JPS61258461A - Electronic part - Google Patents
Electronic partInfo
- Publication number
- JPS61258461A JPS61258461A JP11725486A JP11725486A JPS61258461A JP S61258461 A JPS61258461 A JP S61258461A JP 11725486 A JP11725486 A JP 11725486A JP 11725486 A JP11725486 A JP 11725486A JP S61258461 A JPS61258461 A JP S61258461A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- leads
- lead
- tab
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 以千介も 構造）部間する。[Detailed description of the invention] Ichisuke too structure) between parts.
封止部の側面から複数のリード（外部端子）を突出する
構造の電子部品（たとえば半導体装Ｕ）をプリント基板
、セラミック基板等の配線板に取り付ける構造としては
、従来、第１図（ａ） 、 （１））で示す構造が知ら
れている。同図（ａ）の構造は封止部ｌから延びるリー
ド２を途中で同一方向に折り曲げてインライン形にし、
各リード２を配線板３に設けた取付孔４に挿し込み、配
線板３を貫通した先端部と配線板３とを半田５ｔ−介し
て固定する構造となっている□また、同図（ｂ）の構造
はインライン形のリード２の先端を１ｑび外方に折り曲
げてフラットタイプとし、この先端平坦部６を配線板３
に載せて図示しない半田を介して固定する構造である。A conventional structure for attaching an electronic component (for example, a semiconductor device U) having a plurality of leads (external terminals) protruding from the side surface of the sealing part to a wiring board such as a printed circuit board or a ceramic board is shown in FIG. 1(a). , (1)) is known. In the structure shown in FIG. 2(a), the leads 2 extending from the sealing part l are bent in the same direction midway to form an in-line shape.
Each lead 2 is inserted into a mounting hole 4 provided in a wiring board 3, and the tip portion passing through the wiring board 3 is fixed to the wiring board 3 via solder 5t. ) has a structure in which the tips of the inline leads 2 are bent outward by 1q to form a flat type, and this flat tip 6 is attached to the wiring board 3.
It has a structure in which it is placed on the board and fixed via solder (not shown).
なお、これらの図罠おいては配線板面の配線層は省略し
てあろう
しかし、前者の挿込構造は配線板に取付孔を穿たなけれ
ばならず、配線板コストが高くなる難点がある。また、
後者のフラットタイプは取付面積が広くなり、実装密度
が低くなる欠点がある。Note that the wiring layer on the surface of the wiring board is omitted in these diagrams, but the former insertion structure requires drilling holes in the wiring board, which has the disadvantage of increasing the cost of the wiring board. be. Also,
The latter flat type has the disadvantage that the installation area is large and the mounting density is low.
ｊ、たがって、本発明の目的は配線板コストの低廉化お
よび実装密度の向上を図ることが可能な電子部品を提供
することにある。以下実施例により本発明を説明する。Therefore, an object of the present invention is to provide an electronic component that can reduce wiring board cost and improve packaging density. The present invention will be explained below with reference to Examples.
第２図は本発明の一実施例による電子部品の実装構造を
示す。同図に示す電子部品７は直方体からなる封止部８
と、封止部８の側面から延び途中で下方に折れ曲がる複
数のリード９とからなっている。そして、この電子部品
７は下方に延びるリード９の先端を配線板（配線層は省
略しである。）１０の上面に当接し、その当接部を鑞材
である半田１１によって配線板ｌＯに固定している。FIG. 2 shows a mounting structure for electronic components according to an embodiment of the present invention. The electronic component 7 shown in the figure has a sealing part 8 made of a rectangular parallelepiped.
and a plurality of leads 9 extending from the side surface of the sealing part 8 and bending downward in the middle. Then, this electronic component 7 has the tip of the lead 9 extending downward in contact with the top surface of the wiring board (wiring layer is omitted) 10, and the contact portion is attached to the wiring board IO using solder 11, which is a solder material. Fixed.
このような実装構造によれば、配線板１０に取付孔を設
ける必要がないことから配線板の製造コストが安価とな
る。また、フラットタイプのようような実装構造では取
付面積が狭くてもよく、実装密度の向上を図ることがで
きる。特にモールド部から４方向にリードが延在する構
造では取付面積の縮小化に効果が顕著である〇
なお、前記実施例にあって、封止部８の外縁からリード
９の屈曲部までの距離ｔをできるだけ短かくすることに
よって実装面積をさらに狭くすることができる。また、
リードを封止部の界面で折り曲げるようにすればリード
の折り曲げが容易となる利点もある。また、リード９の
長さく高さＨ）を短かくすることによって、電子部品の
Ｉ・ノドリング時にリードが引っ掛りにくくなる０この
ため、リード曲がりの発生を少なくすることもできる。According to such a mounting structure, since there is no need to provide a mounting hole in the wiring board 10, the manufacturing cost of the wiring board becomes low. Further, in a mounting structure such as a flat type, the mounting area may be small, and the mounting density can be improved. In particular, in a structure in which the leads extend in four directions from the mold part, the effect of reducing the mounting area is remarkable. In the above embodiment, the distance from the outer edge of the sealing part 8 to the bent part of the lead 9 is By making t as short as possible, the mounting area can be further reduced. Also,
If the leads are bent at the interface of the sealing part, there is an advantage that the leads can be easily bent. Further, by shortening the length and height H) of the lead 9, the lead becomes less likely to be caught during I/nodding of the electronic component, thereby reducing the occurrence of lead bending.
また、この実装構造ではリード端面のソルダビリティ（
宇出の濡れ性）の良否が接続の良否に大きく杉響する。In addition, this mounting structure also has the solderability of the lead end face (
The quality of the connection (wettability) greatly affects the quality of the connection.
そこで、ソルダビリティを向上させるためにリード表面
に銀めっき等を砲こす場合もリードの先端面にも銀めっ
きを施こす必要がある。この場合、第３図で示すような
リードフレーム１２を用いて電子部品を組み立てるとよ
い。このり一ドフレーム１２はリードフレーム製造の段
階でり〜ド９の外端（モールド部から露出する先端）を
リードフレーム枠１３から分離してお・き、この状態で
リードフレーム全体を恨めつきする。Therefore, even when silver plating or the like is applied to the lead surface in order to improve soldability, it is necessary to also apply silver plating to the tip end surface of the lead. In this case, it is preferable to assemble the electronic component using a lead frame 12 as shown in FIG. This lead frame 12 is manufactured at the stage of lead frame manufacturing.The outer end of the lead frame 12 (the tip exposed from the molded part) is separated from the lead frame frame 13, and in this state, the entire lead frame is assembled. do.
そして、タブ１４上に回路素子１５を固定した後、回路
素子１５の電極とリード９の内端をワイヤ１６で繋ぎ、
その後ダム１７の内部をレジンでモールドし、不要なダ
ム１７．リードフレーム枠１３を切断除去する。また、
−タブリード１８はモールド部１９あるいはリードフレ
ーム枠１３の付は根から切１析する。この実施例では、
リード先端面にもソルダビリティの良好な銀めっきが施
こされるので、′Ｃ子部品の取り付けの信頼性も向上す
る。また、このようなリードフレームを用いることによ
って、リード切断成形機の金型のＣ４造も簡素となるこ
とから、金型製造コストも安価となる。After fixing the circuit element 15 on the tab 14, the electrode of the circuit element 15 and the inner end of the lead 9 are connected with a wire 16.
After that, the inside of the dam 17 is molded with resin, and unnecessary dam 17. The lead frame frame 13 is cut and removed. Also,
- Cut the tab lead 18 from the root of the mold part 19 or the lead frame frame 13. In this example,
Since the lead end surface is also plated with silver which has good solderability, the reliability of attaching the C component is also improved. Further, by using such a lead frame, the C4 structure of the mold of the lead cutting and molding machine becomes simple, and therefore the mold manufacturing cost becomes low.
なお、このような形状のリードフレームにちっては、レ
ジ／モールド時のレジンの内圧によってダムが外方に曲
がるおそれもあることから、不要なあきリードの外端を
リードフレーム枠に連結したり、ダムとリードフレーム
枠間に補強片を渡すようにすることが望ましい・これら
あきリードおよび補強片はダム切断によってリードから
外れてしまうので製造上も特に間但（吐ない。Note that with lead frames of this type, there is a risk that the dam may bend outward due to the internal pressure of the resin during registration/molding, so it is important to connect the outer ends of unnecessary open leads to the lead frame frame. It is desirable to pass a reinforcing piece between the dam and the lead frame. Since these open leads and reinforcing pieces will come off the lead when the dam is cut, there is a special need for manufacturing.
一方、第４図（ａ）、Φ）に示すように、ソルダビリテ
ィの良好な金属でリードフレームが作られている場合に
は、同図（ｂ）で示すように、リード９の先ＪｌｉＫダ
ム切断面２０およびリード切断面２１が現われるように
することが望ましい。このようにすると、ダム切断面２
０．リード切断面２１は岐後に切断されて現われた面で
あることからきれいな面となって、ソルダビリティも良
好となる。On the other hand, as shown in Fig. 4(a), Φ), if the lead frame is made of a metal with good solderability, as shown in Fig. 4(b), the JliK dam is located at the end of lead 9. It is desirable that the cut surface 20 and the lead cut surface 21 be exposed. In this way, the dam cut surface 2
0. Since the lead cut surface 21 is a surface that appears after cutting, it is a clean surface and has good soldability.
以上のように、本発明の電′：ｆ部品つ取付構造によれ
ば、配線板コストの軽減化、実装密度の向上を図る仁と
ができるので、電子部品の実装コストを低減できる。As described above, according to the electronic component mounting structure of the present invention, it is possible to reduce the wiring board cost and improve the packaging density, thereby reducing the packaging cost of electronic components.
また、本発明によれば、電子部品の実装の信頼性も高い
等多くの効果を奏する。Further, according to the present invention, there are many effects such as high reliability in mounting electronic components.
第１図・真）、（ｂ）は従宋の電子部品の取付構造を示
す断面図および正面図、第２図は本発明の一実施例によ
る電子部品の取付構造を示す一部断面図、第３図は本発
明の他の実施例に用いるリードフレームの平面図、第４
図（ａ） 、 （ｂ）は本発明の池の実施例による電子
部品の斜視図およびリードの−部の斜視図である。
１・・封止部、２・・リード、３中・配線板、４・・取
付孔、５・・半田、６・・先端平坦部、７・・電子部品
１．８・・封止部、９・・リード、１０・・配線板、１
１・・半田、１２・・リードフレーム、１３寺参り一ド
フレーム枠、１４−−タブ、１５・・回路素そ、１６０
．ワイヤ、１７・・ダム、１８・・タブリード、１９・
・モールド部、２０一φダム切断面、２１・ ・リード
切断面。
第 １ 図
（ａ） （ｂ）
第 ４ 図Fig. 1 (true) and (b) are a cross-sectional view and a front view showing a mounting structure for electronic parts in the Congo Song Dynasty, and Fig. 2 is a partial cross-sectional view showing a mounting structure for electronic parts according to an embodiment of the present invention. FIG. 3 is a plan view of a lead frame used in another embodiment of the present invention;
Figures (a) and (b) are a perspective view of an electronic component according to an embodiment of the present invention and a perspective view of the negative part of a lead. 1. Sealing portion, 2. Lead, 3 Middle wiring board, 4. Mounting hole, 5. Solder, 6. Flat end portion, 7. Electronic component 1.8. Sealing portion, 9...Lead, 10...Wiring board, 1
1.Solder, 12.Lead frame, 13. Temple visit frame, 14--Tab, 15..Circuit element, 160
．． Wire, 17...Dam, 18...Tab lead, 19...
・Mold part, 201φ dam cut surface, 21・・Lead cut surface. Figure 1 (a) (b) Figure 4
Claims (1)
に沿って複数配列してなるリードとを有し、それらリー
ドの先端は自由端をなしている電子部品用リードフレー
ムと、そのタブには回路素子が固定され、そのタブ、回
路素子およびリードの一部は樹脂封止体により封止され
て成り、そして樹脂封止体より露出するリード自由端に
はめつき処理されてなることを特徴とする電子部品。1. A lead frame for electronic components, which has a rectangular tab to which a circuit element is fixed, and a plurality of leads arranged along the sides of the tab, the tips of which are free ends; A circuit element is fixed to the tab, the tab, the circuit element, and a part of the lead are sealed with a resin sealing body, and the free end of the lead exposed from the resin sealing body is fitted. An electronic component characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11725486A JPS61258461A (en) | 1986-05-23 | 1986-05-23 | Electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11725486A JPS61258461A (en) | 1986-05-23 | 1986-05-23 | Electronic part |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1146179A Division JPS55103789A (en) | 1979-02-05 | 1979-02-05 | Strucutre for mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61258461A true JPS61258461A (en) | 1986-11-15 |
Family
ID=14707210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11725486A Pending JPS61258461A (en) | 1986-05-23 | 1986-05-23 | Electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61258461A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141961A (en) * | 1974-10-07 | 1976-04-08 | Nippon Electric Co | Handotai shusekikairosochoriidofureemu |
| JPS51115775A (en) * | 1975-04-04 | 1976-10-12 | Nec Corp | Semiconductor apparatus |
| JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
| JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
| JPS53141577A (en) * | 1977-05-17 | 1978-12-09 | Mitsubishi Electric Corp | Lead frame for integrated circuit |
-
1986
- 1986-05-23 JP JP11725486A patent/JPS61258461A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5141961A (en) * | 1974-10-07 | 1976-04-08 | Nippon Electric Co | Handotai shusekikairosochoriidofureemu |
| JPS51115775A (en) * | 1975-04-04 | 1976-10-12 | Nec Corp | Semiconductor apparatus |
| JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
| JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
| JPS53141577A (en) * | 1977-05-17 | 1978-12-09 | Mitsubishi Electric Corp | Lead frame for integrated circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59227143A (en) | Package of integrated circuit | |
| JPS63296252A (en) | Resin sealed semiconductor device | |
| JPS61258461A (en) | Electronic part | |
| JPS61258460A (en) | Lead frame for electronic part | |
| JPS6097654A (en) | Sealed type semiconductor device | |
| KR910000018B1 (en) | Semiconductor device using the lead-frame and method of manufacture there of | |
| JPS62134945A (en) | Molded transistor | |
| JPS61258462A (en) | Assembly of electronic component parts | |
| JPS61258496A (en) | Mounting of electronic component | |
| JPS6212101A (en) | Terminal hoop for resin sealed electronic component | |
| JP2881932B2 (en) | Semiconductor device | |
| JPS5847710Y2 (en) | Comb-shaped lead frame for semiconductor devices | |
| JPS6329913A (en) | Fixed inductor | |
| JPH0214558A (en) | Semiconductor integrated circuit device | |
| JP3230318B2 (en) | Lead frame for semiconductor device | |
| JPH053275A (en) | Lead frame of semiconductor device | |
| JP2000277677A (en) | Lead frame, semiconductor package and manufacture thereof | |
| JPH04199739A (en) | Lead frame for semiconductor device | |
| JPH0199245A (en) | Ic package | |
| JPH02152243A (en) | Semiconductor device | |
| JPH03211865A (en) | Lead for semiconductor | |
| JPH0617088Y2 (en) | Integrated circuit socket | |
| JPS60161643A (en) | Semiconductor device | |
| JPH04209559A (en) | Semiconductor device | |
| JPH04186755A (en) | Lead frame |