JPS5731299B2 - - Google Patents

Info

Publication number
JPS5731299B2
JPS5731299B2 JP11464574A JP11464574A JPS5731299B2 JP S5731299 B2 JPS5731299 B2 JP S5731299B2 JP 11464574 A JP11464574 A JP 11464574A JP 11464574 A JP11464574 A JP 11464574A JP S5731299 B2 JPS5731299 B2 JP S5731299B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11464574A
Other languages
Japanese (ja)
Other versions
JPS5141961A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11464574A priority Critical patent/JPS5141961A/en
Publication of JPS5141961A publication Critical patent/JPS5141961A/en
Publication of JPS5731299B2 publication Critical patent/JPS5731299B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP11464574A 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu Granted JPS5141961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11464574A JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11464574A JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58052102A Division JPS58175852A (en) 1983-03-28 1983-03-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5141961A JPS5141961A (en) 1976-04-08
JPS5731299B2 true JPS5731299B2 (en) 1982-07-03

Family

ID=14642974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11464574A Granted JPS5141961A (en) 1974-10-07 1974-10-07 Handotai shusekikairosochoriidofureemu

Country Status (1)

Country Link
JP (1) JPS5141961A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817649A (en) * 1981-07-24 1983-02-01 Fujitsu Ltd Package for electronic part
JPS58175852A (en) * 1983-03-28 1983-10-15 Nec Corp Semiconductor device
JPS61258462A (en) * 1986-05-23 1986-11-15 Hitachi Ltd Assembly of electronic component parts
JPS61258461A (en) * 1986-05-23 1986-11-15 Hitachi Ltd Electronic part
JPS63111655A (en) * 1986-10-30 1988-05-16 Toshiba Corp Surface treatment of frame for semiconductor elements
JPS63291445A (en) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk Dichroic selective plating on lead frame

Also Published As

Publication number Publication date
JPS5141961A (en) 1976-04-08

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