JPS6325009B2 - - Google Patents

Info

Publication number
JPS6325009B2
JPS6325009B2 JP25051184A JP25051184A JPS6325009B2 JP S6325009 B2 JPS6325009 B2 JP S6325009B2 JP 25051184 A JP25051184 A JP 25051184A JP 25051184 A JP25051184 A JP 25051184A JP S6325009 B2 JPS6325009 B2 JP S6325009B2
Authority
JP
Japan
Prior art keywords
epoxy resin
inorganic filler
resin composition
group
coupling agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP25051184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61130326A (ja
Inventor
Shuichi Kita
Takamitsu Fujimoto
Juzo Kanegae
Norimoto Moriwaki
Torahiko Ando
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25051184A priority Critical patent/JPS61130326A/ja
Publication of JPS61130326A publication Critical patent/JPS61130326A/ja
Publication of JPS6325009B2 publication Critical patent/JPS6325009B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP25051184A 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物 Granted JPS61130326A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25051184A JPS61130326A (ja) 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25051184A JPS61130326A (ja) 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61130326A JPS61130326A (ja) 1986-06-18
JPS6325009B2 true JPS6325009B2 (enrdf_load_html_response) 1988-05-24

Family

ID=17208974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25051184A Granted JPS61130326A (ja) 1984-11-29 1984-11-29 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61130326A (enrdf_load_html_response)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63202621A (ja) * 1987-02-18 1988-08-22 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JP2930115B2 (ja) * 1988-09-12 1999-08-03 日東電工株式会社 半導体装置
JPH078939B2 (ja) * 1988-10-19 1995-02-01 沖電気工業株式会社 樹脂封止半導体装置
US5571851A (en) * 1994-01-28 1996-11-05 J.M. Huber Corporation Reinforcing fillers for plastics systems
JP5256614B2 (ja) * 2006-01-19 2013-08-07 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP5311130B2 (ja) * 2009-06-22 2013-10-09 日立化成株式会社 素子封止用エポキシ樹脂成形材料及び電子部品装置
JP6409362B2 (ja) * 2014-06-25 2018-10-24 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JPS61130326A (ja) 1986-06-18

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