JPS61258461A - Electronic part - Google Patents

Electronic part

Info

Publication number
JPS61258461A
JPS61258461A JP11725486A JP11725486A JPS61258461A JP S61258461 A JPS61258461 A JP S61258461A JP 11725486 A JP11725486 A JP 11725486A JP 11725486 A JP11725486 A JP 11725486A JP S61258461 A JPS61258461 A JP S61258461A
Authority
JP
Japan
Prior art keywords
leads
wiring board
electronic
sealing
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11725486A
Other languages
Japanese (ja)
Inventor
Fumihito Inoue
Susumu Okikawa
Keizo Otsuki
Kazuo Shimizu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11725486A priority Critical patent/JPS61258461A/en
Publication of JPS61258461A publication Critical patent/JPS61258461A/en
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49548Cross section geometry
    • H01L23/49551Cross section geometry characterised by bent parts
    • H01L23/49555Cross section geometry characterised by bent parts the bent parts being the outer leads
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE:To reduce the cost of a wiring board and improve a mounting density by a method wherein a tab, a circuit element and parts of leads are sealed with sealing resin and the free ends of the leads exposed from the sealing resin are plated. CONSTITUTION:An electronic part 7 is composed of a cuboid sealing part 8 and a plurality of leads 9 which are extended from the sides of the sealing part 8 and bent downward at their intermediate portions. The tips of the leads 9 extended downward touch the upper surface of a wiring board 10 and those touching parts are fixed with solder 11, welding material, to fix the electronic part 7 to the wiring board 10. Therefore, it is not necessary to drill fitting holes in the wiring board 10. By reducing the length H of the lead 9, possibility of catching the leads during the handling of the electronic parts can be reduced so that the creation of bent leads can be suppressed. With this constitution, the cost of the wiring board can be reduced and the mounting density can be improved.
JP11725486A 1986-05-23 1986-05-23 Electronic part Granted JPS61258461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11725486A JPS61258461A (en) 1986-05-23 1986-05-23 Electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11725486A JPS61258461A (en) 1986-05-23 1986-05-23 Electronic part

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1146179A Division JPS55103789A (en) 1979-02-05 1979-02-05 Strucutre for mounting electronic part

Publications (1)

Publication Number Publication Date
JPS61258461A true JPS61258461A (en) 1986-11-15

Family

ID=14707210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11725486A Granted JPS61258461A (en) 1986-05-23 1986-05-23 Electronic part

Country Status (1)

Country Link
JP (1) JPS61258461A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu
JPS51115775A (en) * 1975-04-04 1976-10-12 Nec Corp Semiconductor apparatus
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same
JPS5380969A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141961A (en) * 1974-10-07 1976-04-08 Nippon Electric Co Handotai shusekikairosochoriidofureemu
JPS51115775A (en) * 1975-04-04 1976-10-12 Nec Corp Semiconductor apparatus
JPS5363979A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Sealing method of semiconductor element and lead frame used for the same
JPS5380969A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit

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