JPS58159737U - Semiconductor substrate etching equipment - Google Patents
Semiconductor substrate etching equipmentInfo
- Publication number
- JPS58159737U JPS58159737U JP5569382U JP5569382U JPS58159737U JP S58159737 U JPS58159737 U JP S58159737U JP 5569382 U JP5569382 U JP 5569382U JP 5569382 U JP5569382 U JP 5569382U JP S58159737 U JPS58159737 U JP S58159737U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- etching equipment
- substrate etching
- rotation mechanism
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体基板のエツチング装置を示す概略
断面図、第２図は第゛１図装置でエツチング加工された
シリコン基板を示す断面図、第３図は本考案にがかる一
実施例のエツチング装置の１部切り欠き側面説明図、第
４図は第３図装置でエツチング加工されたシリコン基板
を示す断面図である。
２．２′・・・エツチング液、３．３′・・・半導体基
板、５・・・第１の回転機構、５ａ・・・回転治具、６
・・・第２の回転機構、６ａ・・・円筒状のエツチング
槽。FIG. 1 is a schematic sectional view showing a conventional semiconductor substrate etching apparatus, FIG. 2 is a sectional view showing a silicon substrate etched by the apparatus shown in FIG. FIG. 4 is a partially cutaway side view of the etching apparatus, and FIG. 4 is a sectional view showing a silicon substrate etched by the apparatus of FIG. 2.2'... Etching liquid, 3.3'... Semiconductor substrate, 5... First rotating mechanism, 5a... Rotating jig, 6
...Second rotation mechanism, 6a...Cylindrical etching tank.
Claims (1)
を回転させる第１の回転機構と、前記複数個の半導体基
板を浸すエツチング液を貯留させる円筒状のエツチング
槽と、該エツチング槽を回転させる第２の回転機構とを
備え、該第２の回転機構を回転させてから前記回転治具
を前記エツチング液中に設置して第１の回転機構を駆動
させることを特徴とする半導体基板のエツチング装置。A rotating jig for fixing a plurality of semiconductor substrates, a first rotation mechanism for rotating the rotating jig, a cylindrical etching tank for storing an etching solution for immersing the plurality of semiconductor substrates, and the etching tank. a second rotation mechanism that rotates the semiconductor device, and after rotating the second rotation mechanism, the rotation jig is placed in the etching solution and the first rotation mechanism is driven. Substrate etching equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569382U JPS58159737U (en) | 1982-04-19 | 1982-04-19 | Semiconductor substrate etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5569382U JPS58159737U (en) | 1982-04-19 | 1982-04-19 | Semiconductor substrate etching equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58159737U true JPS58159737U (en) | 1983-10-25 |
| JPH0230836Y2 JPH0230836Y2 (en) | 1990-08-20 |
Family
ID=30066258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5569382U Granted JPS58159737U (en) | 1982-04-19 | 1982-04-19 | Semiconductor substrate etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58159737U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015106571A (en) * | 2013-11-28 | 2015-06-08 | 京セラ株式会社 | Etching method |
-
1982
- 1982-04-19 JP JP5569382U patent/JPS58159737U/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015106571A (en) * | 2013-11-28 | 2015-06-08 | 京セラ株式会社 | Etching method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230836Y2 (en) | 1990-08-20 |
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