JPS58159353A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS58159353A JPS58159353A JP4218582A JP4218582A JPS58159353A JP S58159353 A JPS58159353 A JP S58159353A JP 4218582 A JP4218582 A JP 4218582A JP 4218582 A JP4218582 A JP 4218582A JP S58159353 A JPS58159353 A JP S58159353A
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- metal
- wiring
- substrate
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000001312 dry etching Methods 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 238000007740 vapor deposition Methods 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 210000000554 iris Anatomy 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Weting (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4218582A JPS58159353A (ja) | 1982-03-17 | 1982-03-17 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4218582A JPS58159353A (ja) | 1982-03-17 | 1982-03-17 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58159353A true JPS58159353A (ja) | 1983-09-21 |
JPH0122983B2 JPH0122983B2 (enrdf_load_stackoverflow) | 1989-04-28 |
Family
ID=12628940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4218582A Granted JPS58159353A (ja) | 1982-03-17 | 1982-03-17 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58159353A (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4910670A (enrdf_load_stackoverflow) * | 1972-05-24 | 1974-01-30 |
-
1982
- 1982-03-17 JP JP4218582A patent/JPS58159353A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4910670A (enrdf_load_stackoverflow) * | 1972-05-24 | 1974-01-30 |
Also Published As
Publication number | Publication date |
---|---|
JPH0122983B2 (enrdf_load_stackoverflow) | 1989-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3849270A (en) | Process of manufacturing semiconductor devices | |
US3623961A (en) | Method of providing an electric connection to a surface of an electronic device and device obtained by said method | |
JPS58159353A (ja) | 半導体装置の製造方法 | |
JPH05109714A (ja) | 半導体装置の製造方法 | |
KR0171069B1 (ko) | 반도체 장치의 접촉부 형성방법 | |
JP3211287B2 (ja) | 半導体装置の製造方法 | |
CN109037191B (zh) | 修调电阻及其制造方法 | |
JP2906877B2 (ja) | 半導体装置及びその製造方法 | |
JPS6362352A (ja) | 半導体装置の製造方法 | |
JPS5910232A (ja) | 半導体装置の製造方法 | |
JPH04196429A (ja) | 半導体集積回路装置の製造方法 | |
JPS6125217B2 (enrdf_load_stackoverflow) | ||
JPS588143B2 (ja) | シユウセキカイロ ノ セイゾウホウ | |
JPH0562975A (ja) | 半導体装置の製造方法 | |
JPS60154539A (ja) | アルミ配線の形成方法 | |
JPH03230532A (ja) | 半導体装置の製造方法 | |
JPS63272050A (ja) | 半導体装置の製造方法 | |
JPS60227440A (ja) | 半導体装置の製造方法 | |
JPH0451050B2 (enrdf_load_stackoverflow) | ||
JPH0289319A (ja) | 半導体装置の製造方法 | |
JPS58215029A (ja) | 半導体装置の製造方法 | |
JPH0457332A (ja) | 半導体装置の製造方法 | |
JPS6210034B2 (enrdf_load_stackoverflow) | ||
JPS6020904B2 (ja) | 半導体装置の製造方法 | |
JPS6053086A (ja) | 化合物半導体集積回路の製造法 |