JPS5618306A - Lead wire for semiconductor device - Google Patents

Lead wire for semiconductor device

Info

Publication number
JPS5618306A
JPS5618306A JP9465779A JP9465779A JPS5618306A JP S5618306 A JPS5618306 A JP S5618306A JP 9465779 A JP9465779 A JP 9465779A JP 9465779 A JP9465779 A JP 9465779A JP S5618306 A JPS5618306 A JP S5618306A
Authority
JP
Japan
Prior art keywords
semiconductor device
lead wire
lead
wire
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9465779A
Other languages
Japanese (ja)
Inventor
Hiroshi Ishibe
Nobuo Ogasa
Akira Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP9465779A priority Critical patent/JPS5618306A/en
Publication of JPS5618306A publication Critical patent/JPS5618306A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)
JP9465779A 1979-07-24 1979-07-24 Lead wire for semiconductor device Pending JPS5618306A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9465779A JPS5618306A (en) 1979-07-24 1979-07-24 Lead wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9465779A JPS5618306A (en) 1979-07-24 1979-07-24 Lead wire for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5618306A true JPS5618306A (en) 1981-02-21

Family

ID=14116317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9465779A Pending JPS5618306A (en) 1979-07-24 1979-07-24 Lead wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5618306A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103203447A (en) * 2013-04-19 2013-07-17 常熟市精工模具制造有限公司 Glass mould bottom casting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103203447A (en) * 2013-04-19 2013-07-17 常熟市精工模具制造有限公司 Glass mould bottom casting method

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