JPS5460581A - Semiconductor - Google Patents

Semiconductor

Info

Publication number
JPS5460581A
JPS5460581A JP11993678A JP11993678A JPS5460581A JP S5460581 A JPS5460581 A JP S5460581A JP 11993678 A JP11993678 A JP 11993678A JP 11993678 A JP11993678 A JP 11993678A JP S5460581 A JPS5460581 A JP S5460581A
Authority
JP
Japan
Prior art keywords
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11993678A
Other languages
Japanese (ja)
Other versions
JPS5812742B2 (en
Inventor
Mushie Mishieru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR7729477A external-priority patent/FR2404922A1/en
Priority claimed from FR7810208A external-priority patent/FR2422224A1/en
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS5460581A publication Critical patent/JPS5460581A/en
Publication of JPS5812742B2 publication Critical patent/JPS5812742B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/102—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
    • H01L27/1021—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components including diodes only
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0688—Integrated circuits having a three-dimensional layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/926—Elongated lead extending axially through another elongated lead
JP53119936A 1977-09-30 1978-09-30 semiconductor equipment Expired JPS5812742B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7729477A FR2404922A1 (en) 1977-09-30 1977-09-30 PROM cells with diodes and fuses - has PN junction diode and electrically destructible element to re-form broken junction or open new junction
FR7810208A FR2422224A1 (en) 1978-04-06 1978-04-06 PROM cells with diodes and fuses - has PN junction diode and electrically destructible element to re-form broken junction or open new junction

Publications (2)

Publication Number Publication Date
JPS5460581A true JPS5460581A (en) 1979-05-16
JPS5812742B2 JPS5812742B2 (en) 1983-03-10

Family

ID=26220243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53119936A Expired JPS5812742B2 (en) 1977-09-30 1978-09-30 semiconductor equipment

Country Status (5)

Country Link
US (1) US4494135A (en)
JP (1) JPS5812742B2 (en)
CA (1) CA1135854A (en)
DE (1) DE2841467C2 (en)
GB (1) GB2005078B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763854A (en) * 1980-10-07 1982-04-17 Toshiba Corp Semiconductor device
JPS57186295A (en) * 1981-02-23 1982-11-16 Burroughs Corp Mask type programmable read only memory to be stacked on semiconductor substrate
JPS5831569A (en) * 1981-08-03 1983-02-24 テキサス・インスツルメンツ・インコ−ポレイテツド Semiconductor rom array and method of producing same
JPS5961061A (en) * 1982-09-30 1984-04-07 Fujitsu Ltd Manufacture of semiconductor device
JPH02252187A (en) * 1989-03-24 1990-10-09 Norio Akamatsu Storing method and storage device to execute storage according to storing method

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FR2490860B1 (en) * 1980-09-24 1986-11-28 Nippon Telegraph & Telephone PROGRAMMABLE STORAGE SEMICONDUCTOR WITH ONLY READING, OF SHORT-JUNCTION TYPE
DE3150164A1 (en) * 1980-12-29 1982-08-12 Naamloze Vennootschap Philips' Gloeilampenfabrieken, 5621 Eindhoven PROGRAMMABLE FIXED VALUE STORAGE AND STORAGE CELL FOR USE IN SUCH A STORAGE
JPS5846174B2 (en) * 1981-03-03 1983-10-14 株式会社東芝 semiconductor integrated circuit
DK306081A (en) * 1981-07-10 1983-03-14 Gnt Automatic As FLOOR-BASED DIGITAL INFORMATION STORAGE AND PROCEDURES FOR READING AND CODING THE SAME
US4518981A (en) * 1981-11-12 1985-05-21 Advanced Micro Devices, Inc. Merged platinum silicide fuse and Schottky diode and method of manufacture thereof
US4562639A (en) * 1982-03-23 1986-01-07 Texas Instruments Incorporated Process for making avalanche fuse element with isolated emitter
JPS58188155A (en) * 1982-04-27 1983-11-02 Seiko Epson Corp Double layered rom integrated circuit
DK143783A (en) * 1982-06-17 1983-12-18 Gnt Automatic As DATA STORAGE
JPS59214239A (en) * 1983-05-16 1984-12-04 Fujitsu Ltd Manufacture of semiconductor device
US4616404A (en) * 1984-11-30 1986-10-14 Advanced Micro Devices, Inc. Method of making improved lateral polysilicon diode by treating plasma etched sidewalls to remove defects
JPS6228929U (en) * 1985-08-05 1987-02-21
US5266829A (en) * 1986-05-09 1993-11-30 Actel Corporation Electrically-programmable low-impedance anti-fuse element
US4823181A (en) * 1986-05-09 1989-04-18 Actel Corporation Programmable low impedance anti-fuse element
US4899205A (en) * 1986-05-09 1990-02-06 Actel Corporation Electrically-programmable low-impedance anti-fuse element
US4881114A (en) * 1986-05-16 1989-11-14 Actel Corporation Selectively formable vertical diode circuit element
US4876220A (en) * 1986-05-16 1989-10-24 Actel Corporation Method of making programmable low impedance interconnect diode element
US5367208A (en) * 1986-09-19 1994-11-22 Actel Corporation Reconfigurable programmable interconnect architecture
US5311039A (en) * 1990-04-24 1994-05-10 Seiko Epson Corporation PROM and ROM memory cells
US5648661A (en) * 1992-07-02 1997-07-15 Lsi Logic Corporation Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies
US5672905A (en) * 1992-08-26 1997-09-30 At&T Global Information Solutions Company Semiconductor fuse and method
US5963825A (en) * 1992-08-26 1999-10-05 Hyundai Electronics America Method of fabrication of semiconductor fuse with polysilicon plate
US6337507B1 (en) 1995-09-29 2002-01-08 Intel Corporation Silicide agglomeration fuse device with notches to enhance programmability
US5708291A (en) * 1995-09-29 1998-01-13 Intel Corporation Silicide agglomeration fuse device
DE19638666C1 (en) * 1996-01-08 1997-11-20 Siemens Ag Fuse with a protective layer in an integrated semiconductor circuit and associated manufacturing process
US5909049A (en) * 1997-02-11 1999-06-01 Actel Corporation Antifuse programmed PROM cell
US5949127A (en) 1997-06-06 1999-09-07 Integrated Device Technology, Inc. Electrically programmable interlevel fusible link for integrated circuits
US6385074B1 (en) 1998-11-16 2002-05-07 Matrix Semiconductor, Inc. Integrated circuit structure including three-dimensional memory array
US6351406B1 (en) 1998-11-16 2002-02-26 Matrix Semiconductor, Inc. Vertically stacked field programmable nonvolatile memory and method of fabrication
US6034882A (en) * 1998-11-16 2000-03-07 Matrix Semiconductor, Inc. Vertically stacked field programmable nonvolatile memory and method of fabrication
US6483736B2 (en) * 1998-11-16 2002-11-19 Matrix Semiconductor, Inc. Vertically stacked field programmable nonvolatile memory and method of fabrication
US6323534B1 (en) 1999-04-16 2001-11-27 Micron Technology, Inc. Fuse for use in a semiconductor device
US6791157B1 (en) * 2000-01-18 2004-09-14 Advanced Micro Devices, Inc. Integrated circuit package incorporating programmable elements
US6631085B2 (en) * 2000-04-28 2003-10-07 Matrix Semiconductor, Inc. Three-dimensional memory array incorporating serial chain diode stack
US6888750B2 (en) * 2000-04-28 2005-05-03 Matrix Semiconductor, Inc. Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication
US8575719B2 (en) 2000-04-28 2013-11-05 Sandisk 3D Llc Silicon nitride antifuse for use in diode-antifuse memory arrays
US6323535B1 (en) * 2000-06-16 2001-11-27 Infineon Technologies North America Corp. Electrical fuses employing reverse biasing to enhance programming
US6624011B1 (en) 2000-08-14 2003-09-23 Matrix Semiconductor, Inc. Thermal processing for three dimensional circuits
CN101179079B (en) 2000-08-14 2010-11-03 矩阵半导体公司 Rail stack array of charge storage devices and method of making same
US6580124B1 (en) 2000-08-14 2003-06-17 Matrix Semiconductor Inc. Multigate semiconductor device with vertical channel current and method of fabrication
US6661730B1 (en) 2000-12-22 2003-12-09 Matrix Semiconductor, Inc. Partial selection of passive element memory cell sub-arrays for write operation
US6627530B2 (en) 2000-12-22 2003-09-30 Matrix Semiconductor, Inc. Patterning three dimensional structures
US6545898B1 (en) 2001-03-21 2003-04-08 Silicon Valley Bank Method and apparatus for writing memory arrays using external source of high programming voltage
US6897514B2 (en) * 2001-03-28 2005-05-24 Matrix Semiconductor, Inc. Two mask floating gate EEPROM and method of making
US6593624B2 (en) 2001-09-25 2003-07-15 Matrix Semiconductor, Inc. Thin film transistors with vertically offset drain regions
US6525953B1 (en) 2001-08-13 2003-02-25 Matrix Semiconductor, Inc. Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication
US6841813B2 (en) * 2001-08-13 2005-01-11 Matrix Semiconductor, Inc. TFT mask ROM and method for making same
US6624485B2 (en) 2001-11-05 2003-09-23 Matrix Semiconductor, Inc. Three-dimensional, mask-programmed read only memory
US6853049B2 (en) 2002-03-13 2005-02-08 Matrix Semiconductor, Inc. Silicide-silicon oxide-semiconductor antifuse device and method of making
US6813182B2 (en) * 2002-05-31 2004-11-02 Hewlett-Packard Development Company, L.P. Diode-and-fuse memory elements for a write-once memory comprising an anisotropic semiconductor sheet
US6737675B2 (en) 2002-06-27 2004-05-18 Matrix Semiconductor, Inc. High density 3D rail stack arrays
US6661330B1 (en) * 2002-07-23 2003-12-09 Texas Instruments Incorporated Electrical fuse for semiconductor integrated circuits
US20070164388A1 (en) * 2002-12-19 2007-07-19 Sandisk 3D Llc Memory cell comprising a diode fabricated in a low resistivity, programmed state
US20060249753A1 (en) * 2005-05-09 2006-11-09 Matrix Semiconductor, Inc. High-density nonvolatile memory array fabricated at low temperature comprising semiconductor diodes
US7177183B2 (en) 2003-09-30 2007-02-13 Sandisk 3D Llc Multiple twin cell non-volatile memory array and logic block structure and method therefor
US7145255B2 (en) * 2004-08-26 2006-12-05 Micrel, Incorporated Lateral programmable polysilicon structure incorporating polysilicon blocking diode
US20060067117A1 (en) * 2004-09-29 2006-03-30 Matrix Semiconductor, Inc. Fuse memory cell comprising a diode, the diode serving as the fuse element
US7486534B2 (en) * 2005-12-08 2009-02-03 Macronix International Co., Ltd. Diode-less array for one-time programmable memory
KR101166834B1 (en) * 2007-06-20 2012-07-19 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 An electronic component, and a method of manufacturing an electronic component
US7619295B2 (en) * 2007-10-10 2009-11-17 Fairchild Semiconductor Corporation Pinched poly fuse
KR101446332B1 (en) * 2008-03-04 2014-10-08 삼성전자주식회사 Multi bit OTP(One Time Programmable) memory device using multi plug and methods of manufacturing and operating the same
US20090272958A1 (en) * 2008-05-02 2009-11-05 Klaus-Dieter Ufert Resistive Memory
US20100283053A1 (en) * 2009-05-11 2010-11-11 Sandisk 3D Llc Nonvolatile memory array comprising silicon-based diodes fabricated at low temperature
WO2011023922A1 (en) * 2009-08-28 2011-03-03 X-Fab Semiconductor Foundries Ag Improved pn junctions and methods
GB0915501D0 (en) * 2009-09-04 2009-10-07 Univ Warwick Organic photosensitive optoelectronic devices
JP2011216240A (en) * 2010-03-31 2011-10-27 Oki Semiconductor Co Ltd Current fuse, semiconductor device, and method of blowing the current fuse
KR20120139361A (en) * 2011-06-17 2012-12-27 삼성전자주식회사 E-fuse structure and method of operating the same
US9627395B2 (en) 2015-02-11 2017-04-18 Sandisk Technologies Llc Enhanced channel mobility three-dimensional memory structure and method of making thereof
US9478495B1 (en) 2015-10-26 2016-10-25 Sandisk Technologies Llc Three dimensional memory device containing aluminum source contact via structure and method of making thereof

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763854A (en) * 1980-10-07 1982-04-17 Toshiba Corp Semiconductor device
JPS57186295A (en) * 1981-02-23 1982-11-16 Burroughs Corp Mask type programmable read only memory to be stacked on semiconductor substrate
JPH0320904B2 (en) * 1981-02-23 1991-03-20 Unisys Corp
JPS5831569A (en) * 1981-08-03 1983-02-24 テキサス・インスツルメンツ・インコ−ポレイテツド Semiconductor rom array and method of producing same
JPH01138747A (en) * 1981-08-03 1989-05-31 Texas Instr Inc <Ti> Polycrystalline semiconductor lateral diode
JPH0436466B2 (en) * 1981-08-03 1992-06-16 Texas Instruments Inc
JPS5961061A (en) * 1982-09-30 1984-04-07 Fujitsu Ltd Manufacture of semiconductor device
JPH0454985B2 (en) * 1982-09-30 1992-09-01 Fujitsu Ltd
JPH02252187A (en) * 1989-03-24 1990-10-09 Norio Akamatsu Storing method and storage device to execute storage according to storing method

Also Published As

Publication number Publication date
CA1135854A (en) 1982-11-16
GB2005078A (en) 1979-04-11
JPS5812742B2 (en) 1983-03-10
DE2841467C2 (en) 1984-06-14
US4494135A (en) 1985-01-15
GB2005078B (en) 1982-02-17
DE2841467A1 (en) 1979-04-12

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