JPS5446474A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPS5446474A JPS5446474A JP11291077A JP11291077A JPS5446474A JP S5446474 A JPS5446474 A JP S5446474A JP 11291077 A JP11291077 A JP 11291077A JP 11291077 A JP11291077 A JP 11291077A JP S5446474 A JPS5446474 A JP S5446474A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- package
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11291077A JPS5446474A (en) | 1977-09-20 | 1977-09-20 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11291077A JPS5446474A (en) | 1977-09-20 | 1977-09-20 | Semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5446474A true JPS5446474A (en) | 1979-04-12 |
JPS5733701B2 JPS5733701B2 (en) | 1982-07-19 |
Family
ID=14598541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11291077A Granted JPS5446474A (en) | 1977-09-20 | 1977-09-20 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5446474A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122459U (en) * | 1982-02-15 | 1983-08-20 | 株式会社東芝 | Semiconductor device envelope |
JPS62290158A (en) * | 1986-06-09 | 1987-12-17 | Ngk Spark Plug Co Ltd | Junction structure of ceramic of loading section of semiconductor element |
JPS6473750A (en) * | 1987-09-16 | 1989-03-20 | Nec Corp | Semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039066A (en) * | 1973-08-08 | 1975-04-10 |
-
1977
- 1977-09-20 JP JP11291077A patent/JPS5446474A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5039066A (en) * | 1973-08-08 | 1975-04-10 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122459U (en) * | 1982-02-15 | 1983-08-20 | 株式会社東芝 | Semiconductor device envelope |
JPS6336687Y2 (en) * | 1982-02-15 | 1988-09-28 | ||
JPS62290158A (en) * | 1986-06-09 | 1987-12-17 | Ngk Spark Plug Co Ltd | Junction structure of ceramic of loading section of semiconductor element |
JPH0548953B2 (en) * | 1986-06-09 | 1993-07-22 | Ngk Spark Plug Co | |
JPS6473750A (en) * | 1987-09-16 | 1989-03-20 | Nec Corp | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5733701B2 (en) | 1982-07-19 |
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