JPS5848940A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5848940A
JPS5848940A JP56148092A JP14809281A JPS5848940A JP S5848940 A JPS5848940 A JP S5848940A JP 56148092 A JP56148092 A JP 56148092A JP 14809281 A JP14809281 A JP 14809281A JP S5848940 A JPS5848940 A JP S5848940A
Authority
JP
Japan
Prior art keywords
film
polyacethylene
polyimide film
wiring
polyacetylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56148092A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0117254B2 (enExample
Inventor
Nobuo Sasaki
伸夫 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56148092A priority Critical patent/JPS5848940A/ja
Priority to DE8282304904T priority patent/DE3277759D1/de
Priority to EP82304904A priority patent/EP0075454B1/en
Publication of JPS5848940A publication Critical patent/JPS5848940A/ja
Priority to US07/008,139 priority patent/US4761677A/en
Publication of JPH0117254B2 publication Critical patent/JPH0117254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W20/01—

Landscapes

  • Formation Of Insulating Films (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP56148092A 1981-09-18 1981-09-18 半導体装置の製造方法 Granted JPS5848940A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56148092A JPS5848940A (ja) 1981-09-18 1981-09-18 半導体装置の製造方法
DE8282304904T DE3277759D1 (en) 1981-09-18 1982-09-17 Semiconductor device having new conductive interconnection structure and method for manufacturing the same
EP82304904A EP0075454B1 (en) 1981-09-18 1982-09-17 Semiconductor device having new conductive interconnection structure and method for manufacturing the same
US07/008,139 US4761677A (en) 1981-09-18 1987-01-22 Semiconductor device having new conductive interconnection structure and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56148092A JPS5848940A (ja) 1981-09-18 1981-09-18 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5848940A true JPS5848940A (ja) 1983-03-23
JPH0117254B2 JPH0117254B2 (enExample) 1989-03-29

Family

ID=15445054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56148092A Granted JPS5848940A (ja) 1981-09-18 1981-09-18 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5848940A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0630820U (ja) * 1992-09-16 1994-04-22 日信工業株式会社 回動レバーの取付け構造
WO1998021755A3 (en) * 1996-11-12 1998-10-08 Ibm Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
US6331356B1 (en) 1989-05-26 2001-12-18 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
US6746770B1 (en) * 1989-05-26 2004-06-08 Internatonal Business Machines Corporation Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5351985A (en) * 1976-10-22 1978-05-11 Hitachi Ltd Semiconductor wiring constitution

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5351985A (en) * 1976-10-22 1978-05-11 Hitachi Ltd Semiconductor wiring constitution

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6331356B1 (en) 1989-05-26 2001-12-18 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
US6746770B1 (en) * 1989-05-26 2004-06-08 Internatonal Business Machines Corporation Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof
US7095474B2 (en) 1989-05-26 2006-08-22 International Business Machines Corporation Patterns of electrically conducting polymers and their application as electrodes or electrical contacts
JPH0630820U (ja) * 1992-09-16 1994-04-22 日信工業株式会社 回動レバーの取付け構造
WO1998021755A3 (en) * 1996-11-12 1998-10-08 Ibm Patterns of electrically conducting polymers and their application as electrodes or electrical contacts

Also Published As

Publication number Publication date
JPH0117254B2 (enExample) 1989-03-29

Similar Documents

Publication Publication Date Title
JPH01235254A (ja) 半導体装置及びその製造方法
TW385523B (en) Method for making contact via with a formed component on semiconductor substrate
JPS5848940A (ja) 半導体装置の製造方法
JPS6211781B2 (enExample)
JPH0528501B2 (enExample)
JPS6266679A (ja) 半導体装置の製造方法
JPS603779B2 (ja) 半導体装置の製造方法
JPH0379864B2 (enExample)
JPH0277127A (ja) 半導体装置
JPH0419707B2 (enExample)
JPS61228661A (ja) 半導体装置及びその製造方法
JPH0258353A (ja) 半導体装置
JP2945023B2 (ja) 薄膜トランジスタの製造方法
JPH022310B2 (enExample)
JPS62213141A (ja) 半導体装置の製造方法
JPS6027187B2 (ja) 半導体装置の製造方法
JPS60246652A (ja) 平坦化導電体配線の形成方法
JPS6196756A (ja) 半導体装置及びその製造方法
JPH05275424A (ja) 半導体装置の製造方法
JPH04349629A (ja) 半導体装置及びその製造方法
JPS59121855A (ja) 半導体装置
JPH0219973B2 (enExample)
JPH0370170A (ja) 半導体素子の形成方法
JPH04326553A (ja) 半導体装置の製造方法
JPS61152043A (ja) 半導体装置の製造方法