JPS549580A - Method of matching semiconductor wire bonds - Google Patents

Method of matching semiconductor wire bonds

Info

Publication number
JPS549580A
JPS549580A JP7452377A JP7452377A JPS549580A JP S549580 A JPS549580 A JP S549580A JP 7452377 A JP7452377 A JP 7452377A JP 7452377 A JP7452377 A JP 7452377A JP S549580 A JPS549580 A JP S549580A
Authority
JP
Japan
Prior art keywords
wire bonds
semiconductor wire
matching semiconductor
matching
bonds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7452377A
Other languages
Japanese (ja)
Inventor
Tomoji Konno
Kuniaki Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP7452377A priority Critical patent/JPS549580A/en
Publication of JPS549580A publication Critical patent/JPS549580A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Control Of Position Or Direction (AREA)
JP7452377A 1977-06-24 1977-06-24 Method of matching semiconductor wire bonds Pending JPS549580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7452377A JPS549580A (en) 1977-06-24 1977-06-24 Method of matching semiconductor wire bonds

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7452377A JPS549580A (en) 1977-06-24 1977-06-24 Method of matching semiconductor wire bonds

Publications (1)

Publication Number Publication Date
JPS549580A true JPS549580A (en) 1979-01-24

Family

ID=13549756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7452377A Pending JPS549580A (en) 1977-06-24 1977-06-24 Method of matching semiconductor wire bonds

Country Status (1)

Country Link
JP (1) JPS549580A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138908U (en) * 1983-03-08 1984-09-17 東北金属工業株式会社 Mark sense positioning device
JPS61102747A (en) * 1984-10-26 1986-05-21 Marine Instr Co Ltd Method of varying recognition pattern for wire bonder

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59138908U (en) * 1983-03-08 1984-09-17 東北金属工業株式会社 Mark sense positioning device
JPS61102747A (en) * 1984-10-26 1986-05-21 Marine Instr Co Ltd Method of varying recognition pattern for wire bonder
JPH0236066B2 (en) * 1984-10-26 1990-08-15 Kaijo Denki Kk

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