JPS5458352A - Method of bonding wire - Google Patents

Method of bonding wire

Info

Publication number
JPS5458352A
JPS5458352A JP12447277A JP12447277A JPS5458352A JP S5458352 A JPS5458352 A JP S5458352A JP 12447277 A JP12447277 A JP 12447277A JP 12447277 A JP12447277 A JP 12447277A JP S5458352 A JPS5458352 A JP S5458352A
Authority
JP
Japan
Prior art keywords
bonding wire
bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12447277A
Other languages
Japanese (ja)
Other versions
JPS6132814B2 (en
Inventor
Masajirou Takasaki
Kazuhiro Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP12447277A priority Critical patent/JPS5458352A/en
Publication of JPS5458352A publication Critical patent/JPS5458352A/en
Publication of JPS6132814B2 publication Critical patent/JPS6132814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
JP12447277A 1977-10-19 1977-10-19 Method of bonding wire Granted JPS5458352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12447277A JPS5458352A (en) 1977-10-19 1977-10-19 Method of bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12447277A JPS5458352A (en) 1977-10-19 1977-10-19 Method of bonding wire

Publications (2)

Publication Number Publication Date
JPS5458352A true JPS5458352A (en) 1979-05-11
JPS6132814B2 JPS6132814B2 (en) 1986-07-29

Family

ID=14886352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12447277A Granted JPS5458352A (en) 1977-10-19 1977-10-19 Method of bonding wire

Country Status (1)

Country Link
JP (1) JPS5458352A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58139435A (en) * 1982-02-15 1983-08-18 Toshiba Corp Bonding method
JP2012169309A (en) * 2011-02-09 2012-09-06 Ricoh Co Ltd Electronic device and manufacturing method therefor and image forming apparatus
US10181452B2 (en) 2017-01-27 2019-01-15 Nichia Corporation Method for manufacturing light-emitting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5041818U (en) * 1973-08-13 1975-04-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5041818U (en) * 1973-08-13 1975-04-28

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58139435A (en) * 1982-02-15 1983-08-18 Toshiba Corp Bonding method
JPH0147893B2 (en) * 1982-02-15 1989-10-17 Tokyo Shibaura Electric Co
JP2012169309A (en) * 2011-02-09 2012-09-06 Ricoh Co Ltd Electronic device and manufacturing method therefor and image forming apparatus
US10181452B2 (en) 2017-01-27 2019-01-15 Nichia Corporation Method for manufacturing light-emitting device

Also Published As

Publication number Publication date
JPS6132814B2 (en) 1986-07-29

Similar Documents

Publication Publication Date Title
JPS53146572A (en) Method of bonding disks
YU61078A (en) Semi-thermal method of drawing wire
JPS5458352A (en) Method of bonding wire
JPS5655001A (en) Method of forming lead wire of chipplike part
JPS5458354A (en) Method of bonding wire
JPS5458353A (en) Method of bonding wire
JPS5433661A (en) Method of bonding wires
JPS5296868A (en) Method of bonding wires
JPS5691492A (en) Method of mounting lead wire
JPS5420022A (en) Bonding method
JPS5386455A (en) Method of connection for lead wire
JPS5457666A (en) Method of connecting lead wire
JPS549580A (en) Method of matching semiconductor wire bonds
JPS5265668A (en) Method of connecting multiistage wires
JPS53105972A (en) Method of presssbonding tape bonder without solder
JPS5445666A (en) Method of making special lead wire
JPS5421466A (en) Method of bonding two members
ZA772305B (en) Method of bonding
JPS5463181A (en) Method of bonding two part members
JPS5463906A (en) Method of bonding parts
JPS5396465A (en) Extending method of lead wires of wounddtype capacitor
JPS5416686A (en) Method of making electric wire
JPS5464819A (en) Method of connecting parapetto
JPS53100620A (en) Method of connecting hhbeam
JPS5265860A (en) Method of connecting lead wire