * | 2001-11-23 | 2010-07-01 | Taiwan Semiconductor Manufacturing Co Ltd | 半導体デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6211508B2 (enExample) | 1987-03-12 |
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