JPS6048252U - リ−ドフレ−ム - Google Patents
リ−ドフレ−ムInfo
- Publication number
- JPS6048252U JPS6048252U JP1983139311U JP13931183U JPS6048252U JP S6048252 U JPS6048252 U JP S6048252U JP 1983139311 U JP1983139311 U JP 1983139311U JP 13931183 U JP13931183 U JP 13931183U JP S6048252 U JPS6048252 U JP S6048252U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- metal layer
- forming
- external lead
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983139311U JPS6048252U (ja) | 1983-09-08 | 1983-09-08 | リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983139311U JPS6048252U (ja) | 1983-09-08 | 1983-09-08 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6048252U true JPS6048252U (ja) | 1985-04-04 |
| JPH0143872Y2 JPH0143872Y2 (enExample) | 1989-12-19 |
Family
ID=30312289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983139311U Granted JPS6048252U (ja) | 1983-09-08 | 1983-09-08 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048252U (enExample) |
-
1983
- 1983-09-08 JP JP1983139311U patent/JPS6048252U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0143872Y2 (enExample) | 1989-12-19 |
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