JPH0220848Y2 - - Google Patents

Info

Publication number
JPH0220848Y2
JPH0220848Y2 JP1982125066U JP12506682U JPH0220848Y2 JP H0220848 Y2 JPH0220848 Y2 JP H0220848Y2 JP 1982125066 U JP1982125066 U JP 1982125066U JP 12506682 U JP12506682 U JP 12506682U JP H0220848 Y2 JPH0220848 Y2 JP H0220848Y2
Authority
JP
Japan
Prior art keywords
lines
substrate
thin film
conductive
bias
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982125066U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5853161U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5853161U publication Critical patent/JPS5853161U/ja
Application granted granted Critical
Publication of JPH0220848Y2 publication Critical patent/JPH0220848Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/685—
    • H10W76/153—
    • H10W72/075—
    • H10W72/29—
    • H10W72/5363—
    • H10W72/952—
    • H10W90/724—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1982125066U 1981-08-21 1982-08-20 マルチチツプ薄膜モジユ−ル Granted JPS5853161U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/294,100 US4446477A (en) 1981-08-21 1981-08-21 Multichip thin film module
US294100 1981-08-21

Publications (2)

Publication Number Publication Date
JPS5853161U JPS5853161U (ja) 1983-04-11
JPH0220848Y2 true JPH0220848Y2 (enExample) 1990-06-06

Family

ID=23131876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982125066U Granted JPS5853161U (ja) 1981-08-21 1982-08-20 マルチチツプ薄膜モジユ−ル

Country Status (4)

Country Link
US (1) US4446477A (enExample)
EP (1) EP0073149B1 (enExample)
JP (1) JPS5853161U (enExample)
DE (1) DE3277758D1 (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137807B (en) * 1983-04-05 1987-08-12 Plessey Co Plc A semiconductor component and method of manufacture
JPS60108460U (ja) * 1983-12-27 1985-07-23 本田技研工業株式会社 加圧鋳造機における注湯部構造
EP0162521A3 (en) * 1984-05-23 1986-10-08 American Microsystems, Incorporated Package for semiconductor devices
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
US4874721A (en) * 1985-11-11 1989-10-17 Nec Corporation Method of manufacturing a multichip package with increased adhesive strength
US4700276A (en) * 1986-01-03 1987-10-13 Motorola Inc. Ultra high density pad array chip carrier
US4700473A (en) * 1986-01-03 1987-10-20 Motorola Inc. Method of making an ultra high density pad array chip carrier
JPS62216259A (ja) * 1986-03-17 1987-09-22 Fujitsu Ltd 混成集積回路の製造方法および構造
WO1988005959A1 (en) * 1987-02-04 1988-08-11 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
US4743568A (en) * 1987-07-24 1988-05-10 Motorola Inc. Multilevel interconnect transfer process
GB2209867B (en) * 1987-09-16 1990-12-19 Advanced Semiconductor Package Method of forming an integrated circuit chip carrier
JPH0751270B2 (ja) * 1988-07-06 1995-06-05 田辺工業株式会社 溶融金属の給湯方法と給湯装置
US4916259A (en) * 1988-08-01 1990-04-10 International Business Machines Corporation Composite dielectric structure for optimizing electrical performance in high performance chip support packages
US5005070A (en) * 1988-12-19 1991-04-02 Hewlett-Packard Company Soldering interconnect method and apparatus for semiconductor packages
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5208188A (en) * 1989-10-02 1993-05-04 Advanced Micro Devices, Inc. Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
US5237205A (en) * 1989-10-02 1993-08-17 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5559369A (en) * 1989-10-02 1996-09-24 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JP2633366B2 (ja) * 1989-11-24 1997-07-23 株式会社日立製作所 計算機モジュール用リードレスチップキャリア
US5061987A (en) * 1990-01-09 1991-10-29 Northrop Corporation Silicon substrate multichip assembly
US5157477A (en) * 1990-01-10 1992-10-20 International Business Machines Corporation Matched impedance vertical conductors in multilevel dielectric laminated wiring
US5948533A (en) * 1990-02-09 1999-09-07 Ormet Corporation Vertically interconnected electronic assemblies and compositions useful therefor
WO1992008606A1 (en) * 1990-11-19 1992-05-29 The Carborundum Company Microelectronics package
US6111308A (en) * 1991-06-05 2000-08-29 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5262719A (en) * 1991-09-19 1993-11-16 International Business Machines Corporation Test structure for multi-layer, thin-film modules
US5625307A (en) * 1992-03-03 1997-04-29 Anadigics, Inc. Low cost monolithic gallium arsenide upconverter chip
US5440805A (en) * 1992-03-09 1995-08-15 Rogers Corporation Method of manufacturing a multilayer circuit
US5287619A (en) * 1992-03-09 1994-02-22 Rogers Corporation Method of manufacture multichip module substrate
JP2721093B2 (ja) * 1992-07-21 1998-03-04 三菱電機株式会社 半導体装置
JPH08250827A (ja) * 1995-03-08 1996-09-27 Shinko Electric Ind Co Ltd 半導体装置用パッケージ及びその製造方法並びに半導体装置
US6861290B1 (en) 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
US5719440A (en) 1995-12-19 1998-02-17 Micron Technology, Inc. Flip chip adaptor package for bare die
US5952716A (en) 1997-04-16 1999-09-14 International Business Machines Corporation Pin attach structure for an electronic package
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
FR2793990B1 (fr) 1999-05-19 2001-07-27 Sagem Boitier electronique sur plaque et procede de fabrication d'un tel boitier
JP4780844B2 (ja) * 2001-03-05 2011-09-28 Ｏｋｉセミコンダクタ株式会社 半導体装置
CN103534802A (zh) * 2011-06-01 2014-01-22 E.I.内穆尔杜邦公司 用于高频应用的低温共烧陶瓷结构及其制造方法
US20130015504A1 (en) * 2011-07-11 2013-01-17 Chien-Li Kuo Tsv structure and method for forming the same
US10643936B2 (en) * 2017-05-31 2020-05-05 Dyi-chung Hu Package substrate and package structure
KR102613513B1 (ko) 2019-05-17 2023-12-13 삼성전자주식회사 반도체 모듈

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233787B2 (enExample) * 1972-05-10 1977-08-30
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
JPS5242371A (en) * 1975-10-01 1977-04-01 Hitachi Ltd Multi-chip packaged semiconductor device
US4210885A (en) * 1978-06-30 1980-07-01 International Business Machines Corporation Thin film lossy line for preventing reflections in microcircuit chip package interconnections
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
US4245273A (en) * 1979-06-29 1981-01-13 International Business Machines Corporation Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly

Also Published As

Publication number Publication date
EP0073149B1 (en) 1987-11-25
US4446477A (en) 1984-05-01
DE3277758D1 (en) 1988-01-07
EP0073149A2 (en) 1983-03-02
JPS5853161U (ja) 1983-04-11
EP0073149A3 (en) 1984-12-19

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