JPS5141961A - Handotai shusekikairosochoriidofureemu - Google Patents

Handotai shusekikairosochoriidofureemu

Info

Publication number
JPS5141961A
JPS5141961A JP11464574A JP11464574A JPS5141961A JP S5141961 A JPS5141961 A JP S5141961A JP 11464574 A JP11464574 A JP 11464574A JP 11464574 A JP11464574 A JP 11464574A JP S5141961 A JPS5141961 A JP S5141961A
Authority
JP
Japan
Prior art keywords
shusekikairosochoriidofureemu
handotai
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11464574A
Other languages
Japanese (ja)
Other versions
JPS5731299B2 (en
Inventor
Tomoaki Kojima
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Priority to JP11464574A priority Critical patent/JPS5731299B2/ja
Publication of JPS5141961A publication Critical patent/JPS5141961A/en
Publication of JPS5731299B2 publication Critical patent/JPS5731299B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP11464574A 1974-10-07 1974-10-07 Expired JPS5731299B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11464574A JPS5731299B2 (en) 1974-10-07 1974-10-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11464574A JPS5731299B2 (en) 1974-10-07 1974-10-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58052102A Division JPS6232622B2 (en) 1983-03-28 1983-03-28

Publications (2)

Publication Number Publication Date
JPS5141961A true JPS5141961A (en) 1976-04-08
JPS5731299B2 JPS5731299B2 (en) 1982-07-03

Family

ID=14642974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11464574A Expired JPS5731299B2 (en) 1974-10-07 1974-10-07

Country Status (1)

Country Link
JP (1) JPS5731299B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817649A (en) * 1981-07-24 1983-02-01 Fujitsu Ltd Package for electronic part
JPS58175852A (en) * 1983-03-28 1983-10-15 Nec Corp Semiconductor device
JPS61258461A (en) * 1986-05-23 1986-11-15 Hitachi Ltd Electronic part
JPS63111655A (en) * 1986-10-30 1988-05-16 Toshiba Corp Surface treatment of frame for semiconductor elements
JPS63291445A (en) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk Dichroic selective plating on lead frame
JPH041504B2 (en) * 1986-05-23 1992-01-13 Hitachi Ltd

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817649A (en) * 1981-07-24 1983-02-01 Fujitsu Ltd Package for electronic part
JPS6259892B2 (en) * 1981-07-24 1987-12-14 Fujitsu Ltd
JPS58175852A (en) * 1983-03-28 1983-10-15 Nec Corp Semiconductor device
JPS6232622B2 (en) * 1983-03-28 1987-07-15 Nippon Electric Co
JPS61258461A (en) * 1986-05-23 1986-11-15 Hitachi Ltd Electronic part
JPH041504B2 (en) * 1986-05-23 1992-01-13 Hitachi Ltd
JPS63111655A (en) * 1986-10-30 1988-05-16 Toshiba Corp Surface treatment of frame for semiconductor elements
JPS63291445A (en) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk Dichroic selective plating on lead frame

Also Published As

Publication number Publication date
JPS5731299B2 (en) 1982-07-03

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