JPS61258460A - Lead frame for electronic part - Google Patents
Lead frame for electronic partInfo
- Publication number
- JPS61258460A JPS61258460A JP11725386A JP11725386A JPS61258460A JP S61258460 A JPS61258460 A JP S61258460A JP 11725386 A JP11725386 A JP 11725386A JP 11725386 A JP11725386 A JP 11725386A JP S61258460 A JPS61258460 A JP S61258460A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- lead
- leads
- lead frame
- sealing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】 以工欠負 ・ 構造）に関する。[Detailed description of the invention] ・ structure).
封止部の側面から複数のリード（外部端子）を突出する
構造の電子部品（たとえば半導体装置）をプリント基板
、セラミック基板等の配線板に取り付ける構造としては
、従来、第１図（ａ） 、 （１））で示す構造が知ら
れている。同図（ａ）の構造は封止部１から嫌びるリー
ド２を途中で同一方向に’ｊｉり曲げてインライン形に
し、各リード２を配線板３に設けた取付孔４に挿し込み
、配線板３を貫通した先端部と配線板３とを半田５を介
して固定する構造となっている。また、同図（１））の
構造はインライン形のり−ド２の先端を再び外方に折り
曲げてフラットタイプとし、この先端平坦部６を配線板
３に載せて図示し々い半田を介して固定する構造である
。なお、これらの図ておいては配線板面の配線層は省略
してあろう
しかし、前者の挿込構造は配線板に取付孔を穿たなけれ
ばならず、配線板コストが高くなる難点がある。また、
後者のフラットタイプは増灯面積が広くなり、実装密度
力；低くなる欠点がある。Conventionally, as a structure for attaching an electronic component (for example, a semiconductor device) having a structure in which a plurality of leads (external terminals) protrude from the side surface of the sealing part to a wiring board such as a printed circuit board or a ceramic board, there is a structure shown in FIG. 1(a), The structure shown in (1)) is known. In the structure shown in FIG. 2(a), the leads 2 that are removed from the sealing part 1 are bent halfway in the same direction to form an in-line shape, each lead 2 is inserted into a mounting hole 4 provided in a wiring board 3, and the wiring is completed. It has a structure in which the tip portion passing through the plate 3 and the wiring board 3 are fixed via solder 5. In addition, the structure shown in FIG. 1 (1)) is made by bending the tip of the inline type glued 2 outward again to make it a flat type, and placing the flat tip 6 on the wiring board 3 and applying solder as shown in the figure. It is a fixed structure. Note that the wiring layer on the wiring board surface is omitted in these figures, but the former insertion structure requires drilling holes in the wiring board, which has the disadvantage of increasing the cost of the wiring board. be. Also,
The latter flat type has the disadvantage that the area for multiple lights is large and the mounting density is low.
したがって、本発明の目的は配線板コストの低廉化およ
び実装密度の向上を図ることが可能な電子部品に使用す
るリードフレームを提供することにある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a lead frame for use in electronic components that can reduce wiring board costs and improve packaging density.
本発明は樹脂封止体より露出されるところのリード先端
が他のリードフレーム構成部に接続されることなく自由
端をなしている。以下実施例により本発明を説明する。In the present invention, the lead tips exposed from the resin sealing body are free ends without being connected to other lead frame components. The present invention will be explained below with reference to Examples.
第２図は本発明の一実施例による電子部品の実装構造を
示す。同図に示す電子部品７は直方体からなる封止部８
と、封止部８の側面から延び途中で下方に折れ曲がる複
数のリード９とからなっている。そして、この電子部品
７は下方に延びるリード９の先端を配線板（配線層は省
略しである。）ＩＯの上面に当接し、その当接部を 材
である半田ＩＩによって配線板１０に固定している。FIG. 2 shows a mounting structure for electronic components according to an embodiment of the present invention. The electronic component 7 shown in the figure has a sealing part 8 made of a rectangular parallelepiped.
and a plurality of leads 9 extending from the side surface of the sealing part 8 and bending downward in the middle. Then, this electronic component 7 has the tip of the lead 9 extending downward in contact with the upper surface of the wiring board (wiring layer is omitted) IO, and the contact part is fixed to the wiring board 10 with solder II, which is a material. are doing.
このような実装構造によれば、配線板ｌＯに取付孔を設
ける必要がないことから配線板の製造コストが安価とな
る。また、フラットタイプのようにリード２が外方に延
びることがないので、このような実装構造では取付面積
が狭くてもよく、実装密度の向上を図ることができる。According to such a mounting structure, there is no need to provide a mounting hole in the wiring board 10, so that the manufacturing cost of the wiring board becomes low. Furthermore, unlike the flat type, the leads 2 do not extend outward, so with this mounting structure, the mounting area may be small, and the mounting density can be improved.
特にモールド部から４方向ＫＩＪ−ドが延在する構造で
は取付面積や＆ｌ小化に効果が顕著である。Particularly in a structure in which the KIJ-do extends in four directions from the mold part, the effect of reducing the mounting area and size is remarkable.
なお、前記実施例にあって、封止部８の外縁からリード
９の屈曲部までの距離ｔをできるだけ短かくすることに
よって実装面積をさらに狭くすることができろうまた、
リードを封止部の界面で折り曲げるようセすればリード
の折り曲げが容易となる利点もある。また、リード９の
長さく高さＨ）を短かくすることによって、電子部品の
ハンドリング時にリードが引っ掛りにくくなる。このた
め、リード曲がりの発生を少なくすることもできる。In addition, in the above embodiment, the mounting area can be further narrowed by making the distance t from the outer edge of the sealing part 8 to the bent part of the lead 9 as short as possible.
If the lead is bent at the interface of the sealing part, there is an advantage that the lead can be easily bent. Further, by shortening the length and height H) of the lead 9, the lead becomes less likely to be caught when handling electronic components. Therefore, the occurrence of lead bending can also be reduced.
また、この実装構造ではリード端面のソルダビリティ（
１８出の濡れ性）の良否が接続の良否に大きく影響する
。そこで、ソルダビリティを向上させるためにリード表
面に銀めっき等を砲こす場合もリードの先端面にも銀め
っきを施こす必要がある。この場合、第３図で示すよう
なリードフレーム１２を用いて電子部品を組み立てると
よい。このリードフレーム１２はリードフレーム製造の
段階でリード９の外端（モールド部から露出する先端）
をリードフレーム枠１３から分離しておき、この状態で
リードフレーム全体を恨めつきする。In addition, this mounting structure also has the solderability of the lead end face (
The quality of the wettability (wettability of 18) greatly affects the quality of the connection. Therefore, even when silver plating or the like is applied to the lead surface in order to improve soldability, it is necessary to also apply silver plating to the tip end surface of the lead. In this case, it is preferable to assemble the electronic component using a lead frame 12 as shown in FIG. This lead frame 12 is formed at the outer end of the lead 9 (the tip exposed from the mold part) at the lead frame manufacturing stage.
is separated from the lead frame frame 13, and the entire lead frame is assembled in this state.
そして、タブ１４上に回路素子１５を固定した後、回路
素子１５の電極とリード９の内端をワイヤ１６で繋ぎ、
その後ダム１７の内部をレジンでモールドし、不要なダ
ム１７．リードフレーム枠１３を切断除去する。また、
タブリード１８はモールド部１９４るいはリードフレー
ム枠１３の付は根から切断する。この実施例では、リー
ド先端面にもソルダビリティの良好な銀めっきが施こさ
れるので、電子部品の取り付けの信頼性も向上する。ま
た、このようなリードフレームを用いることによって、
リード切断成形機の金型の構造も簡素となることから、
−金型製造コストも安価となる。After fixing the circuit element 15 on the tab 14, the electrode of the circuit element 15 and the inner end of the lead 9 are connected with a wire 16.
After that, the inside of the dam 17 is molded with resin, and unnecessary dam 17. The lead frame frame 13 is cut and removed. Also,
The tab lead 18 is cut from the mold part 194 or the root of the lead frame frame 13. In this embodiment, since silver plating with good solderability is also applied to the lead end surfaces, the reliability of mounting electronic components is also improved. Also, by using such a lead frame,
Since the structure of the mold of the lead cutting molding machine is also simple,
-Mold production costs are also low.
なお、このような形状のリードフレームにちっては、レ
ジンモールド時のレジンの内圧によってダムが外方に曲
がるおそれもあることから、不要なあきリードの外端を
リードフレーム枠に連結したり、ダムとリードフレーム
枠間に補強片を渡すようにすることが望ましい。これら
あきリードおよび補強片はダム切断によってリードから
外れてしまうので製造上も１％に間＠はない。In addition, with lead frames of this type, there is a risk that the dam may bend outward due to the internal pressure of the resin during resin molding, so connect the outer ends of unnecessary open leads to the lead frame frame, or It is desirable to provide a reinforcing piece between the dam and the lead frame. Since these open leads and reinforcing pieces come off from the leads when the dam is cut, there is no 1% difference in manufacturing.
一方、第４図（ａ）、φ）に示すように、ソルダビリテ
ィの良好な金属でリードフレームが作られている場合に
は、同図（１））で示すように、リード９の先端部にダ
ム切ｌ析面２０およびリード切断面２１が現われるよう
にすることが望ましい。このようにすると、ダム切断面
２０．リード切断面２１は最後に切断されて現われた面
であることからきれいな面となって、ソルダビリティも
良好となる。On the other hand, if the lead frame is made of a metal with good solderability, as shown in FIG. 4(a), φ), the tip of the lead 9 It is desirable that the dam cutting surface 20 and the lead cutting surface 21 appear at the top. In this way, the dam cut surface 20. Since the lead cut surface 21 is the last surface to be cut, it is a clean surface and has good soldability.
以上のようＫ、本発明の電そ部品の取付構造によれば、
配線板−コストの軽減化、実装密度の向上を図るξとが
できるので、電子部品の実装コストを低減できる。As described above, according to the mounting structure for electrical components of the present invention,
Wiring board - Since it is possible to reduce costs and improve mounting density, it is possible to reduce mounting costs for electronic components.
また、本発明によれば、電子部品の実装の信頼性も高い
等多くの効果倉奏する。Further, according to the present invention, there are many advantages such as high reliability in mounting electronic components.
第１図（＆） 、 Ｃｂ）は従宋の電子部品の取付構造
を示す断面図および正面図、第２図は本発明の一実施例
による電子部品の取付構造を示す一部断ａ図、第３図は
本発明Ｏ池の実施例に用いるリードフレームの平面図、
第４図（ａ） 、 （１））は本発明の池の実施例によ
る電子部品の斜視図およびリードの一部の斜視図でちる
。
１・・封止部、２・・リード、−３・・配線板、４・・
取付孔、５・・半田、６・・先端平坦部、７・・電子部
品、８・・封止部、９・・リード、１０・・配線板、１
１・・半田、１２・・リードフレーム、１３・Φリード
フレ−ム枠、１４・９タブ、】５・・回路素そ、１６・
・ワイヤ、１７＃・ダム、１８−争タブリード、】９争
ｅモ一ルド部、２０パ°・ダム切断面、２１・ ・リー
ド切断面。
第 １ 図
（、） （ｂ）
第 ４ 図
（−） （ｂ）FIG. 1 (&), Cb) is a cross-sectional view and front view showing a mounting structure for electronic components in the Congo Song Dynasty, FIG. 2 is a partial cross-sectional view A showing a mounting structure for electronic components according to an embodiment of the present invention, FIG. 3 is a plan view of a lead frame used in an embodiment of the O pond of the present invention;
FIGS. 4(a) and 4(1)) are a perspective view of an electronic component according to an embodiment of the present invention and a perspective view of a portion of a lead. 1...Sealing part, 2...Lead, -3...Wiring board, 4...
Mounting hole, 5...Solder, 6...Flat end, 7...Electronic component, 8...Sealing part, 9...Lead, 10...Wiring board, 1
1.Solder, 12.Lead frame, 13.Φ lead frame frame, 14.9 tab, ]5..Circuit element, 16.
・Wire, 17#・Dam, 18-Tab lead, 】9-E mold part, 20 Pad ・Dam cutting surface, 21. ・Lead cutting surface. Figure 1 (,) (b) Figure 4 (-) (b)
Claims (1)
に沿って複数配列してなるリードとを有し、それらリー
ドの先端は自由端をなしていることを特徴とする電子部
品用リードフレーム。1. An electronic component characterized by having a rectangular tab to which a circuit element is fixed, and a plurality of leads arranged along the sides of the tab, the tips of which are free ends. lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11725386A JPS61258460A (en) | 1986-05-23 | 1986-05-23 | Lead frame for electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11725386A JPS61258460A (en) | 1986-05-23 | 1986-05-23 | Lead frame for electronic part |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1146179A Division JPS55103789A (en) | 1979-02-05 | 1979-02-05 | Strucutre for mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61258460A true JPS61258460A (en) | 1986-11-15 |
Family
ID=14707183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11725386A Pending JPS61258460A (en) | 1986-05-23 | 1986-05-23 | Lead frame for electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61258460A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147832U (en) * | 1987-03-19 | 1988-09-29 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
| JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
-
1986
- 1986-05-23 JP JP11725386A patent/JPS61258460A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5363979A (en) * | 1976-11-19 | 1978-06-07 | Hitachi Ltd | Sealing method of semiconductor element and lead frame used for the same |
| JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147832U (en) * | 1987-03-19 | 1988-09-29 |
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