JPS58500463A - めっきのしてないパッケ−ジを含む半導体デバイス - Google Patents

めっきのしてないパッケ−ジを含む半導体デバイス

Info

Publication number
JPS58500463A
JPS58500463A JP57500908A JP50090882A JPS58500463A JP S58500463 A JPS58500463 A JP S58500463A JP 57500908 A JP57500908 A JP 57500908A JP 50090882 A JP50090882 A JP 50090882A JP S58500463 A JPS58500463 A JP S58500463A
Authority
JP
Japan
Prior art keywords
die
copper
metal
package
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57500908A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412028B2 (cg-RX-API-DMAC10.html
Inventor
オルセン・デニス・ア−ル
スパンジヤ−・ケイス・ジ−
Original Assignee
モトロ−ラ・インコ−ポレ−テッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by モトロ−ラ・インコ−ポレ−テッド filed Critical モトロ−ラ・インコ−ポレ−テッド
Publication of JPS58500463A publication Critical patent/JPS58500463A/ja
Publication of JPH0412028B2 publication Critical patent/JPH0412028B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/111—
    • H10W70/24—
    • H10W70/481—
    • H10W76/132—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07541—
    • H10W72/352—
    • H10W72/534—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/753—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP57500908A 1981-03-23 1982-02-05 めっきのしてないパッケ−ジを含む半導体デバイス Granted JPS58500463A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24678481A 1981-03-23 1981-03-23
US246784BRCH 1981-03-23

Publications (2)

Publication Number Publication Date
JPS58500463A true JPS58500463A (ja) 1983-03-24
JPH0412028B2 JPH0412028B2 (cg-RX-API-DMAC10.html) 1992-03-03

Family

ID=22932185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57500908A Granted JPS58500463A (ja) 1981-03-23 1982-02-05 めっきのしてないパッケ−ジを含む半導体デバイス

Country Status (5)

Country Link
EP (1) EP0074378A4 (cg-RX-API-DMAC10.html)
JP (1) JPS58500463A (cg-RX-API-DMAC10.html)
KR (1) KR900001223B1 (cg-RX-API-DMAC10.html)
IT (1) IT1147903B (cg-RX-API-DMAC10.html)
WO (1) WO1982003294A1 (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088446A (ja) * 1995-05-25 1996-01-12 Rohm Co Ltd 個別ダイオード装置
JP2024516742A (ja) * 2021-05-07 2024-04-16 マテリオン コーポレイション マイクロエレクトロニクスパッケージアセンブリおよび作製方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
GB2174063B (en) * 1985-04-22 1988-08-17 Philips Electronic Associated Semiconductor device having a laser printable envelope
JPS63253653A (ja) * 1987-04-10 1988-10-20 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
US6821821B2 (en) * 1996-04-18 2004-11-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
US7696611B2 (en) 2004-01-13 2010-04-13 Halliburton Energy Services, Inc. Conductive material compositions, apparatus, systems, and methods

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936517A (cg-RX-API-DMAC10.html) * 1972-08-08 1974-04-04
JPS5516425A (en) * 1978-07-21 1980-02-05 Toshiba Corp Semiconductor device
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3434018A (en) * 1966-07-05 1969-03-18 Motorola Inc Heat conductive mounting base for a semiconductor device
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
US3821615A (en) * 1973-05-16 1974-06-28 Solitron Devices Long life lead frame means for semiconductor devices
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
IN148328B (cg-RX-API-DMAC10.html) * 1977-04-18 1981-01-17 Rca Corp
IT7821073V0 (it) * 1978-03-09 1978-03-09 Ates Componenti Elettron Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936517A (cg-RX-API-DMAC10.html) * 1972-08-08 1974-04-04
JPS5516425A (en) * 1978-07-21 1980-02-05 Toshiba Corp Semiconductor device
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088446A (ja) * 1995-05-25 1996-01-12 Rohm Co Ltd 個別ダイオード装置
JP2024516742A (ja) * 2021-05-07 2024-04-16 マテリオン コーポレイション マイクロエレクトロニクスパッケージアセンブリおよび作製方法

Also Published As

Publication number Publication date
IT8248005A0 (it) 1982-03-16
KR900001223B1 (ko) 1990-03-05
EP0074378A1 (en) 1983-03-23
IT1147903B (it) 1986-11-26
KR830009650A (ko) 1983-12-22
EP0074378A4 (en) 1985-04-25
JPH0412028B2 (cg-RX-API-DMAC10.html) 1992-03-03
WO1982003294A1 (en) 1982-09-30

Similar Documents

Publication Publication Date Title
US4631805A (en) Semiconductor device including plateless package fabrication method
US4546374A (en) Semiconductor device including plateless package
US6608374B1 (en) Semiconductor chip assembly with bumped conductive trace
JP3032964B2 (ja) ボールグリッドアレイ半導体のパッケージ及び製造方法
JPH08510358A (ja) 集積回路チップと基板との相互接続
US6759597B1 (en) Wire bonding to dual metal covered pad surfaces
JP2001110957A (ja) パワー半導体モジュールの製造方法
JPH11135679A (ja) 電子装置および半導体パッケージ
JPS58500463A (ja) めっきのしてないパッケ−ジを含む半導体デバイス
JPH06506319A (ja) リードレス・パッド・アレイ・チップ・キャリア
US6537851B1 (en) Method of connecting a bumped compliant conductive trace to a semiconductor chip
CN107305879B (zh) 半导体器件及相应的方法
KR101008534B1 (ko) 전력용 반도체모듈패키지 및 그 제조방법
JPH08148608A (ja) 半導体装置及びその製造方法及び半導体装置用基板
JPH0964080A (ja) 半導体装置及びその製造方法
JP3314574B2 (ja) 半導体装置の製造方法
JPH0917910A (ja) 半導体装置及びその製造方法、検査方法、実装基板
JP2891426B2 (ja) 半導体装置
JP2716355B2 (ja) 半導体装置の製造方法
JPS61242051A (ja) 半導体装置
JP2785917B2 (ja) 半導体チップモジュール
JP2986661B2 (ja) 半導体装置の製造方法
JPH11345928A (ja) 半導体装置とその製造方法
JP2972679B2 (ja) リードフレーム並びに樹脂封止型半導体装置及びその製造方法
KR19980083259A (ko) 칩 싸이즈 반도체 패키지의 구조 및 그 제조 방법