JPS5287362A - Lead wire for semiconductor device - Google Patents

Lead wire for semiconductor device

Info

Publication number
JPS5287362A
JPS5287362A JP421576A JP421576A JPS5287362A JP S5287362 A JPS5287362 A JP S5287362A JP 421576 A JP421576 A JP 421576A JP 421576 A JP421576 A JP 421576A JP S5287362 A JPS5287362 A JP S5287362A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead wire
lead
wire
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP421576A
Other languages
Japanese (ja)
Other versions
JPS5948545B2 (en
Inventor
Akira Shiraishi
Kenji Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP421576A priority Critical patent/JPS5948545B2/en
Publication of JPS5287362A publication Critical patent/JPS5287362A/en
Publication of JPS5948545B2 publication Critical patent/JPS5948545B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP421576A 1976-01-17 1976-01-17 Lead wires for semiconductor devices Expired JPS5948545B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP421576A JPS5948545B2 (en) 1976-01-17 1976-01-17 Lead wires for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP421576A JPS5948545B2 (en) 1976-01-17 1976-01-17 Lead wires for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5287362A true JPS5287362A (en) 1977-07-21
JPS5948545B2 JPS5948545B2 (en) 1984-11-27

Family

ID=11578385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP421576A Expired JPS5948545B2 (en) 1976-01-17 1976-01-17 Lead wires for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5948545B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH672379A5 (en) * 1986-10-08 1989-11-15 Hunkeler Ag Jos
WO2019065164A1 (en) 2017-09-26 2019-04-04 東レ株式会社 Polyimide precursor resin composition, polyimide resin composition, polyimide resin film, production method for layered product, production method for color filter, production method for liquid crystal element, and production method for organic el element

Also Published As

Publication number Publication date
JPS5948545B2 (en) 1984-11-27

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