US3272625A - Beryllium-gold alloy and article made therefrom - Google Patents

Beryllium-gold alloy and article made therefrom Download PDF

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US3272625A
US3272625A US502763A US50276365A US3272625A US 3272625 A US3272625 A US 3272625A US 502763 A US502763 A US 502763A US 50276365 A US50276365 A US 50276365A US 3272625 A US3272625 A US 3272625A
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gold
beryllium
tensile strength
alloy
wire
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Brenner Bert
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01202—2N purity grades, i.e. 99%

Definitions

  • This invention relates to the art of alloys generally and, more particularly, to a beryllium-gold alloy having improved physical properties and to an article made of such alloy.
  • the alloy of this invention has wide application. It is especially useful in various branches of the electrical industry which employ gold in different forms, including fine wire, as the material of a variety of electrically conductive elements.
  • the alloy may, for example, be advantageously employed as the material of certain electrically conductive elements in semiconductor devices and in other instrumentalities which require that such elements comprise substantially pure gold, i.e. in the neighborhood of 99.99% gold.
  • gold is considered as being a ductile metal, this is true only in diameters of about 0.002 and greater. As is well knOWn in the art, it is very difficult and quite expensive to draw gold wires in diameters of 0.002 and smaller. One reason for this is that gold has low tensile strength and, as a consequence, unless great care is exercised, relatively fine diameter gold wire pulls apart in the dies instead of being properly drawn therethrough. Also, gold in smaller diameters self anneals at ordinary room temperatures. Such gold is, therefore, unstable and is extremely difiicult to draw.
  • a beryllium-gold alloy according to this invention affords a relatively high purity gold which is both ductile and stable and which may be formed more readily and economically into fine wire than gold that does not contain beryllium in the amounts indicated above and identified more particularly hereinafter.
  • Another object of this invention is to increase the tensile strength and improve the ductility of gold.
  • a further object of this invention is to provide an alloy, consisting essentially of a minute amount of beryllium and the balance gold, which alloy has improved physical properties, such as high tensile strength and better ductility, as compared to gold compositions which do not contain beryllium in such amount.
  • a still further object of the invention is to provide a beryllium-gold alloy which may be readily and economically produced, such as by drawing, into long lengths of relatively fine diameter wire.
  • beryllium as a hardening agent for certain metals, other than gold, is well known to the art.
  • the beryllium component usually constitutes several weight percent of the resultant alloy.
  • beryllium as a hardening agent for copper.
  • the amount of beryllium contained in commercial beryllium-copper alloys is usually in the range of from 2% to 2.5%.
  • the hardening effect of beryllium on copper is understood to be due to precipitation hardening. This hardening effect of beryllium on copper is largely latent and cannot be fully attained until the beryllium-copper alloy is subjected to elaborate heat treatment.
  • beryllium-gold alloys consisting essentially of beryllium in the amount of 0.001% to 0.1% by weight and the balance gold. Alloys consisting essentially of beryllium in an amount greater than about 0.1% and the balance gold are considered unsuitable as they tend to become brittle and cannot be readily drawn or otherwise formed into a fine wire having a diameter less than 0.002.
  • Preferred and recommended beryllium-gold alloys of this invention consist of beryllium in the amount of 0.0025% to 0.0075% by weight and the balance gold. These alloys permit the fabrication of fine, electrically conductive gold elements hardened with beryllium in a purity better than 99.99% gold which is the commercially accepted standard for pure gold elements in many electrical applications.
  • annealed gold has a tensile strength of approximately 17,200 pounds per square inch.
  • minute amounts of beryllium i.e. up to 0.1% beryllium, for a like amount of gold, the tensile strength of the resultant alloy is raised to approximately 28,000 pounds per square inch. This constitutes an increase of almost 63% in tensile strength.
  • a wire according to this invention consisting essentially of beryllium in the amount of about 0.001% to about 0.1% by weight and the balance gold has a tensile strength within the range of about 18,000 pounds per square inch and about 76,000 pounds per square inch. It will also be noted that such a wire, consisting essentially of beryllium in the amount of about 0.0025% to about 0.0075% by weight and the balance gold, has a tensile strength within the range of about 20,000 pounds per square inch to about 57,000 pounds per square inch.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Extraction Processes (AREA)

Description

B. BRENNER Sept. 13, 1966 BERYLLIUM-GOLD ALLOY AND ARTICLE MADE THEREFROM Filed Oct. 18, 1965 O m m w O L V 9 W H w W m o 1 M 8 W M o m 7 m w m w N N M M w m W w A O m J 4 mm 0 3 D? f W m m l m n w m w w a w M m x a a m m m m a 4 0 OOO mufi; IOZ MVEDGW Eun- WOZDOQ 7: Ikozwmkw w zmzmh R E N mm mm. WT R E B Y B BERYLLIUM CONTENT IN PARTS PER MILLION TIMES IO, BALANCE GOLD ATTORNEY United States Patent 3,272,625 BERYLLlUM-GOLD ALLOY AND ARTICLE MADE THEREFROM Bert Brenner, Tenafly, N.J., assignor to James Cohn, White Plains, N.Y., and Richard Cohn, Scarsdale, N.Y., jointly Filed Oct. 18, 1965, Ser. No. 502,763 2 Claims. (Cl. 75--165) This application is a continuation-in-part of my application Serial No. 283,455, filed May 27, 1963, now abandoned.
This invention relates to the art of alloys generally and, more particularly, to a beryllium-gold alloy having improved physical properties and to an article made of such alloy.
In the ensuing discussion and in the appended claims the term gold, unless otherwise qualified, is understood to mean gold of high commercial purity.
The alloy of this invention has wide application. It is especially useful in various branches of the electrical industry which employ gold in different forms, including fine wire, as the material of a variety of electrically conductive elements. The alloy may, for example, be advantageously employed as the material of certain electrically conductive elements in semiconductor devices and in other instrumentalities which require that such elements comprise substantially pure gold, i.e. in the neighborhood of 99.99% gold.
While gold is considered as being a ductile metal, this is true only in diameters of about 0.002 and greater. As is well knOWn in the art, it is very difficult and quite expensive to draw gold wires in diameters of 0.002 and smaller. One reason for this is that gold has low tensile strength and, as a consequence, unless great care is exercised, relatively fine diameter gold wire pulls apart in the dies instead of being properly drawn therethrough. Also, gold in smaller diameters self anneals at ordinary room temperatures. Such gold is, therefore, unstable and is extremely difiicult to draw.
Considerable research has been carried out in recent years with the view of explaining this undesirable characteristic of gold. It is now thought that lattice distortion due to dislocations, voids or other defects in the crystal lattice is the probable and likely cause for this undesirable characteristic of gold in fine wire form.
I have discovered that the addition of extremely small or minute amounts of beryllium to gold has the surprising, unexpected and highly desirable and beneficial effects of (1) increasing the tensile strength to a great extent, (2) substantially improving the ductility of gold in fine wire form and (3) rendering the gold stable. Hence, a beryllium-gold alloy according to this invention affords a relatively high purity gold which is both ductile and stable and which may be formed more readily and economically into fine wire than gold that does not contain beryllium in the amounts indicated above and identified more particularly hereinafter.
It is the primary object of this invention to provide substantially pure gold having improved properties.
Another object of this invention is to increase the tensile strength and improve the ductility of gold.
A further object of this invention is to provide an alloy, consisting essentially of a minute amount of beryllium and the balance gold, which alloy has improved physical properties, such as high tensile strength and better ductility, as compared to gold compositions which do not contain beryllium in such amount.
A still further object of the invention is to provide a beryllium-gold alloy which may be readily and economically produced, such as by drawing, into long lengths of relatively fine diameter wire.
3,272,625 Patented Sept. 13, 1966 The enumerated objects and additional objects, together with the advantages of the invention, will be readily comprehended by persons trained in the art from the detailed description that follows taken in conjunction with the annexed drawing which is a graph containing two curves that were obtained by plotting the tensile strength of annealed elements and hard drawn elements made of alloys according to this invention against the beryllium-gold content of such alloys.
Since it is well known that the tensile strength of a wire of any given alloy is affected by both the heat treatment of the final wire and the amount of working or drawing it has received, as well as by the composition of the alloy, it is understood that the two curves in the accompanying graph, marked A and B, represent the extremes which may be obtained for any given composition. In other words the area between curve A and curve B represents the characteristics of wire obtained by employing the present invention.
It is recognized that the use of beryllium as a hardening agent for certain metals, other than gold, is well known to the art. In such instances, the beryllium component usually constitutes several weight percent of the resultant alloy. For example, it has long been known to employ beryllium as a hardening agent for copper. The amount of beryllium contained in commercial beryllium-copper alloys is usually in the range of from 2% to 2.5%. The hardening effect of beryllium on copper is understood to be due to precipitation hardening. This hardening effect of beryllium on copper is largely latent and cannot be fully attained until the beryllium-copper alloy is subjected to elaborate heat treatment.
Attempts to increase the tensile strength of gold by the addition of several weight percent of beryllium, such as from 2% to 2.5%, the amount generally used on commercial beryllium-copper alloys, have all resulted in complete failure. Moreover, experimentation has demonstrated that alloys containing as little as 1% beryllium and the balance gold are undesirably brittle and are unsuited for the production of wire.
It has been ascertained that the objectives of this invention are successfully attained by beryllium-gold alloys consisting essentially of beryllium in the amount of 0.001% to 0.1% by weight and the balance gold. Alloys consisting essentially of beryllium in an amount greater than about 0.1% and the balance gold are considered unsuitable as they tend to become brittle and cannot be readily drawn or otherwise formed into a fine wire having a diameter less than 0.002.
Preferred and recommended beryllium-gold alloys of this invention consist of beryllium in the amount of 0.0025% to 0.0075% by weight and the balance gold. These alloys permit the fabrication of fine, electrically conductive gold elements hardened with beryllium in a purity better than 99.99% gold which is the commercially accepted standard for pure gold elements in many electrical applications.
It will be appreciated from an examination of the curves appearing on the graph that the addition of beryllium in the amounts specified above to gold greatly increases the tensile strength, whether elements made therefrom are annealed, as represented by curve A, or hard drawn, as represented by curve B, or whether they lie between these two extremes.
Referring first to curve A, it will be noted that annealed gold has a tensile strength of approximately 17,200 pounds per square inch. By substituting minute amounts of beryllium, i.e. up to 0.1% beryllium, for a like amount of gold, the tensile strength of the resultant alloy is raised to approximately 28,000 pounds per square inch. This constitutes an increase of almost 63% in tensile strength.
Referring now to curve B, it will be observed that hard drawn gold has a tensile strength of approximately 38,000 pounds per square inch. By again substituting up to 0.1% beryllium for a like amount of gold, the tensile strength of the resultant alloy is raised to approximately 76,000 pounds per square inch. This constitutes a 100% increase in tensile strength.
The same observations obviously apply to any intermediate tempers of the wire between the two extremes shown in curves A and B. The tensile strength range of any alloy within the composition limits, and also those of pure gold, can easily be read off from the graph.
It will be noted from the graph that a wire according to this invention and consisting essentially of beryllium in the amount of about 0.001% to about 0.1% by weight and the balance gold has a tensile strength within the range of about 18,000 pounds per square inch and about 76,000 pounds per square inch. It will also be noted that such a wire, consisting essentially of beryllium in the amount of about 0.0025% to about 0.0075% by weight and the balance gold, has a tensile strength within the range of about 20,000 pounds per square inch to about 57,000 pounds per square inch.
From the foregoing, it is believed that the objects,
advantages and utility of the present invention will be readily comprehended by persons skilled in the art without further description. It is to be clearly understood that all matter contained in the above description or shown in the drawing is to be interpreted as illustrative and not in a limiting sense.
Iclaim:
1. A wire having a diameter less than 0.002 inch and made of an alloy consisting essentially of beryllium in the amount of about 0.001% to about 0.1% by weight and the balance gold, said wire having a tensile strength within the range of about 18,000 pounds per square inch to about 76,000 pounds per square inch.
2. A wire having a diameter less than 0.002 inch and made of an alloy consisting essentially of beryllium in the amount of about 0.0025% to about 0.0075% by weight and the balance gold, said wire having a tensile strength within the range of about 20,000 pounds per square inch to about 57,000 pounds per square inch.
No references cited.
DAVID L. RECK, Primary Examiner.
C. N. LOVELL, Assistant Examiner.

Claims (1)

1. A WIRE HAVING A DIAMETER LESS THAN 0.002 INCH AND MADE OF AN ALLOY CONSISTING ESSENTIALLY OF BERYLLIUM IN THE AMOUNT OF ABOUT 0.001% TO ABOUT 0.1% BY WEIGHT AND THE BALANCE GOLD, SAID WIRE HAVING A TENSILE STRENGTH WITHIN THE RANGE OF ABOUT 18.000 POUNDS PER SQUARE INCH TO ABOUT 76,000 POUNDS PER SQUARE INCH.
US502763A 1965-10-18 1965-10-18 Beryllium-gold alloy and article made therefrom Expired - Lifetime US3272625A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112059A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS6030158A (en) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd Bonding wire
JPS6152961A (en) * 1984-08-22 1986-03-15 Sumitomo Electric Ind Ltd Production of gold alloy wire
DE3618560A1 (en) * 1985-10-01 1987-04-02 Tanaka Electronics Ind GOLD LEAD FOR CONNECTING SEMICONDUCTOR ELEMENTS
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
EP0685565A1 (en) * 1993-09-06 1995-12-06 Mitsubishi Materials Corporation Golden ornament material hardened by alloying with minor components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53112059A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor
JPS5826662B2 (en) * 1977-03-11 1983-06-04 田中電子工業株式会社 Gold wire for bonding semiconductor devices
JPS6030158A (en) * 1983-07-29 1985-02-15 Sumitomo Metal Mining Co Ltd Bonding wire
JPH0245336B2 (en) * 1983-07-29 1990-10-09 Sumitomo Metal Mining Co
JPS6152961A (en) * 1984-08-22 1986-03-15 Sumitomo Electric Ind Ltd Production of gold alloy wire
DE3618560A1 (en) * 1985-10-01 1987-04-02 Tanaka Electronics Ind GOLD LEAD FOR CONNECTING SEMICONDUCTOR ELEMENTS
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
EP0685565A1 (en) * 1993-09-06 1995-12-06 Mitsubishi Materials Corporation Golden ornament material hardened by alloying with minor components
EP0685565A4 (en) * 1993-09-06 1996-01-24 Mitsubishi Materials Corp Golden ornament material hardened by alloying with minor components.

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