JPS5926242U

JPS5926242U - Semiconductor wafer etching jig

Info

Publication number: JPS5926242U
Application number: JP12062982U
Authority: JP
Inventors: 尚博清水; 井口　信; 宗三郎堀田
Original assignee: 東洋電機製造株式会社
Priority date: 1982-08-10
Filing date: 1982-08-10
Publication date: 1984-02-18

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図および第２図は従来のもので、第１図はエツチン
グ加工中の状態図、第２図はエツチング加工完了したウ
ェハの状態図であり、第３図ａ。ｂはエツチング加工前のウェハで、ａは平面図、ｂはａ
に示すｘ−ｘ’線断面図、第３図Ｃはエツチング後のウ
ェハ断面図である。第４図は本考案にがかるウェハのエ
ツチング治具を示し、ａはその断面図、ｂは平面口であ
り、第５図はエツチング加工中の状態図である。第６図
は本考案の基本技術思想番説明するための説明図で、ａ
は第３図すに示したものに類したエツチング加工前の断
面図、ｂはエツチング加工後の断面図である。１．１’、１“、１“′・・・・・・ウェハ、５・−・
曲エツチング液、７・・・・・・治具本体、７ａ・・・
・・・絞り孔（吸液口）、７ｂ・・・・・・排液口、８
・・・・・・台。1 and 2 are conventional ones, where FIG. 1 is a state diagram during etching processing, FIG. 2 is a state diagram of a wafer after etching processing is completed, and FIG. 3a is a state diagram. b is a wafer before etching, a is a plan view, b is a
FIG. 3C is a cross-sectional view of the wafer after etching. FIG. 4 shows a wafer etching jig according to the present invention, in which a is a cross-sectional view thereof, b is a plane opening, and FIG. 5 is a state diagram during etching. Figure 6 is an explanatory diagram for explaining the basic technical idea of the present invention.
is a sectional view before etching similar to that shown in FIG. 3, and b is a sectional view after etching. 1.1', 1", 1"'...wafer, 5...
Curved etching liquid, 7... Jig body, 7a...
... Throttle hole (liquid suction port), 7b... Liquid drain port, 8
......stand.

Claims

[Scope of utility model registration request]

In a wet etching apparatus used for etching only one side of a semiconductor wafer, a box-like body is constructed of a jig body and a stand that fits into the jig body and attaches the semiconductor wafer to the inner surface of the jig body. , a constriction hole with a smaller diameter than the outer diameter of the semiconductor wafer mounted on the stand is provided in the jig main body in a direction concentric with the semiconductor wafer and perpendicular to the surface of the semiconductor wafer, and serves as an etching solution supply port, and the aperture hole is provided in the jig body in a direction directly in front of the semiconductor wafer. A jig for etching a semiconductor wafer, characterized in that radial drain ports are provided at equal intervals in a direction perpendicular to the aperture holes.