JPS5446474A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS5446474A
JPS5446474A JP11291077A JP11291077A JPS5446474A JP S5446474 A JPS5446474 A JP S5446474A JP 11291077 A JP11291077 A JP 11291077A JP 11291077 A JP11291077 A JP 11291077A JP S5446474 A JPS5446474 A JP S5446474A
Authority
JP
Japan
Prior art keywords
semiconductor package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11291077A
Other languages
Japanese (ja)
Other versions
JPS5733701B2 (en
Inventor
Masayoshi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP11291077A priority Critical patent/JPS5446474A/en
Publication of JPS5446474A publication Critical patent/JPS5446474A/en
Publication of JPS5733701B2 publication Critical patent/JPS5733701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
JP11291077A 1977-09-20 1977-09-20 Semiconductor package Granted JPS5446474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11291077A JPS5446474A (en) 1977-09-20 1977-09-20 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11291077A JPS5446474A (en) 1977-09-20 1977-09-20 Semiconductor package

Publications (2)

Publication Number Publication Date
JPS5446474A true JPS5446474A (en) 1979-04-12
JPS5733701B2 JPS5733701B2 (en) 1982-07-19

Family

ID=14598541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11291077A Granted JPS5446474A (en) 1977-09-20 1977-09-20 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS5446474A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122459U (en) * 1982-02-15 1983-08-20 株式会社東芝 Semiconductor device envelope
JPS62290158A (en) * 1986-06-09 1987-12-17 Ngk Spark Plug Co Ltd Junction structure of ceramic of loading section of semiconductor element
JPS6473750A (en) * 1987-09-16 1989-03-20 Nec Corp Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039066A (en) * 1973-08-08 1975-04-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039066A (en) * 1973-08-08 1975-04-10

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122459U (en) * 1982-02-15 1983-08-20 株式会社東芝 Semiconductor device envelope
JPS6336687Y2 (en) * 1982-02-15 1988-09-28
JPS62290158A (en) * 1986-06-09 1987-12-17 Ngk Spark Plug Co Ltd Junction structure of ceramic of loading section of semiconductor element
JPH0548953B2 (en) * 1986-06-09 1993-07-22 Ngk Spark Plug Co
JPS6473750A (en) * 1987-09-16 1989-03-20 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS5733701B2 (en) 1982-07-19

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