JPS6232622B2 - - Google Patents
Info
- Publication number
- JPS6232622B2 JPS6232622B2 JP58052102A JP5210283A JPS6232622B2 JP S6232622 B2 JPS6232622 B2 JP S6232622B2 JP 58052102 A JP58052102 A JP 58052102A JP 5210283 A JP5210283 A JP 5210283A JP S6232622 B2 JPS6232622 B2 JP S6232622B2
- Authority
- JP
- Japan
- Prior art keywords
- coating
- lead frame
- layer
- present
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/457—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W74/00—
-
- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58052102A JPS58175852A (ja) | 1983-03-28 | 1983-03-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58052102A JPS58175852A (ja) | 1983-03-28 | 1983-03-28 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11464574A Division JPS5141961A (en) | 1974-10-07 | 1974-10-07 | Handotai shusekikairosochoriidofureemu |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58175852A JPS58175852A (ja) | 1983-10-15 |
| JPS6232622B2 true JPS6232622B2 (enExample) | 1987-07-15 |
Family
ID=12905482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58052102A Granted JPS58175852A (ja) | 1983-03-28 | 1983-03-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175852A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6437126U (enExample) * | 1987-08-28 | 1989-03-06 | ||
| JPS6437127U (enExample) * | 1987-08-28 | 1989-03-06 | ||
| US6983551B2 (en) | 2000-08-23 | 2006-01-10 | Micron Technology, Inc. | Interconnecting substrates for electrical coupling of microelectronic components |
| US7332376B2 (en) | 2000-08-28 | 2008-02-19 | Micron Technology, Inc. | Method of encapsulating packaged microelectronic devices with a barrier |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0612796B2 (ja) * | 1984-06-04 | 1994-02-16 | 株式会社日立製作所 | 半導体装置 |
| JPH0210761A (ja) * | 1988-06-28 | 1990-01-16 | Mitsui High Tec Inc | リードフレーム及びその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141961A (en) * | 1974-10-07 | 1976-04-08 | Nippon Electric Co | Handotai shusekikairosochoriidofureemu |
-
1983
- 1983-03-28 JP JP58052102A patent/JPS58175852A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6437126U (enExample) * | 1987-08-28 | 1989-03-06 | ||
| JPS6437127U (enExample) * | 1987-08-28 | 1989-03-06 | ||
| US6983551B2 (en) | 2000-08-23 | 2006-01-10 | Micron Technology, Inc. | Interconnecting substrates for electrical coupling of microelectronic components |
| US7332376B2 (en) | 2000-08-28 | 2008-02-19 | Micron Technology, Inc. | Method of encapsulating packaged microelectronic devices with a barrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58175852A (ja) | 1983-10-15 |
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