JPH02137040U - - Google Patents

Info

Publication number
JPH02137040U
JPH02137040U JP4315789U JP4315789U JPH02137040U JP H02137040 U JPH02137040 U JP H02137040U JP 4315789 U JP4315789 U JP 4315789U JP 4315789 U JP4315789 U JP 4315789U JP H02137040 U JPH02137040 U JP H02137040U
Authority
JP
Japan
Prior art keywords
semiconductor wafer
etching
etching apparatus
swinging
containers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4315789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4315789U priority Critical patent/JPH02137040U/ja
Publication of JPH02137040U publication Critical patent/JPH02137040U/ja
Pending legal-status Critical Current

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  • Weting (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の半導体ウエハのエツチング装
置の一実施例を示す断面図および平面図である。 1:回転円板、2:ビーカー、4:ウエハ、5
:シヤフト、6:駆動用モータ。
FIG. 1 is a sectional view and a plan view showing an embodiment of the semiconductor wafer etching apparatus of the present invention. 1: Rotating disk, 2: Beaker, 4: Wafer, 5
: Shaft, 6: Drive motor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウエハを鏡面状に化学的エツチングする
半導体ウエハのエツチング装置において、前記半
導体ウエハおよびエツチング液を収納する複数個
の容器を積載する回転形円板と、該円板を任意速
度で偏心回転させ、前記容器を揺動して前記半導
体ウエハをエツチングする偏心駆動装置とよりな
ることを特徴とする半導体ウエハのエツチング装
置。
A semiconductor wafer etching apparatus for chemically etching a semiconductor wafer into a mirror-like surface, comprising: a rotating disk carrying a plurality of containers for storing the semiconductor wafer and an etching solution; the disk being eccentrically rotated at an arbitrary speed; A semiconductor wafer etching apparatus comprising an eccentric drive device for etching the semiconductor wafer by swinging the container.
JP4315789U 1989-04-13 1989-04-13 Pending JPH02137040U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4315789U JPH02137040U (en) 1989-04-13 1989-04-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4315789U JPH02137040U (en) 1989-04-13 1989-04-13

Publications (1)

Publication Number Publication Date
JPH02137040U true JPH02137040U (en) 1990-11-15

Family

ID=31555332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4315789U Pending JPH02137040U (en) 1989-04-13 1989-04-13

Country Status (1)

Country Link
JP (1) JPH02137040U (en)

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