JPS5834824A - エポキシ樹脂組成物及びその製造方法 - Google Patents
エポキシ樹脂組成物及びその製造方法Info
- Publication number
- JPS5834824A JPS5834824A JP13270481A JP13270481A JPS5834824A JP S5834824 A JPS5834824 A JP S5834824A JP 13270481 A JP13270481 A JP 13270481A JP 13270481 A JP13270481 A JP 13270481A JP S5834824 A JPS5834824 A JP S5834824A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- agent
- silane coupling
- coupling agent
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 17
- 125000005372 silanol group Chemical group 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000000945 filler Substances 0.000 claims abstract description 12
- 229920002545 silicone oil Polymers 0.000 claims abstract description 11
- 239000002994 raw material Substances 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- 239000004945 silicone rubber Substances 0.000 claims description 7
- 238000005273 aeration Methods 0.000 claims description 5
- 239000006082 mold release agent Substances 0.000 claims description 3
- 239000012756 surface treatment agent Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 238000007789 sealing Methods 0.000 abstract description 5
- -1 silane compound Chemical class 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract 1
- 239000005871 repellent Substances 0.000 abstract 1
- 229910000077 silane Inorganic materials 0.000 abstract 1
- 230000035882 stress Effects 0.000 description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- XYOVOXDWRFGKEX-UHFFFAOYSA-N azepine Chemical compound N1C=CC=CC=C1 XYOVOXDWRFGKEX-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- KMIOJWCYOHBUJS-HAKPAVFJSA-N vorolanib Chemical compound C1N(C(=O)N(C)C)CC[C@@H]1NC(=O)C1=C(C)NC(\C=C/2C3=CC(F)=CC=C3NC\2=O)=C1C KMIOJWCYOHBUJS-HAKPAVFJSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13270481A JPS5834824A (ja) | 1981-08-26 | 1981-08-26 | エポキシ樹脂組成物及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13270481A JPS5834824A (ja) | 1981-08-26 | 1981-08-26 | エポキシ樹脂組成物及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20525387A Division JPS6399221A (ja) | 1987-08-20 | 1987-08-20 | 半導体封止用エポキシ樹脂組成物の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5834824A true JPS5834824A (ja) | 1983-03-01 |
| JPH0138131B2 JPH0138131B2 (enrdf_load_html_response) | 1989-08-11 |
Family
ID=15087602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13270481A Granted JPS5834824A (ja) | 1981-08-26 | 1981-08-26 | エポキシ樹脂組成物及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834824A (enrdf_load_html_response) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6063951A (ja) * | 1983-09-16 | 1985-04-12 | Hitachi Ltd | 半導体装置 |
| JPS6112051A (ja) * | 1984-06-27 | 1986-01-20 | Toshiba Corp | 半導体封止用エポキシ樹脂成形材料 |
| JPS61127723A (ja) * | 1984-11-27 | 1986-06-16 | Sumitomo Bakelite Co Ltd | 発光または受光素子成形体 |
| JPS61183314A (ja) * | 1985-02-12 | 1986-08-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPS61190550A (ja) * | 1985-02-19 | 1986-08-25 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS61268720A (ja) * | 1984-12-26 | 1986-11-28 | Kanegafuchi Chem Ind Co Ltd | 硬化性樹脂組成物 |
| JPS6356518A (ja) * | 1986-08-27 | 1988-03-11 | Rishiyou Kogyo Kk | エポキシ樹脂組成物 |
| JPS63241061A (ja) * | 1986-11-13 | 1988-10-06 | Sunstar Giken Kk | エポキシ樹脂組成物 |
| JPS6490253A (en) * | 1987-09-30 | 1989-04-06 | Matsushita Electric Ind Co Ltd | Epoxy resin composition and its production |
| JPH01185316A (ja) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPH02173155A (ja) * | 1988-12-27 | 1990-07-04 | Toray Ind Inc | 半導体封止用エポキシ含有組成物 |
| JPH02189357A (ja) * | 1989-01-19 | 1990-07-25 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPH0341146A (ja) * | 1989-12-15 | 1991-02-21 | Hitachi Ltd | 半導体装置の製法 |
| US5043211A (en) * | 1987-03-31 | 1991-08-27 | Kabushiki Kaisha Toshiba | Epoxy resin composition and a resin-sealed semiconductor device |
| JPH03245558A (ja) * | 1990-09-17 | 1991-11-01 | Hitachi Ltd | 半導体装置 |
| US5068267A (en) * | 1988-09-13 | 1991-11-26 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant consisting of epoxy resin composition |
| US5258426A (en) * | 1989-02-23 | 1993-11-02 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant |
| JPH09167815A (ja) * | 1996-11-18 | 1997-06-24 | Hitachi Ltd | 半導体装置 |
| JP2010211968A (ja) * | 2009-03-06 | 2010-09-24 | Somar Corp | 電子部品用絶縁塗料およびこれを利用した電子部品 |
| JP2017179346A (ja) * | 2016-03-28 | 2017-10-05 | 味の素株式会社 | 樹脂組成物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5431500A (en) * | 1977-08-13 | 1979-03-08 | Allied Chem | Packing composition based on anhydride curable epoxy resin |
| JPS5454168A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
-
1981
- 1981-08-26 JP JP13270481A patent/JPS5834824A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5431500A (en) * | 1977-08-13 | 1979-03-08 | Allied Chem | Packing composition based on anhydride curable epoxy resin |
| JPS5454168A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6063951A (ja) * | 1983-09-16 | 1985-04-12 | Hitachi Ltd | 半導体装置 |
| JPS6112051A (ja) * | 1984-06-27 | 1986-01-20 | Toshiba Corp | 半導体封止用エポキシ樹脂成形材料 |
| JPS61127723A (ja) * | 1984-11-27 | 1986-06-16 | Sumitomo Bakelite Co Ltd | 発光または受光素子成形体 |
| JPS61268720A (ja) * | 1984-12-26 | 1986-11-28 | Kanegafuchi Chem Ind Co Ltd | 硬化性樹脂組成物 |
| JPS61183314A (ja) * | 1985-02-12 | 1986-08-16 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
| JPS61190550A (ja) * | 1985-02-19 | 1986-08-25 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPS6356518A (ja) * | 1986-08-27 | 1988-03-11 | Rishiyou Kogyo Kk | エポキシ樹脂組成物 |
| JPS63241061A (ja) * | 1986-11-13 | 1988-10-06 | Sunstar Giken Kk | エポキシ樹脂組成物 |
| US5043211A (en) * | 1987-03-31 | 1991-08-27 | Kabushiki Kaisha Toshiba | Epoxy resin composition and a resin-sealed semiconductor device |
| JPS6490253A (en) * | 1987-09-30 | 1989-04-06 | Matsushita Electric Ind Co Ltd | Epoxy resin composition and its production |
| JPH01185316A (ja) * | 1988-01-18 | 1989-07-24 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| US5068267A (en) * | 1988-09-13 | 1991-11-26 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant consisting of epoxy resin composition |
| JPH02173155A (ja) * | 1988-12-27 | 1990-07-04 | Toray Ind Inc | 半導体封止用エポキシ含有組成物 |
| JPH02189357A (ja) * | 1989-01-19 | 1990-07-25 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂成形材料 |
| US5258426A (en) * | 1989-02-23 | 1993-11-02 | Kabushiki Kaisha Toshiba | Semiconductor device encapsulant |
| JPH0341146A (ja) * | 1989-12-15 | 1991-02-21 | Hitachi Ltd | 半導体装置の製法 |
| JPH03245558A (ja) * | 1990-09-17 | 1991-11-01 | Hitachi Ltd | 半導体装置 |
| JPH09167815A (ja) * | 1996-11-18 | 1997-06-24 | Hitachi Ltd | 半導体装置 |
| JP2010211968A (ja) * | 2009-03-06 | 2010-09-24 | Somar Corp | 電子部品用絶縁塗料およびこれを利用した電子部品 |
| JP2017179346A (ja) * | 2016-03-28 | 2017-10-05 | 味の素株式会社 | 樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0138131B2 (enrdf_load_html_response) | 1989-08-11 |
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