KR830009650A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR830009650A
KR830009650A KR1019820001045A KR820001045A KR830009650A KR 830009650 A KR830009650 A KR 830009650A KR 1019820001045 A KR1019820001045 A KR 1019820001045A KR 820001045 A KR820001045 A KR 820001045A KR 830009650 A KR830009650 A KR 830009650A
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KR
South Korea
Prior art keywords
die
metallization
lead
copper alloy
copper
Prior art date
Application number
KR1019820001045A
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English (en)
Other versions
KR900001223B1 (ko
Inventor
알. 올슨 데니스
스파니어 카이츠지.
Original Assignee
빈센트제이. 라우너
모터로라 인코오포레이티드
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Application filed by 빈센트제이. 라우너, 모터로라 인코오포레이티드 filed Critical 빈센트제이. 라우너
Publication of KR830009650A publication Critical patent/KR830009650A/ko
Application granted granted Critical
Publication of KR900001223B1 publication Critical patent/KR900001223B1/ko

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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의해서 플라스틱으로 캡슐화한 반도체를 부분적으로 잘라서본 투시도.
제2도는 반도체장치 조립품의 횡단면도.

Claims (1)

  1. 도금하지 않은 동 합금 다이설치 패케이지 부분과 제1,2표면을 지닌 반도체 다이와, 전기환 제1표면위에 형성되어 거기에 전기적 접촉을 만드는 제1금속화 부위와, 전기한 제1금속화 부위화 전기한 등 합금 다이설치 패케이지 부분과 양립하고 전기한 다이를 다이 설치 패케이지 부분에 연결하는데 적합한 금속화 납과, 전기한 제2표면에 패턴화되어 있어서 그 선택된 부분에 대한 전기적 접촉을 형성하는 제2금속화부위와 전기한 다이 설치 패케이지 부분에 관해 기계적으로 고정된 동합금 리드연결 패케이지 부분과, 전기한 제2패턴화된 금속화 부분과 전기한 리드 연결패케이지 부분 사이에 본딩되어 전기적으로 상호 연결시키는 동 연결장치와, 전기한 반도체 다이 그리고 동 연결장치와 전기한 다이 설치와 리드 연결패케이지의 각 부분을 봉하는 장치로 구성된 반도체장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR8201045A 1981-03-23 1982-03-11 반도체 장치 KR900001223B1 (ko)

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US24678481A 1981-03-23 1981-03-23
US246784 1981-03-23

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KR900001223B1 KR900001223B1 (ko) 1990-03-05

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JP (1) JPS58500463A (ko)
KR (1) KR900001223B1 (ko)
IT (1) IT1147903B (ko)
WO (1) WO1982003294A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
GB2174063B (en) * 1985-04-22 1988-08-17 Philips Electronic Associated Semiconductor device having a laser printable envelope
JPS63253653A (ja) * 1987-04-10 1988-10-20 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
JPH088446A (ja) * 1995-05-25 1996-01-12 Rohm Co Ltd 個別ダイオード装置
US6821821B2 (en) * 1996-04-18 2004-11-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
US7696611B2 (en) 2004-01-13 2010-04-13 Halliburton Energy Services, Inc. Conductive material compositions, apparatus, systems, and methods

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3434018A (en) * 1966-07-05 1969-03-18 Motorola Inc Heat conductive mounting base for a semiconductor device
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
JPS5120323B2 (ko) * 1972-08-08 1976-06-24
US3821615A (en) * 1973-05-16 1974-06-28 Solitron Devices Long life lead frame means for semiconductor devices
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
IN148328B (ko) * 1977-04-18 1981-01-17 Rca Corp
IT7821073V0 (it) * 1978-03-09 1978-03-09 Ates Componenti Elettron Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.
JPS5516425A (en) * 1978-07-21 1980-02-05 Toshiba Corp Semiconductor device
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device

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JPH0412028B2 (ko) 1992-03-03
EP0074378A1 (en) 1983-03-23
JPS58500463A (ja) 1983-03-24
IT8248005A0 (it) 1982-03-16
WO1982003294A1 (en) 1982-09-30
KR900001223B1 (ko) 1990-03-05
EP0074378A4 (en) 1985-04-25
IT1147903B (it) 1986-11-26

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