JPS58175852A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58175852A
JPS58175852A JP58052102A JP5210283A JPS58175852A JP S58175852 A JPS58175852 A JP S58175852A JP 58052102 A JP58052102 A JP 58052102A JP 5210283 A JP5210283 A JP 5210283A JP S58175852 A JPS58175852 A JP S58175852A
Authority
JP
Japan
Prior art keywords
layer
metal
coating
semiconductor element
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58052102A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6232622B2 (enExample
Inventor
Tomoaki Kojima
小島　知昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58052102A priority Critical patent/JPS58175852A/ja
Publication of JPS58175852A publication Critical patent/JPS58175852A/ja
Publication of JPS6232622B2 publication Critical patent/JPS6232622B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H10W72/07551—
    • H10W72/50—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58052102A 1983-03-28 1983-03-28 半導体装置 Granted JPS58175852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58052102A JPS58175852A (ja) 1983-03-28 1983-03-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58052102A JPS58175852A (ja) 1983-03-28 1983-03-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11464574A Division JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Publications (2)

Publication Number Publication Date
JPS58175852A true JPS58175852A (ja) 1983-10-15
JPS6232622B2 JPS6232622B2 (enExample) 1987-07-15

Family

ID=12905482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58052102A Granted JPS58175852A (ja) 1983-03-28 1983-03-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS58175852A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
JPH0210761A (ja) * 1988-06-28 1990-01-16 Mitsui High Tec Inc リードフレーム及びその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437126U (enExample) * 1987-08-28 1989-03-06
JPS6437127U (enExample) * 1987-08-28 1989-03-06
US6483044B1 (en) 2000-08-23 2002-11-19 Micron Technology, Inc. Interconnecting substrates for electrical coupling of microelectronic components
US6838760B1 (en) 2000-08-28 2005-01-04 Micron Technology, Inc. Packaged microelectronic devices with interconnecting units

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707724A (en) * 1984-06-04 1987-11-17 Hitachi, Ltd. Semiconductor device and method of manufacturing thereof
JPH0210761A (ja) * 1988-06-28 1990-01-16 Mitsui High Tec Inc リードフレーム及びその製造方法

Also Published As

Publication number Publication date
JPS6232622B2 (enExample) 1987-07-15

Similar Documents

Publication Publication Date Title
US5530284A (en) Semiconductor leadframe structure compatible with differing bond wire materials
US4707724A (en) Semiconductor device and method of manufacturing thereof
US3684464A (en) Composite metal laminate material and lead frame
JPH05508259A (ja) 改善された電磁障害抵抗を有する金属電子パッケージ
JPS6043851A (ja) 被覆金属リ−ドフレ−ム基板
JP3072735B2 (ja) ２重金属被覆パッド面へのワイヤ・ボンディング方法及びそのワイヤ・ボンディングを含む電気カード構造
JPS5948546B2 (ja) リ−ドフレ−ム用金属ストリップ及びその製造方法
JPS58175852A (ja) 半導体装置
JPH034030Y2 (enExample)
EP0538019A2 (en) Lead frame for a semiconductor device
JPS5936426B2 (ja) Ｉｃ用リ−ドフレ−ム
JPS60147148A (ja) 半導体装置用リ−ドフレ−ム
JPS61140160A (ja) 半導体用リ−ドフレ−ム
JP2000068396A (ja) ハーメチックシール用カバー
JP2006086380A (ja) 半導体装置用リードフレーム
JPH06216313A (ja) 樹脂封止半導体装置
JPS6312385B2 (enExample)
JPH0455336B2 (enExample)
JPS60206054A (ja) リ−ドフレ−ム
JPH0645485A (ja) 高放熱性集積回路パッケージ
JP2845002B2 (ja) 半導体装置用複合リードフレーム
JP4123719B2 (ja) テープキャリアおよびこれを用いた半導体装置
TWI250628B (en) Leadframe, semiconductor package and method for manufacturing the same
JPH0519820B2 (enExample)
JPS60208882A (ja) 磁電変換素子