JPS59173341U - 回転塗布装置 - Google Patents

回転塗布装置

Info

Publication number
JPS59173341U
JPS59173341U JP6788783U JP6788783U JPS59173341U JP S59173341 U JPS59173341 U JP S59173341U JP 6788783 U JP6788783 U JP 6788783U JP 6788783 U JP6788783 U JP 6788783U JP S59173341 U JPS59173341 U JP S59173341U
Authority
JP
Japan
Prior art keywords
coating device
rotary coating
holding portion
substrate
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6788783U
Other languages
English (en)
Inventor
上田 久美
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP6788783U priority Critical patent/JPS59173341U/ja
Publication of JPS59173341U publication Critical patent/JPS59173341U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図は従来の回転塗布装置の断面図、第2図は本考案
の一実施例における真空チャックの斜視図、第3図は本
考案のチャックを装備した回転塗布装置の断面図である
。 1・・・・・・回転軸、2・・・・・・ウェハー、3・
・・・・・貫通口、4・・・・・・真空吸引用溝、5・
・・・・・ホトレジスト、6・・・・・・モータ、7・
・・・・・保持部、8・・・・・・ウェハ位置決めリン
グ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板の保持部と、この保持部を回転させる回転軸と、前
    記保持部の底部に前記基板と略一致した大きさの中心位
    置決め部材とを有する二吉を特徴とする回転塗布装置。
JP6788783U 1983-05-06 1983-05-06 回転塗布装置 Pending JPS59173341U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6788783U JPS59173341U (ja) 1983-05-06 1983-05-06 回転塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6788783U JPS59173341U (ja) 1983-05-06 1983-05-06 回転塗布装置

Publications (1)

Publication Number Publication Date
JPS59173341U true JPS59173341U (ja) 1984-11-19

Family

ID=30198072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6788783U Pending JPS59173341U (ja) 1983-05-06 1983-05-06 回転塗布装置

Country Status (1)

Country Link
JP (1) JPS59173341U (ja)

Similar Documents

Publication Publication Date Title
JPS59173341U (ja) 回転塗布装置
JPS5989483U (ja) 磁気デイスクカ−トリツジ
JPS60117034U (ja) 半導体真空回転チヤツク
JPS6112653U (ja) バキユ−ムチヤツク
JPS5839039U (ja) 半導体素子の蒸着治具
JPS6066281U (ja) 駆動装置
JPS5926242U (ja) 半導体ウエハのエツチング治具
JPH0265333U (ja)
JPS6096821U (ja) 半導体製造装置
JPS58132573U (ja) 回転塗布装置
JPS5815346U (ja) ウエハ回転装置
JPS59117136U (ja) エピタキシヤル成長装置用サセプタ−
JPS6087654U (ja) 真空チヤツク
JPS59192835U (ja) スピンナ
JPS6045437U (ja) 半導体ウエ−ハホルダ
JPS58144643U (ja) テ−プレコ−ダのリ−ル台
JPS60100748U (ja) フオトレジスト塗布装置
JPS5839509U (ja) 塗膜厚さ測定器
JPS5966366U (ja) モ−タを用いた回転伝達装置
JPS6021984U (ja) 磁力自転装置
JPS59110426U (ja) ガイドシリンダ
JPS5995019U (ja) パ−ツフイ−ダ
JPS5936241U (ja) 半導体製造装置
JPS5825039U (ja) 半導体基板
JPS6048341U (ja) モ−タの取付構造