IT1147903B - Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura - Google Patents

Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura

Info

Publication number
IT1147903B
IT1147903B IT48005/82A IT4800582A IT1147903B IT 1147903 B IT1147903 B IT 1147903B IT 48005/82 A IT48005/82 A IT 48005/82A IT 4800582 A IT4800582 A IT 4800582A IT 1147903 B IT1147903 B IT 1147903B
Authority
IT
Italy
Prior art keywords
die
package
electrical contact
copper alloy
metallization
Prior art date
Application number
IT48005/82A
Other languages
English (en)
Italian (it)
Other versions
IT8248005A0 (it
Inventor
Dennis R Olsen
Keith G Spanjer
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IT8248005A0 publication Critical patent/IT8248005A0/it
Application granted granted Critical
Publication of IT1147903B publication Critical patent/IT1147903B/it

Links

Classifications

    • H10W74/111—
    • H10W70/24—
    • H10W70/481—
    • H10W76/132—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07541—
    • H10W72/352—
    • H10W72/534—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/753—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
IT48005/82A 1981-03-23 1982-03-16 Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura IT1147903B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24678481A 1981-03-23 1981-03-23

Publications (2)

Publication Number Publication Date
IT8248005A0 IT8248005A0 (it) 1982-03-16
IT1147903B true IT1147903B (it) 1986-11-26

Family

ID=22932185

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48005/82A IT1147903B (it) 1981-03-23 1982-03-16 Perfezionamento nei dispositivi a semiconduttore con involucri o incapsulamenti senza placcatura

Country Status (5)

Country Link
EP (1) EP0074378A4 (cg-RX-API-DMAC10.html)
JP (1) JPS58500463A (cg-RX-API-DMAC10.html)
KR (1) KR900001223B1 (cg-RX-API-DMAC10.html)
IT (1) IT1147903B (cg-RX-API-DMAC10.html)
WO (1) WO1982003294A1 (cg-RX-API-DMAC10.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
GB2174063B (en) * 1985-04-22 1988-08-17 Philips Electronic Associated Semiconductor device having a laser printable envelope
JPS63253653A (ja) * 1987-04-10 1988-10-20 Citizen Watch Co Ltd 樹脂封止型ピングリツドアレイ及びその製造方法
IT1252624B (it) * 1991-12-05 1995-06-19 Cons Ric Microelettronica Dispositivo semiconduttore incapsulato in resina e elettricamente isolato di migliorate caratteristiche di isolamento,e relativo processo di fabbricazione
JPH088446A (ja) * 1995-05-25 1996-01-12 Rohm Co Ltd 個別ダイオード装置
US6821821B2 (en) * 1996-04-18 2004-11-23 Tessera, Inc. Methods for manufacturing resistors using a sacrificial layer
US6020636A (en) * 1997-10-24 2000-02-01 Eni Technologies, Inc. Kilowatt power transistor
US7696611B2 (en) 2004-01-13 2010-04-13 Halliburton Energy Services, Inc. Conductive material compositions, apparatus, systems, and methods
JP2024516742A (ja) * 2021-05-07 2024-04-16 マテリオン コーポレイション マイクロエレクトロニクスパッケージアセンブリおよび作製方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US3434018A (en) * 1966-07-05 1969-03-18 Motorola Inc Heat conductive mounting base for a semiconductor device
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3763403A (en) * 1972-03-01 1973-10-02 Gen Electric Isolated heat-sink semiconductor device
JPS5120323B2 (cg-RX-API-DMAC10.html) * 1972-08-08 1976-06-24
US3821615A (en) * 1973-05-16 1974-06-28 Solitron Devices Long life lead frame means for semiconductor devices
US3922712A (en) * 1974-05-01 1975-11-25 Gen Motors Corp Plastic power semiconductor flip chip package
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
IN148328B (cg-RX-API-DMAC10.html) * 1977-04-18 1981-01-17 Rca Corp
IT7821073V0 (it) * 1978-03-09 1978-03-09 Ates Componenti Elettron Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.
JPS5516425A (en) * 1978-07-21 1980-02-05 Toshiba Corp Semiconductor device
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
IT8248005A0 (it) 1982-03-16
KR900001223B1 (ko) 1990-03-05
EP0074378A1 (en) 1983-03-23
JPS58500463A (ja) 1983-03-24
KR830009650A (ko) 1983-12-22
EP0074378A4 (en) 1985-04-25
JPH0412028B2 (cg-RX-API-DMAC10.html) 1992-03-03
WO1982003294A1 (en) 1982-09-30

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19990331