JPS58154242A - 半導体素子ボンデイング用金合金細線 - Google Patents

半導体素子ボンデイング用金合金細線

Info

Publication number
JPS58154242A
JPS58154242A JP57037580A JP3758082A JPS58154242A JP S58154242 A JPS58154242 A JP S58154242A JP 57037580 A JP57037580 A JP 57037580A JP 3758082 A JP3758082 A JP 3758082A JP S58154242 A JPS58154242 A JP S58154242A
Authority
JP
Japan
Prior art keywords
bonding
wire
gold alloy
gold
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57037580A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0212022B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Naoyuki Hosoda
細田　直之
Masayuki Tanaka
正幸 田中
Tamotsu Mori
保 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP57037580A priority Critical patent/JPS58154242A/ja
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to GB08227141A priority patent/GB2116208B/en
Priority to NL8203706A priority patent/NL8203706A/nl
Priority to FR8216472A priority patent/FR2517885B1/fr
Priority to DE19823237385 priority patent/DE3237385A1/de
Priority to KR8204586A priority patent/KR890003143B1/ko
Priority to IT68243/82A priority patent/IT1156088B/it
Publication of JPS58154242A publication Critical patent/JPS58154242A/ja
Priority to SG934/87A priority patent/SG93487G/en
Priority to MY920/87A priority patent/MY8700920A/xx
Priority to HK178/88A priority patent/HK17888A/xx
Priority to US07/296,350 priority patent/US4885135A/en
Priority to US07/445,542 priority patent/US5071619A/en
Publication of JPH0212022B2 publication Critical patent/JPH0212022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/011—Groups of the periodic table
    • H01L2924/01105—Rare earth metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57037580A 1981-12-04 1982-03-10 半導体素子ボンデイング用金合金細線 Granted JPS58154242A (ja)

Priority Applications (12)

Application Number Priority Date Filing Date Title
JP57037580A JPS58154242A (ja) 1982-03-10 1982-03-10 半導体素子ボンデイング用金合金細線
GB08227141A GB2116208B (en) 1981-12-04 1982-09-23 Fine gold alloy wire for bonding of a semiconductor device
NL8203706A NL8203706A (nl) 1981-12-04 1982-09-24 Draad vervaardigd uit een goudlegering en halfgeleiderorgaan voorzien van een dergelijke draad.
FR8216472A FR2517885B1 (fr) 1981-12-04 1982-09-30 Fil d'alliage d'or fin pour connecter un dispositif a semi-conducteur
DE19823237385 DE3237385A1 (de) 1981-12-04 1982-10-08 Feingoldlegierungsdraht zum verbinden von halbleiterelementen
KR8204586A KR890003143B1 (ko) 1981-12-04 1982-10-12 반도체 소자 결선용 금합금 세선
IT68243/82A IT1156088B (it) 1981-12-04 1982-10-25 Filo sottile in lega d oro per il collegamento di un dispositivo a semiconduttore
SG934/87A SG93487G (en) 1981-12-04 1987-10-26 Fine gold alloy wire for bonding of a semiconductor device
MY920/87A MY8700920A (en) 1981-12-04 1987-12-30 Fine gold alloy wire for bonding of a semiconductor device
HK178/88A HK17888A (en) 1981-12-04 1988-03-03 Fine gold alloy wire for bonding of a semiconductor device
US07/296,350 US4885135A (en) 1981-12-04 1989-01-09 Fine gold alloy wire for bonding of a semi-conductor device
US07/445,542 US5071619A (en) 1981-12-04 1989-12-04 Fine gold alloy wire for bonding of a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57037580A JPS58154242A (ja) 1982-03-10 1982-03-10 半導体素子ボンデイング用金合金細線

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3060831A Division JPH0647699B2 (ja) 1991-01-29 1991-01-29 半導体素子ボンディング用金合金細線

Publications (2)

Publication Number Publication Date
JPS58154242A true JPS58154242A (ja) 1983-09-13
JPH0212022B2 JPH0212022B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-03-16

Family

ID=12501472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57037580A Granted JPS58154242A (ja) 1981-12-04 1982-03-10 半導体素子ボンデイング用金合金細線

Country Status (1)

Country Link
JP (1) JPS58154242A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030158A (ja) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd ボンデイングワイヤ−
JPS62228440A (ja) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk 半導体素子ボンデイング用金線
JPS6478698A (en) * 1987-09-21 1989-03-24 Mitsubishi Metal Corp Ribbon foil material of au alloy for brazing semiconductor device without degrading in hardness with age
JPH01146336A (ja) * 1987-12-03 1989-06-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH01198438A (ja) * 1988-02-02 1989-08-10 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH02170931A (ja) * 1988-09-29 1990-07-02 Mitsubishi Metal Corp 金バンプ用金合金細線
JPH02250934A (ja) * 1989-03-24 1990-10-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線
WO2006057230A1 (ja) * 2004-11-26 2006-06-01 Tanaka Denshi Kogyo K.K. 半導体素子用Auボンディングワイヤ
JP2008016550A (ja) * 2006-07-04 2008-01-24 Tanaka Electronics Ind Co Ltd 半導体素子用Ａｕボンディングワイヤ
US7830008B2 (en) 2005-01-24 2010-11-09 Nippon Steel Materials Co., Ltd. Gold wire for connecting semiconductor chip
DE112010004053T5 (de) 2009-10-14 2012-12-06 Hitachi High-Technologies Corporation Gasfeldionisations-Ionenquelle und Ionenstrahlvorrichtung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112061A (en) * 1977-03-11 1978-09-30 Sharp Corp Wiring substrate of semiconductor chip
JPS53112059A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPH0212022A (ja) * 1988-06-30 1990-01-17 Canon Inc 超伝導光検出素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112061A (en) * 1977-03-11 1978-09-30 Sharp Corp Wiring substrate of semiconductor chip
JPS53112059A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPH0212022A (ja) * 1988-06-30 1990-01-17 Canon Inc 超伝導光検出素子

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030158A (ja) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd ボンデイングワイヤ−
JPS62228440A (ja) * 1986-03-28 1987-10-07 Matsuda Kikinzoku Kogyo Kk 半導体素子ボンデイング用金線
JPS6478698A (en) * 1987-09-21 1989-03-24 Mitsubishi Metal Corp Ribbon foil material of au alloy for brazing semiconductor device without degrading in hardness with age
JPH01146336A (ja) * 1987-12-03 1989-06-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH01198438A (ja) * 1988-02-02 1989-08-10 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH02170931A (ja) * 1988-09-29 1990-07-02 Mitsubishi Metal Corp 金バンプ用金合金細線
JPH02250934A (ja) * 1989-03-24 1990-10-08 Mitsubishi Metal Corp 半導体素子ボンディング用Ａｕ合金極細線
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線
WO2006057230A1 (ja) * 2004-11-26 2006-06-01 Tanaka Denshi Kogyo K.K. 半導体素子用Auボンディングワイヤ
US7830008B2 (en) 2005-01-24 2010-11-09 Nippon Steel Materials Co., Ltd. Gold wire for connecting semiconductor chip
JP2008016550A (ja) * 2006-07-04 2008-01-24 Tanaka Electronics Ind Co Ltd 半導体素子用Ａｕボンディングワイヤ
DE112010004053T5 (de) 2009-10-14 2012-12-06 Hitachi High-Technologies Corporation Gasfeldionisations-Ionenquelle und Ionenstrahlvorrichtung

Also Published As

Publication number Publication date
JPH0212022B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-03-16

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