JPH0143872Y2 - - Google Patents
Info
- Publication number
- JPH0143872Y2 JPH0143872Y2 JP13931183U JP13931183U JPH0143872Y2 JP H0143872 Y2 JPH0143872 Y2 JP H0143872Y2 JP 13931183 U JP13931183 U JP 13931183U JP 13931183 U JP13931183 U JP 13931183U JP H0143872 Y2 JPH0143872 Y2 JP H0143872Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor chip
- external lead
- semiconductor device
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983139311U JPS6048252U (ja) | 1983-09-08 | 1983-09-08 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983139311U JPS6048252U (ja) | 1983-09-08 | 1983-09-08 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6048252U JPS6048252U (ja) | 1985-04-04 |
| JPH0143872Y2 true JPH0143872Y2 (enExample) | 1989-12-19 |
Family
ID=30312289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983139311U Granted JPS6048252U (ja) | 1983-09-08 | 1983-09-08 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048252U (enExample) |
-
1983
- 1983-09-08 JP JP1983139311U patent/JPS6048252U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6048252U (ja) | 1985-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6153924A (en) | Multilayered lead frame for semiconductor package | |
| US5072280A (en) | Resin sealed semiconductor device | |
| JPS6050343B2 (ja) | 半導体装置製造用リ−ドフレ−ム | |
| JPH0582977B2 (enExample) | ||
| JPH0143872Y2 (enExample) | ||
| JPH03125440A (ja) | 電子部品 | |
| JPH02343A (ja) | 電子部品搭載用基板 | |
| JPS6336703Y2 (enExample) | ||
| JP2788011B2 (ja) | 半導体集積回路装置 | |
| JPH0442937Y2 (enExample) | ||
| JPS6334281Y2 (enExample) | ||
| JP2680619B2 (ja) | 混成集積回路 | |
| JPH0445253Y2 (enExample) | ||
| JP3230384B2 (ja) | 半導体装置 | |
| JPH043500Y2 (enExample) | ||
| JPH0442938Y2 (enExample) | ||
| JP2532400Y2 (ja) | ハイブリットic | |
| JPS6050342B2 (ja) | 半導体装置製造用リ−ドフレ−ム | |
| JPH056714Y2 (enExample) | ||
| JPH046212Y2 (enExample) | ||
| JPS639372B2 (enExample) | ||
| JP2883065B2 (ja) | 半導体装置 | |
| JPH0358462A (ja) | 樹脂封止型半導体装置 | |
| JPS6331141A (ja) | Icカ−ド用モジユ−ル | |
| JP2001015561A (ja) | 放熱板兼補強板付きtabテープ及び半導体装置 |