JPS5853161U - マルチチツプ薄膜モジユ−ル - Google Patents

マルチチツプ薄膜モジユ−ル

Info

Publication number
JPS5853161U
JPS5853161U JP1982125066U JP12506682U JPS5853161U JP S5853161 U JPS5853161 U JP S5853161U JP 1982125066 U JP1982125066 U JP 1982125066U JP 12506682 U JP12506682 U JP 12506682U JP S5853161 U JPS5853161 U JP S5853161U
Authority
JP
Japan
Prior art keywords
lines
thin film
bias
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982125066U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0220848Y2 (enExample
Inventor
ト−マス・ピ−タ−・カ−リ−
ノ−マン・ゴ−ルドバ−グ
Original Assignee
スペリ−・コ−ポレ−シヨン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スペリ−・コ−ポレ−シヨン filed Critical スペリ−・コ−ポレ−シヨン
Publication of JPS5853161U publication Critical patent/JPS5853161U/ja
Application granted granted Critical
Publication of JPH0220848Y2 publication Critical patent/JPH0220848Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/685—
    • H10W76/153—
    • H10W72/075—
    • H10W72/29—
    • H10W72/5363—
    • H10W72/952—
    • H10W90/724—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1982125066U 1981-08-21 1982-08-20 マルチチツプ薄膜モジユ−ル Granted JPS5853161U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/294,100 US4446477A (en) 1981-08-21 1981-08-21 Multichip thin film module
US294100 1981-08-21

Publications (2)

Publication Number Publication Date
JPS5853161U true JPS5853161U (ja) 1983-04-11
JPH0220848Y2 JPH0220848Y2 (enExample) 1990-06-06

Family

ID=23131876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982125066U Granted JPS5853161U (ja) 1981-08-21 1982-08-20 マルチチツプ薄膜モジユ−ル

Country Status (4)

Country Link
US (1) US4446477A (enExample)
EP (1) EP0073149B1 (enExample)
JP (1) JPS5853161U (enExample)
DE (1) DE3277758D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60108460U (ja) * 1983-12-27 1985-07-23 本田技研工業株式会社 加圧鋳造機における注湯部構造
JPH02127955A (ja) * 1988-07-06 1990-05-16 Tanabe Kogyo Kk 溶融金属の給湯方法と給湯装置

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137807B (en) * 1983-04-05 1987-08-12 Plessey Co Plc A semiconductor component and method of manufacture
EP0162521A3 (en) * 1984-05-23 1986-10-08 American Microsystems, Incorporated Package for semiconductor devices
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
US4874721A (en) * 1985-11-11 1989-10-17 Nec Corporation Method of manufacturing a multichip package with increased adhesive strength
US4700276A (en) * 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
JPS62216259A (ja) * 1986-03-17 1987-09-22 Fujitsu Ltd 混成集積回路の製造方法および構造
WO1988005959A1 (en) * 1987-02-04 1988-08-11 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
US4743568A (en) * 1987-07-24 1988-05-10 Motorola Inc. Multilevel interconnect transfer process
GB2209867B (en) * 1987-09-16 1990-12-19 Advanced Semiconductor Package Method of forming an integrated circuit chip carrier
US4916259A (en) * 1988-08-01 1990-04-10 International Business Machines Corporation Composite dielectric structure for optimizing electrical performance in high performance chip support packages
US5005070A (en) * 1988-12-19 1991-04-02 Hewlett-Packard Company Soldering interconnect method and apparatus for semiconductor packages
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5208188A (en) * 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
US5237205A (en) * 1989-10-02 1993-08-17 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5559369A (en) * 1989-10-02 1996-09-24 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JP2633366B2 (ja) * 1989-11-24 1997-07-23 株式会社日立製作所 計算機モジュール用リードレスチップキャリア
US5061987A (en) * 1990-01-09 1991-10-29 Northrop Corporation Silicon substrate multichip assembly
US5157477A (en) * 1990-01-10 1992-10-20 International Business Machines Corporation Matched impedance vertical conductors in multilevel dielectric laminated wiring
US5948533A (en) * 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
WO1992008606A1 (en) * 1990-11-19 1992-05-29 The Carborundum Company Microelectronics package
US6111308A (en) * 1991-06-05 2000-08-29 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5262719A (en) * 1991-09-19 1993-11-16 International Business Machines Corporation Test structure for multi-layer, thin-film modules
US5625307A (en) * 1992-03-03 1997-04-29 Anadigics, Inc. Low cost monolithic gallium arsenide upconverter chip
US5440805A (en) * 1992-03-09 1995-08-15 Rogers Corporation Method of manufacturing a multilayer circuit
US5287619A (en) * 1992-03-09 1994-02-22 Rogers Corporation Method of manufacture multichip module substrate
JP2721093B2 (ja) * 1992-07-21 1998-03-04 三菱電機株式会社 半導体装置
JPH08250827A (ja) * 1995-03-08 1996-09-27 Shinko Electric Ind Co Ltd 半導体装置用パッケージ及びその製造方法並びに半導体装置
US6861290B1 (en) 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
US5719440A (en) 1995-12-19 1998-02-17 Micron Technology, Inc. Flip chip adaptor package for bare die
US5952716A (en) 1997-04-16 1999-09-14 International Business Machines Corporation Pin attach structure for an electronic package
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
FR2793990B1 (fr) 1999-05-19 2001-07-27 Sagem Boitier electronique sur plaque et procede de fabrication d'un tel boitier
JP4780844B2 (ja) * 2001-03-05 2011-09-28 Ｏｋｉセミコンダクタ株式会社 半導体装置
CN103534802A (zh) * 2011-06-01 2014-01-22 E.I.内穆尔杜邦公司 用于高频应用的低温共烧陶瓷结构及其制造方法
US20130015504A1 (en) * 2011-07-11 2013-01-17 Chien-Li Kuo Tsv structure and method for forming the same
US10643936B2 (en) * 2017-05-31 2020-05-05 Dyi-chung Hu Package substrate and package structure
KR102613513B1 (ko) 2019-05-17 2023-12-13 삼성전자주식회사 반도체 모듈

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496460A (enExample) * 1972-05-10 1974-01-21
JPS5178176A (enExample) * 1974-12-20 1976-07-07 Ibm

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5242371A (en) * 1975-10-01 1977-04-01 Hitachi Ltd Multi-chip packaged semiconductor device
US4210885A (en) * 1978-06-30 1980-07-01 International Business Machines Corporation Thin film lossy line for preventing reflections in microcircuit chip package interconnections
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496460A (enExample) * 1972-05-10 1974-01-21
JPS5178176A (enExample) * 1974-12-20 1976-07-07 Ibm

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60108460U (ja) * 1983-12-27 1985-07-23 本田技研工業株式会社 加圧鋳造機における注湯部構造
JPH02127955A (ja) * 1988-07-06 1990-05-16 Tanabe Kogyo Kk 溶融金属の給湯方法と給湯装置

Also Published As

Publication number Publication date
EP0073149B1 (en) 1987-11-25
US4446477A (en) 1984-05-01
JPH0220848Y2 (enExample) 1990-06-06
DE3277758D1 (en) 1988-01-07
EP0073149A2 (en) 1983-03-02
EP0073149A3 (en) 1984-12-19

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