JPS58159737U - 半導体基板のエツチング装置 - Google Patents

半導体基板のエツチング装置

Info

Publication number
JPS58159737U
JPS58159737U JP5569382U JP5569382U JPS58159737U JP S58159737 U JPS58159737 U JP S58159737U JP 5569382 U JP5569382 U JP 5569382U JP 5569382 U JP5569382 U JP 5569382U JP S58159737 U JPS58159737 U JP S58159737U
Authority
JP
Japan
Prior art keywords
semiconductor substrate
etching equipment
substrate etching
rotation mechanism
rotating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5569382U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230836Y2 (enrdf_load_stackoverflow
Inventor
尚博 清水
大坪　義信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Electric Manufacturing Ltd
Original Assignee
Toyo Electric Manufacturing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Electric Manufacturing Ltd filed Critical Toyo Electric Manufacturing Ltd
Priority to JP5569382U priority Critical patent/JPS58159737U/ja
Publication of JPS58159737U publication Critical patent/JPS58159737U/ja
Application granted granted Critical
Publication of JPH0230836Y2 publication Critical patent/JPH0230836Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
JP5569382U 1982-04-19 1982-04-19 半導体基板のエツチング装置 Granted JPS58159737U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5569382U JPS58159737U (ja) 1982-04-19 1982-04-19 半導体基板のエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5569382U JPS58159737U (ja) 1982-04-19 1982-04-19 半導体基板のエツチング装置

Publications (2)

Publication Number Publication Date
JPS58159737U true JPS58159737U (ja) 1983-10-25
JPH0230836Y2 JPH0230836Y2 (enrdf_load_stackoverflow) 1990-08-20

Family

ID=30066258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5569382U Granted JPS58159737U (ja) 1982-04-19 1982-04-19 半導体基板のエツチング装置

Country Status (1)

Country Link
JP (1) JPS58159737U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015106571A (ja) * 2013-11-28 2015-06-08 京セラ株式会社 エッチング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015106571A (ja) * 2013-11-28 2015-06-08 京セラ株式会社 エッチング方法

Also Published As

Publication number Publication date
JPH0230836Y2 (enrdf_load_stackoverflow) 1990-08-20

Similar Documents

Publication Publication Date Title
JPS58159737U (ja) 半導体基板のエツチング装置
JPS59169042U (ja) 液処理装置
JPS6094660U (ja) レジスト塗布装置
JPS5977225U (ja) 半導体素子製造装置
JPS60100748U (ja) フオトレジスト塗布装置
JPS5926242U (ja) 半導体ウエハのエツチング治具
JPS59173341U (ja) 回転塗布装置
JPS59195734U (ja) 酸化膜化成装置
JPS6022833U (ja) 半導体製造装置
JPS58158441U (ja) 半導体エツチング装置
JPS6068640U (ja) 半導体ウエ−ハ超音波洗浄装置
JPS6094842U (ja) 半導体基板用研削装置
JPS5982257U (ja) レジスト塗布装置
JPS59159942U (ja) スピンナ−装置
JPS60169838U (ja) 半導体製造装置
JPS60190036U (ja) ウエツトエツチング装置
JPS59104533U (ja) レジスト処理装置
JPS58114042U (ja) シリコンウエハ−の洗浄装置
JPS59115648U (ja) 半導体ウエハ移替装置
JPS6052623U (ja) 超音波洗浄装置
JPS602830U (ja) 半導体ウエハのエツチング槽
JPS6052625U (ja) ウェハ搬送装置
JPS59119450U (ja) レジスト現像装置
JPS60111044U (ja) 半導体ウエ−ハ用処理治具
JPS6068635U (ja) 半導体製造装置