JPS53112059A - Gold wire for bonding semiconductor - Google Patents

Gold wire for bonding semiconductor

Info

Publication number
JPS53112059A
JPS53112059A JP2729177A JP2729177A JPS53112059A JP S53112059 A JPS53112059 A JP S53112059A JP 2729177 A JP2729177 A JP 2729177A JP 2729177 A JP2729177 A JP 2729177A JP S53112059 A JPS53112059 A JP S53112059A
Authority
JP
Japan
Prior art keywords
gold wire
bonding semiconductor
bonding
semiconductor
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2729177A
Other languages
Japanese (ja)
Other versions
JPS5826662B2 (en
Inventor
Shiyouzou Hayashi
Nobuyuki Tadokoro
Susumu Tomiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP52027291A priority Critical patent/JPS5826662B2/en
Publication of JPS53112059A publication Critical patent/JPS53112059A/en
Publication of JPS5826662B2 publication Critical patent/JPS5826662B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85203—Thermocompression bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP52027291A 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices Expired JPS5826662B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52027291A JPS5826662B2 (en) 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52027291A JPS5826662B2 (en) 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices

Publications (2)

Publication Number Publication Date
JPS53112059A true JPS53112059A (en) 1978-09-30
JPS5826662B2 JPS5826662B2 (en) 1983-06-04

Family

ID=12216965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52027291A Expired JPS5826662B2 (en) 1977-03-11 1977-03-11 Gold wire for bonding semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5826662B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58154242A (en) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp Fine wire of gold alloy for bonding semiconductor element
JPS59119752A (en) * 1982-12-24 1984-07-11 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPS6030158A (en) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd Bonding wire
JPS6478698A (en) * 1987-09-21 1989-03-24 Mitsubishi Metal Corp Ribbon foil material of au alloy for brazing semiconductor device without degrading in hardness with age
JPH04214828A (en) * 1991-01-29 1992-08-05 Mitsubishi Materials Corp Gold alloy thin wire for bonding semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272625A (en) * 1965-10-18 1966-09-13 James Cohn Beryllium-gold alloy and article made therefrom

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272625A (en) * 1965-10-18 1966-09-13 James Cohn Beryllium-gold alloy and article made therefrom

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58154242A (en) * 1982-03-10 1983-09-13 Mitsubishi Metal Corp Fine wire of gold alloy for bonding semiconductor element
JPH0212022B2 (en) * 1982-03-10 1990-03-16 Mitsubishi Metal Corp
JPS59119752A (en) * 1982-12-24 1984-07-11 Tanaka Denshi Kogyo Kk Bonding gold wire for semiconductor element
JPH048944B2 (en) * 1982-12-24 1992-02-18
JPS6030158A (en) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd Bonding wire
JPH0245336B2 (en) * 1983-07-29 1990-10-09 Sumitomo Metal Mining Co
JPS6478698A (en) * 1987-09-21 1989-03-24 Mitsubishi Metal Corp Ribbon foil material of au alloy for brazing semiconductor device without degrading in hardness with age
JPH04214828A (en) * 1991-01-29 1992-08-05 Mitsubishi Materials Corp Gold alloy thin wire for bonding semiconductor device

Also Published As

Publication number Publication date
JPS5826662B2 (en) 1983-06-04

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