JPS58139513A - チップ状圧電振動部品の製造方法 - Google Patents

チップ状圧電振動部品の製造方法

Info

Publication number
JPS58139513A
JPS58139513A JP7952782A JP7952782A JPS58139513A JP S58139513 A JPS58139513 A JP S58139513A JP 7952782 A JP7952782 A JP 7952782A JP 7952782 A JP7952782 A JP 7952782A JP S58139513 A JPS58139513 A JP S58139513A
Authority
JP
Japan
Prior art keywords
insulator
piezoelectric
electrodes
electrode
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7952782A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0155605B2 (enExample
Inventor
Isao Toyoshima
豊島 功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP7952782A priority Critical patent/JPS58139513A/ja
Publication of JPS58139513A publication Critical patent/JPS58139513A/ja
Publication of JPH0155605B2 publication Critical patent/JPH0155605B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/13Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/132Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/542Filters comprising resonators of piezoelectric or electrostrictive material including passive elements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/56Monolithic crystal filters

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP7952782A 1982-05-11 1982-05-11 チップ状圧電振動部品の製造方法 Granted JPS58139513A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7952782A JPS58139513A (ja) 1982-05-11 1982-05-11 チップ状圧電振動部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7952782A JPS58139513A (ja) 1982-05-11 1982-05-11 チップ状圧電振動部品の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2146182A Division JPS58138115A (ja) 1982-02-12 1982-02-12 チップ状圧電振動部品の製造方法

Publications (2)

Publication Number Publication Date
JPS58139513A true JPS58139513A (ja) 1983-08-18
JPH0155605B2 JPH0155605B2 (enExample) 1989-11-27

Family

ID=13692451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7952782A Granted JPS58139513A (ja) 1982-05-11 1982-05-11 チップ状圧電振動部品の製造方法

Country Status (1)

Country Link
JP (1) JPS58139513A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082832U (ja) * 1983-11-15 1985-06-08 松下電器産業株式会社 フイルタパツケ−ジ
JPS62109420A (ja) * 1985-11-07 1987-05-20 Alps Electric Co Ltd 弾性表面波素子
US4736128A (en) * 1986-01-28 1988-04-05 Alps Electric Co., Ltd. Surface acoustic wave device
JPS63174338A (ja) * 1987-01-14 1988-07-18 Nec Corp 1チツプsawデバイスの製造方法
US4795934A (en) * 1984-02-20 1989-01-03 British Telecommunication, Plc Mounting of saw devices
JPH0349308A (ja) * 1989-07-17 1991-03-04 Murata Mfg Co Ltd 弾性表面波フイルタ
US5453652A (en) * 1992-12-17 1995-09-26 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device with interdigital transducers formed on a holding substrate thereof and a method of producing the same
US6404110B1 (en) * 1997-05-16 2002-06-11 Murata Manufacturing Co., Ltd Surface acoustic wave element having a bump electrode and surface acoustic wave device comprising the same
DE10016064B4 (de) * 1999-04-02 2006-05-11 Murata Mfg. Co., Ltd., Nagaokakyo Substrat,Einzelsubstrat und Verfahren zur Herstellung derselben

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472696A (en) * 1977-11-21 1979-06-11 Citizen Watch Co Ltd Package for super miniature size piezoelectric oscillator
JPS5661820A (en) * 1979-10-25 1981-05-27 Matsushima Kogyo Co Ltd Quartz oscillator
JPS5717124A (en) * 1980-07-05 1982-01-28 Tdk Electronics Co Ltd Capacitor and method of producing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472696A (en) * 1977-11-21 1979-06-11 Citizen Watch Co Ltd Package for super miniature size piezoelectric oscillator
JPS5661820A (en) * 1979-10-25 1981-05-27 Matsushima Kogyo Co Ltd Quartz oscillator
JPS5717124A (en) * 1980-07-05 1982-01-28 Tdk Electronics Co Ltd Capacitor and method of producing same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082832U (ja) * 1983-11-15 1985-06-08 松下電器産業株式会社 フイルタパツケ−ジ
US4795934A (en) * 1984-02-20 1989-01-03 British Telecommunication, Plc Mounting of saw devices
US5035035A (en) * 1984-02-20 1991-07-30 British Telecommunications Plc Method of mounting saw devices
JPS62109420A (ja) * 1985-11-07 1987-05-20 Alps Electric Co Ltd 弾性表面波素子
US4736128A (en) * 1986-01-28 1988-04-05 Alps Electric Co., Ltd. Surface acoustic wave device
JPS63174338A (ja) * 1987-01-14 1988-07-18 Nec Corp 1チツプsawデバイスの製造方法
JPH0349308A (ja) * 1989-07-17 1991-03-04 Murata Mfg Co Ltd 弾性表面波フイルタ
US5453652A (en) * 1992-12-17 1995-09-26 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device with interdigital transducers formed on a holding substrate thereof and a method of producing the same
US6404110B1 (en) * 1997-05-16 2002-06-11 Murata Manufacturing Co., Ltd Surface acoustic wave element having a bump electrode and surface acoustic wave device comprising the same
DE10016064B4 (de) * 1999-04-02 2006-05-11 Murata Mfg. Co., Ltd., Nagaokakyo Substrat,Einzelsubstrat und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
JPH0155605B2 (enExample) 1989-11-27

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