JPS6152961A - Manufacturing method of gold alloy wire - Google Patents
Manufacturing method of gold alloy wireInfo
- Publication number
- JPS6152961A JPS6152961A JP59174368A JP17436884A JPS6152961A JP S6152961 A JPS6152961 A JP S6152961A JP 59174368 A JP59174368 A JP 59174368A JP 17436884 A JP17436884 A JP 17436884A JP S6152961 A JPS6152961 A JP S6152961A
- Authority
- JP
- Japan
- Prior art keywords
- gold alloy
- alloy wire
- manufacturing
- wire
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001020 Au alloy Inorganic materials 0.000 title claims description 30
- 239000003353 gold alloy Substances 0.000 title claims description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052745 lead Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 230000001112 coagulating effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/005—Continuous casting of metals, i.e. casting in indefinite lengths of wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Continuous Casting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
発明の分野
この発明は、たとえば耐食ろう付線、半導体配線用導体
および装飾用細線などの細物金合金線の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing thin gold alloy wires, such as corrosion-resistant brazing wires, conductors for semiconductor wiring, and fine decorative wires.
先行技術の説明
金線もしくは金合金線は耐食ろう付線、半導体素子の配
線用導体、あるいは装飾用細線として用いられたりする
が、このような場合に細線であることを求められること
も多い。Description of Prior Art Gold wire or gold alloy wire is used as a corrosion-resistant brazing wire, a wiring conductor for semiconductor devices, or a fine wire for decoration, and in such cases, the wire is often required to be thin.
通常金属細線を製造するには溶解、鋳造、熱間加工、冷
間伸線加工とその間多くの場合、表面切削や皮剥や熱処
理などの工程を経て作製される。Normally, thin metal wires are produced through melting, casting, hot working, cold wire drawing, and in many cases, processes such as surface cutting, peeling, and heat treatment.
金や金合金はきわめて高価なため上述のような多工程で
は工程中の試料ロスが伴ない、加工コストが高くつくと
いった問題を有していた。このように従来の絹物導体の
製造方法は、煩雑な工程を経るものであるため製品の歩
留りが低く、かつ、大がかりな設備を必要とすることな
どの他、様々な欠点を有するものであった。Since gold and gold alloys are extremely expensive, the multi-step process described above has the problem of sample loss during the process and high processing costs. As described above, conventional silk conductor manufacturing methods have various drawbacks, such as low product yields due to complicated processes and the need for large-scale equipment. Ta.
他方、鉛などの低融点金属からなる九線製造方法として
、溶融材料を訓いジェット流として液体中に噴出させて
丸線を得る方法が知られている。On the other hand, as a method for producing nine wires made of a low melting point metal such as lead, a method is known in which a round wire is obtained by ejecting a molten material into a liquid as a jet stream.
しかしながら、溶融金合金は金属流の安定性に乏しく、
そのため溶融金属から細物導体を直接製線することは極
めて困難で、よく直接製線できても、短尺であったり、
表面形状が平滑でなかったりする。However, molten gold alloys have poor metal flow stability;
For this reason, it is extremely difficult to make thin conductors directly from molten metal, and even if wires can be made directly, they may be short or short.
The surface shape may not be smooth.
発明の目的
それゆえに、この発明の目的は、金合金溶融物から細物
金合金線を安価に直接製線し得る方法を提供することに
ある。OBJECTS OF THE INVENTION Therefore, an object of the present invention is to provide a method for directly producing thin gold alloy wire from a molten gold alloy at low cost.
発明の構成
この発明は、０．００１〜１重量％のＢｅが添加された
金合金溶融物を細孔またはスリットより噴出させて流体
中にて凝固させることを特徴とする細物金合金線の製造
方法である。ｒＢｅ が添加された金合金溶融物」を
用いることにより、溶融物の粘性、表面張力および表面
酸化状態、またノズルとのぬれ性にも微妙な変化が生じ
、そのため金合金溶融物のジェット流が安定する。この
発明は、この知見に基づくものである。Structure of the Invention The present invention provides a thin gold alloy wire characterized in that a molten gold alloy to which 0.001 to 1% by weight of Be is added is ejected from a pore or slit and solidified in a fluid. This is the manufacturing method. By using a gold alloy melt containing rBe, subtle changes occur in the viscosity, surface tension, and surface oxidation state of the melt, as well as its wettability with the nozzle, and as a result, the jet flow of the gold alloy melt Stabilize. This invention is based on this knowledge.
ｒｏ、ｏｏ１〜１重量％」とした理由は、０．００１重
量％以下では金合金溶融物が粒子状となりやすく、連続
的かつ均一な線を得ることが困難だからであり、他方１
重量％以上の濃度では溶融流安定効果が飽和するのに対
してＢｅ 含有率の上昇による特性変化や均一性の保
証などが問題となるからである。The reason why it is set as 1 to 1% by weight is that if it is less than 0.001% by weight, the gold alloy melt tends to become particulate and it is difficult to obtain a continuous and uniform line.
This is because when the concentration exceeds % by weight, the effect of stabilizing the melt flow is saturated, whereas an increase in the Be content causes problems such as changes in characteristics and ensuring uniformity.
また、用途により、Ｓｉ、 Ｃｕ、 Ｓｎ、 Ｚｎ、
Ｉｎ、 Ａｇ。Also, depending on the application, Si, Cu, Sn, Zn,
In, Ag.
Ｇｅ、 Ｇａ、 ｋｌ、 Ｐｄ、 Ｐｔ、 Ｐｂ、 Ｍ
ｇ、 Ｆｅ、 Ｎｉ、 Ｃｏ、 Ｃａ。Ge, Ga, kl, Pd, Pt, Pb, M
g, Fe, Ni, Co, Ca.
Ｂ、 Ｂｉ、 Ｐ などからなる群から選択される一
種以上の元素が多くとも５０重量％含有された金合金溶
融物が用いられる。これにより様々な強度および融点の
細物会合金線を得ることができる。A gold alloy melt containing at most 50% by weight of one or more elements selected from the group consisting of B, Bi, P, etc. is used. This makes it possible to obtain fine aggregated gold wires of various strengths and melting points.
「細孔またはスリットより噴出させて流体中にて凝固さ
せる」方法については、回転水中紡糸法、流水凝固装置
得る。なお、「流体」としては、水に限られず様々な流
体を使用し得る。For the method of "coagulating in a fluid by ejecting it from a pore or slit", a rotating underwater spinning method and a flowing water coagulating device are used. Note that the "fluid" is not limited to water, and various fluids can be used.
流体中で凝固させな後、平均減面率５％以上の冷間加工
が施されてもよい。断面の均一化、強度の向上および軟
化後の柔軟性の向上が果たし得るからである。After solidifying in a fluid, cold working with an average reduction in area of 5% or more may be performed. This is because the cross section can be made uniform, the strength can be improved, and the flexibility after softening can be improved.
この発明のその他の特徴は、図面を参照して行なう以下
の実施例についての説明゛により一層明らかとなろう。Other features of the invention will become clearer from the following description of embodiments with reference to the drawings.
実施例の説明
実施例１゜
第１図および第２図に正面図および側面図で示す回転水
中紡糸装置の黒鉛るつぼ１内で、０．２重量％のＢｅ
を含有するＡｕ−Ｂｅ合金を溶解した。この溶解は、
黒鉛るつぼｌの周囲に配置されたヒータ２の加熱により
行った。次に、黒鉛るつぼ１の上方からＸ方向にＡｒ
ガスを黒鉛るつぼ１内に導入し、その圧力によりＡｕ
−Ｂｅ溶融物を回転ドラム８の内周−面に形成された厚
さ１５飢の回転水中に、黒鉛るつぼ１の底部の丸孔から
噴出させた。これＫより、断面形状が円形で表面の形状
が滑らかな直径０．２皿の金合金線４が得られた。なお
比較のため同一方法により純度９９．９９％の純金を溶
融きせ噴出させたが、球状の粒子となり、長尺体が得ら
れなかった。DESCRIPTION OF EXAMPLES Example 1 0.2% by weight of Be
An Au-Be alloy containing . This dissolution is
Heating was performed using a heater 2 placed around the graphite crucible 1. Next, Ar is applied in the X direction from above the graphite crucible 1.
Gas is introduced into the graphite crucible 1, and the pressure causes the Au
The -Be melt was jetted out from a round hole at the bottom of the graphite crucible 1 into rotating water having a thickness of 15 mm formed on the inner peripheral surface of the rotating drum 8. From this K, a gold alloy wire 4 having a circular cross-sectional shape and a smooth surface having a diameter of 0.2 disks was obtained. For comparison, pure gold with a purity of 99.99% was melted and ejected using the same method, but the resulting particles were spherical and no elongated bodies were obtained.
実施例２゜
実施例１と同一の方法で直径０．１５Ｍの、Ａｕ に
ＣｕｌＯ％、Ｓｎ ５％、Ｚｎ０．３％、Ｉｎ １％、
Ａｇ ５％、Ｂｅ０．４％を添加した組成の金合金線を
得た。次に、トンネル炉内で連続的に焼鈍させた後、直
径０．０３肌まで伸線した。このとき表面が平滑なため
伸ａと加工性は良好であり、かつ高い生産性を示した。Example 2゜By the same method as in Example 1, a diameter of 0.15M was made of Au with CuO%, Sn 5%, Zn 0.3%, In 1%,
A gold alloy wire having a composition containing 5% Ag and 0.4% Be was obtained. Next, the wire was continuously annealed in a tunnel furnace and then drawn to a diameter of 0.03 skin. At this time, since the surface was smooth, elongation and workability were good, and high productivity was exhibited.
実施例３゜
不純物として、Ｓｉ、 Ｇｅ、 Ｇａ、 ＡＩ！、Ｐｄ
、 Ｐｔ、 Ｐｂ。Example 3゜Si, Ge, Ga, AI! as impurities! , Pd
, Pt, Pb.
Ｍｇ、 Ｆｅ、 Ｎｉ、 Ｃｏ、 Ｃａ、 Ｂ、 Ｂｉ
、 Ｐをそれぞれ０．０５〜２％の範囲で合計２０％含
有し、０．５重量％のＢｅを含有するＡｕ−Ｂｅ系合金
を、第３図に正面断面図で示す流水凝固装置により、実
施例１と同様に直径０．２ｒｕＩＬの金合金線に直接凝
固させた。なお、第３図において、ｌは黒鉛るつぼ、２
はヒータを示し、黒鉛るつぼ１の下方には流水供給用の
クンク５が配置されている。金合金の凝固は、黒鉛るつ
ぼ１の上方から矢印Ｘ方向にＡｒガスを導入し、その圧
力により黒鉛るつぼｌの底部から銀合金溶融物を噴出さ
せ、タンク５から流れ落ちる流水中に接触させることに
より行った。Mg, Fe, Ni, Co, Ca, B, Bi
, P in a total range of 0.05 to 2%, and a total of 20%, and 0.5% by weight of Be. As in Example 1, it was directly solidified into a gold alloy wire with a diameter of 0.2 ruIL. In addition, in Fig. 3, l is a graphite crucible, and 2
indicates a heater, and a sink 5 for supplying running water is arranged below the graphite crucible 1. The gold alloy is solidified by introducing Ar gas from above the graphite crucible 1 in the direction of the arrow X, and using the pressure, the molten silver alloy is ejected from the bottom of the graphite crucible 1 and brought into contact with the flowing water flowing down from the tank 5. went.
発明の効果
以上のように、この発明によ゛れば、０．００１〜１重
量％のＢｅ が添加された金合金溶融物を用いることよ
り、金合金溶融物のジェット流を安定化することができ
、そのため金合金溶融物から細物金合金線を直接製線す
ることができる。したがって製造工程を大幅に簡略化す
ることができ、かつ、中間の熱処理工程をも著しく低減
し得るので、歩留りを飛躍的に向上することができると
ともに、エネルギー消費も極めて少なくし得る。Effects of the Invention As described above, according to the present invention, by using the gold alloy melt to which 0.001 to 1% by weight of Be is added, the jet flow of the gold alloy melt can be stabilized. Therefore, thin gold alloy wire can be made directly from the gold alloy melt. Therefore, the manufacturing process can be greatly simplified, and the intermediate heat treatment process can also be significantly reduced, so that the yield can be dramatically improved and energy consumption can be extremely reduced.
この発明は、耐食ろう付線、半導体配線用導体、装飾用
細線などの各種金合金細物材料に利用することができる
。The present invention can be used for various gold alloy thin materials such as corrosion-resistant brazed wires, semiconductor wiring conductors, and decorative thin wires.
第１図および第２図はこの発明を実施するための装置の
一例を示す正面断面図および側面断面図である。第８図
は、この発明を実施するための装置の他の例を示す正面
断面図である。
図において、４・は細線としての金合金線を示す。
セ１０
子３図
−Ｋ）２図
クン７FIGS. 1 and 2 are a front sectional view and a side sectional view showing an example of an apparatus for carrying out the present invention. FIG. 8 is a front sectional view showing another example of the apparatus for carrying out the invention. In the figure, 4 indicates a gold alloy wire as a thin wire. Se10 Child 3 Figure-K) 2 Figure Kun 7
Claims (3)
溶融物を細孔またはスリットより噴出させて流体中にて
凝固させることを特徴とする金合金線の製造方法。(1) A method for producing a gold alloy wire, which comprises ejecting a molten gold alloy to which 0.001 to 1% by weight of Be has been added through pores or slits and solidifying it in a fluid.
、Ｉｎ、Ａｇ、Ｇｅ、Ｇａ、Ａｌ、Ｐｄ、Ｐｔ、Ｐｂ、
Ｍｇ、Ｆｅ、Ｎｉ、Ｃｏ、Ｃａ、Ｂ、Ｂｉ、Ｐ、などか
らなる群から選択される一種以上の元素が多くとも５０
重量％含有されているものを用いる、特許請求の範囲第
（１）項記載の金合金線の製造方法。(2) Si, Cu, Sn, Zn as the gold alloy melt
, In, Ag, Ge, Ga, Al, Pd, Pt, Pb,
At most 50 elements selected from the group consisting of Mg, Fe, Ni, Co, Ca, B, Bi, P, etc.
A method for manufacturing a gold alloy wire according to claim (1), which uses a gold alloy wire containing % by weight.
心力で固定された液体流体中に金合金溶融物を細孔また
はスリットより噴出させて凝固させることを特徴とする
特許請求の範囲第（１）項または第（２）項の金合金線
の製造方法。(3) Claims characterized in that the method of solidifying in the fluid comprises ejecting the molten gold alloy from pores or slits into the liquid fluid fixed by centrifugal force inside a rotating body and solidifying it. The method for producing a gold alloy wire according to item (1) or item (2).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59174368A JPS6152961A (en) | 1984-08-22 | 1984-08-22 | Manufacturing method of gold alloy wire |
| US06/898,835 US4702302A (en) | 1983-02-23 | 1986-08-20 | Method of making thin alloy wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59174368A JPS6152961A (en) | 1984-08-22 | 1984-08-22 | Manufacturing method of gold alloy wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6152961A true JPS6152961A (en) | 1986-03-15 |
Family
ID=15977392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59174368A Pending JPS6152961A (en) | 1983-02-23 | 1984-08-22 | Manufacturing method of gold alloy wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6152961A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6159420A (en) * | 1996-05-28 | 2000-12-12 | Tanaka Denshi Kogyo K.K. | Gold alloy wire and method for making a bump |
| JP2011143455A (en) * | 2010-01-15 | 2011-07-28 | Toyota Motor Corp | Method and device of manufacturing magnet material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3272625A (en) * | 1965-10-18 | 1966-09-13 | James Cohn | Beryllium-gold alloy and article made therefrom |
| JPS5564948A (en) * | 1978-11-10 | 1980-05-16 | Itsuo Onaka | Production of fine metal wire |
-
1984
- 1984-08-22 JP JP59174368A patent/JPS6152961A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3272625A (en) * | 1965-10-18 | 1966-09-13 | James Cohn | Beryllium-gold alloy and article made therefrom |
| JPS5564948A (en) * | 1978-11-10 | 1980-05-16 | Itsuo Onaka | Production of fine metal wire |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6159420A (en) * | 1996-05-28 | 2000-12-12 | Tanaka Denshi Kogyo K.K. | Gold alloy wire and method for making a bump |
| US6213382B1 (en) | 1996-05-28 | 2001-04-10 | Tanaka Denshi Kogyo K.K. | Method for making a bump |
| JP2011143455A (en) * | 2010-01-15 | 2011-07-28 | Toyota Motor Corp | Method and device of manufacturing magnet material |
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