JPS58139513A - Chip-shaped piezoelectric oscillating parts - Google Patents

Abstract

PURPOSE:To obtain a chip-shaped piezoelectric oscillator which is capable of phase bonding, by forming a conducting film at a cut area of an insulated plate and then laminating it to a piezoelectric oscillating unit. CONSTITUTION:Conducting films 15a-15d including wall surfaces 14a-14d in the thickness direction of cut areas 13a-13d are formed at four corners of an insulator 11. At the same time, lead-out electrodes 17-20 are formed on the main surface of one side of a piezoelectric oscillating unit 12 having an approximately equal size to the insulator 11. The electrodes 17 and 18 serve as input terminals and the electrodes 19 and 20 as output terminals of a surface wave element 21 respectively. The electrodes 17-20 of the element 21 and the films 15-15d of the insulator 11 are soldered to the unit 12 by a deposition process. In such a way, a piezoelectric oscillating parts having high packing density can be obtained in mass production.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-shaped piezoelectric vibrating component that can be phase-bonded by laminating a plate-shaped insulator and piezoelectric vibrating units 1 to 1.

Conventionally, piezoelectric vibrating parts such as resonators, oscillators, filters, and FM discriminators have been manufactured using relatively low frequency bands of seven to seven hundreds of frequencies, depending on the characteristics of the vibration mode of each piezoelectric vibrating unit. For filters, there are Koos type filters that house piezoelectric vibrators 1~ in a box-shaped box-shaped case made of resin, etc., and ceramic filters with a high frequency band of several M+-17 to several 10 M+-12. The filter (゛ is the vibration of the energy-trapped piezoelectric vibrating unit 1-!+l+ The outer resin is applied to the area excluding the l area (+I W, so-called dip-coated type,
Alternatively, surface wave probes having a dip-coated shape or a hermebook shield booth are generally known, but all of these piezoelectric vibrating components are of the lead terminal type in which a lead terminal is attached.

By the way, in recent years, with the miniaturization of electronic devices, various efforts have been made to increase the density of electronic component mounting.
-Lead terminal type L [for electro-vibration parts,
Basically, the piezoelectric vibrator 1~ is covered with an exterior member,
1. Having a configuration in which a plurality of lead terminals protrude from the exterior member has the disadvantage that the shape is large and the packaging density is low.1. :.

The present invention applies 831. The purpose of this project, which was made in view of the current situation, was to convert II electro-vibration parts into a structure suitable for mass production.
The purpose is to attach the piezoelectric vibrating component to the printed board with 1 degree 1 contact, and to improve the mounting density and to simplify the #AJ structure in one culm. Another object is to provide a chip-shaped piezoelectric vibrating component that is easy to manufacture and inexpensive.

For this reason, the present invention provides notches in at least two places of at least one plate-shaped insulator that is to serve as a cover, and provides chip components on at least the wall surface of the insulator in the thickness direction of these notches. A chip in which a conductive film to be an external connection terminal electrode is formed, the above-mentioned insulating material and a piezoelectric vibration unit are laminated, and the extraction electrode of the piezoelectric vibration unit is electrically connected to the above-mentioned conductive film and integrated. In the piezoelectric vibrating component, a partial through hole formed by cutting a synthetic resin substrate in which a C1 through hole is formed is used as the conductive film.

The present invention will now be described in detail with reference to the accompanying drawings.

In Figure 1 (a) and Figure 1 (1)), 11
is a rectangular plate-shaped insulator made of synthetic resin used as printed circuit boards and through-hole plated boards.
12 is a piezoelectric vibration unit that constitutes a surface wave element.

. The insulator 11 has circular arc-shaped notches 13a, 13b, 13c, i3d at its four corners, respectively, and these notches 13a, 13t], 13c,
13d (D Wall surface 14a in the thickness direction of the insulator 11
, '141), 14c, 14cl and insulator 1
The cutout portions 13a, 131. + , +3c
, conductive films 15a and i5b over the vicinity of 13d
, 1! ic and 15d, respectively.

On the other hand, the piezoelectric vibration units 1 to 12 have almost the same dimensions as the two insulators 11, and fan-shaped extraction electrodes 17, 18, 19J and 2o are formed at the four corners of one main surface, respectively. are doing.

The extraction electrodes 17 and 18 are the input terminal and the ground terminal of the surface wave (surface acoustic wave) element 21, respectively, and the extraction electrodes 19 and 2o are the two prong terminals of the surface wave element 21, respectively.

The piezoelectric vibrating unit 12 is laminated with the insulating material 11 having four parts 22 on one main surface thereof in order to ensure the vibration of the surface wave element 21 portion, and both are bonded with adhesive. The above three output electrodes 17, 18, 19 and 2o of the wave element 21, and the conductive film villages ia, 15b, 15c, 1! of the insulator 11. The id is soldered 26 times using the depth method or the like. .

By doing as described above, a chip-shaped surface acoustic wave component 23 as shown in FIG. 2 can be obtained.

When mounting the surface acoustic wave component 23 on the printed circuit board 1 to the board, as shown in FIG. Solder (=1) As shown in FIG. 3 as a representative example of the extraction electrode 19 and the conductive film 15c, the extraction electrodes 17, 18, 19, 20, the conductive films 15a, 1
The surface acoustic wave component 23 is mounted on the printed circuit boards 1 to 24 in a state where the three copper foils 5b, 15c, 15d and the four copper foils 25 corresponding thereto are electrically connected to each other.

In addition, when shielding the surface acoustic wave element 12 portion of the surface acoustic wave component 23, as shown in FIGS. 4 and 5, a shield electrode S is formed on the main surface of the insulator 11, The shield electrode S may be connected to the extraction electrode 18 (earth terminal) via the conductive film 15b.

”: Chip-shaped surface acoustic wave component 2 having the configuration as shown below.
3, as shown in FIG. 6(a), first prepare an insulating base material 31 made of synthetic resin J, which is often used as a material for printed circuit boards and through-ball plating boards. For example, a round hole or a semi-round hole 32 at the edge is formed in the insulator base material 31 at a position where the front-rear and left-right spacing is equal to the width and length of the surface acoustic wave component 23 to be manufactured. ...,
32, and as shown in FIG. 1, the round holes 32. . . , an electrode film 33 . ..., 33
The four portions 22 are provided, for example, by cutting, and preferably, the electrodes on the peripheral edge of the opening end surface on the side that contacts the piezoelectric vibration unit base material 34 are removed by polishing.

On the other hand, as shown in FIG. 6(b), the piezoelectric vibration-1 unit base material 34 is formed by molding the piezoelectric material into a plate shape and firing it.
A circular or semicircular extraction electrode corresponding portion 35. is formed on one main surface of the insulator base material at a position corresponding to the round hole or μ semicircular hole 32 of the insulator base material. ..., 3
These extraction electrode corresponding portions 35.・
..., set up an interdigital electrode connected to 35 [
Surface acoustic wave components 21. ....

Form 21.

Next, the round hole or semi-round hole 32 of the tenth insulating active month 31,
. . , 32 and a portion 35 corresponding to the extraction electrode of the piezoelectric vibration Δ knit base material 34. . . , 35 are aligned with each other, and the insulator base material 31 and the piezoelectric vibration unit base material 34 are bonded to the phase H using an adhesive (not shown).

In the above state, the insulator ffJ, +431 round or semi-round holes 32, . ..., a line 36. passing through the center of 35. ....

36.37. ..., the insulator base material 31 along 37
After cutting the material 34 of the piezoelectric vibration unit 1-1, the round or semi-round hole 32. ..., 32 electrodes 111J 33°..., conductive films 15a to 15d formed by processing 33, and fiIX3 corresponding to extraction electrodes
! + , ..., extraction electrode 1 made by processing 35
By adding half (+1) to 7 to 20, a surface acoustic wave component 23 shown in FIG. 2 can be obtained. In this way, f, Lu
N method (also applicable to the following examples).

In the above manner, one person can produce a ceiling-mounted silk surface acoustic wave component 23 by simply gluing one insulator base material 31 and one piezoelectric vibration unit base material 34 together and cutting them. can do. Furthermore, the insulating base material 31 can be a commercially available material or a similar material that is easy to manufacture and inexpensive.

J of the above-mentioned Li IC surface wave component: uni, excitation (& laminate electrode is formed only on one surface of the piezoelectric plate (9) is a conductive film that should be used as an external connection terminal electrode of the chip component to easily connect the extraction electrode. However, in a bulk wave component using a 1-energy confinement type thickness vibration mode in which excitation electrodes are provided on the opposite main surfaces of a piezoelectric plate such as , it can be easily connected to the first conductive 11'A which is to be the external connection terminal electrode of the chip component, but the extraction electrode of the other 1irl+ fitting electrode goes around the piezoelectric plate using some means and connects to the Same as the first conductive film
Unless it is connected to the second conductive film on the back side, it will not be possible to create a structure that allows phase bonding. Below, we will discuss countermeasures for one-no I-bonding in L energy dojiko 7-me type bulk wave parts.

First, an example in which the present invention is applied to a Nelky confinement type two-terminal resonator (bulk wave) is shown in FIGS. 8, 9, and 10.
1. In this embodiment, as shown in FIG. Two-terminal resonators 47 and 48 having circular electrodes 45 and 4G formed opposite to the electrodes 43 and 42 on the other main surface of 42 and vibrating independently of each other are provided, and these two-terminal resonators 47
．． The electrodes 43 and 44 of 48 are formed at two corners of one diagonal line on the one main surface of the piezoelectric substrate 42 in order to eliminate directionality and make handling convenient.
9. At the same time as pulling out the electrodes 45 and 46 respectively,
This is a connection between

As shown in FIG.
Although it has a circuit configuration in which the two terminals are connected in series, one two-terminal resonator is constructed isometrically. With this configuration, both extraction electrodes 49 and 50 are piezoelectric turns 42.
Since it exists on one side of the piezoelectric vibration mentioned above! IJ unit 4
Insulators 11 and 11 having exactly the same structure as in FIG. 1(a) are stacked and glued on top and bottom of the insulator 11 and 11 as shown in FIG. 9. Oh J, bi :)
0 to the conductive films 15b and 15 of the one insulator 11, respectively.
If solder J is soldered to c with solder 26, a chip-shaped bulk wave [
It is possible to obtain an energy-confined 2@son resonator. In this case, the insulator 11 on the electrode 45, 46 side has four parts 2
It may be replaced with an ordinary insulating plate having only 2.2 and no notches at the corners.3. This also applies to the following embodiments.

Next, when using a three-terminal common electrode with 1 nit, by interposing a 21-Y sensor between the ground side common electrode and its extraction electrode, the input/output electrode of the earth side common electrode can be connected to It is attached to the root side of the piezoelectric tree where the electrode extraction electrode is installed.

In the embodiments shown in FIGS. 8 to 10 above, a piezoelectric vibration-1-2 1-51 having an electrode configuration as shown in FIG.
If you cover the extraction electrode 52 as shown in FIG.
, 53 are chip-shaped with three terminals j (the pendulum 540 is tangential to the divided electrodes 55 and 56, respectively, and a 1-V line C1 is connected between the electrode iI7 and the common electrode 58 of the 1-distribution terminal resonator 54). bulk wave] - It is possible to obtain an energy-confined three-terminal pendulum. With such a structure, the electrode 58
The extraction electrode 57 is located on the same side as the extraction electrodes 52 and 53. Note that if a similar corner C1 is formed at a corner diagonally opposite to the electrode 57, the piezoelectric vibrating parts 1 to 51 have no directionality, making handling convenient.

The embodiments shown in FIGS. 8 to 12 can be used as oscillators, FM discriminator units, filters, etc.

Moreover, if the piezoelectric vibrating conite 61 having the electrode configuration as shown in FIG. 13 is used, as shown in FIG. ,=1 C4J3 and three-terminal resonator 54'
, capacitor C-1 to 4-1? ) Two sets of circuits having exactly the same configuration as in Fig. 12 are connected in cascode, and a capacitor C2 is connected between the three-terminal terminal J and the -l node and the 11-conducting electrode of the divided electrode of the pendulum 54'. A jib-like bulk wave energy confinement type filter is obtained.

One electrode 64 of the capacitor C1 and one electrode 65 of the capacitor C2 are connected to the phase n outside the filter.
It is convenient to add connections such as those shown by dotted lines in FIG. 14, but the connection shown in FIG. 13 also has no directionality.

Next, an embodiment in which the present invention is applied to a non-energy trap type filter is shown in FIGS. 15, 16 (a) and (b).1 In FIG. These resonant elements 71 and 74 have a split type [173°13
At the same time, a common electrode 74 is formed on the other main surface, and a vortex 75 is formed between the split molds 1ii 73, 73 to utilize length vibration [-].

On the other hand, 76 is a substrate made of ceramic or synthetic resin such as aluminum 11- for the fql board of the resonant element 71. 77''-, the above-mentioned resonant element 71.71 is mounted and fixed with elastic anisotropic or isotropic conductive sheets 1 to 78.78 in between, and the common electrode 74.74 is placed and fixed on the above-mentioned drawer 77''. [Conducted to B77.

The resonant elements 71, 71 and the substrate 76 constitute, for example, a piezoelectric vibrating unit 1 corresponding to the piezoelectric vibrating unit 12 shown in FIG. 1(b).

Above the resonant element 71.71, anisotropically conductive sheets 1 to 79.79 having elasticity are placed between them, basically as shown in FIG.
An insulator 11- having the same structure as in a) is placed over the insulator 11-, and the insulator 11- and the substrate are bonded to each other.

The insulator 11- has a recess 22-. for accommodating the resonant element 71.71. 22- (which may be one common recess), and these four parts 22-. Anisotropically conductive sheets 79 and 79 are passed through the inner wall surface of the resonant element 7.
A connecting electrode 80 is formed that connects each one of the divided electrodes 73 and 73 of 1.71 to each other, while the resonant elements 71 and 7
112- The other divided electrodes 73 and 73 are respectively conductive 1!415a
, connection electrodes 81 and 81 are formed to conduct to the IM.

By doing as above, the moon'f1i of the resonant element 71.71
i, the plate 72, 72 is an elastic conductive sheet 18;
and 79 to ensure its vibration, while the other divided electrode 73. It is drawn out to the membranes 15a and 15d, respectively, and
Common electrode 74.74 also has 1-recording lightning conductor [sheet 78.7
8, from the extraction electrode 77 - conductive lX15a
, a conductive film 151) formed at a different position from 15d,
1! It is pulled out to IC.

In the embodiment shown in FIG. 15, the anisotropically conductive sheet 79 on the insulator 11' side cannot be used, for example, as shown in FIG.
) and FIG. 16(b), using the bonding wire 90, the other divided electrode 73, 73
may be electrically connected to the conductive films 15a and 15d.

As described above, a filter in which three-terminal resonators using a non-energy-confined single vibration mode are connected in cascade can also be made into a deep filter. The number of stages to be covered in cascade is (■).In addition, the two-terminal type using a non-energy-confined single vibration mode can also be applied to a three-terminal type oscillator and FM discriminator.Usage mode It goes without saying that the types of vibration elements of non-energy trapping type are not limited to those mentioned above.

d3.Finally, we will discuss the case where the present invention is implemented using an energy confinement type piezoelectric vibrator that uses a conventional lead (= J tJ 'C). Fig. 17 ( 51. Basic piezoelectric vibration in this case-
In the figure, 101 is a piezoelectric substrate, 1
02.1034, a pair of excitation electrodes, 1 (14, 105 are pull-out electrodes installed on the front and back sides of the corners of the piezoelectric 11 plate 101, respectively) on one diagonal clay. Insulators 11 and 11 are laminated and glued from above and below as shown in FIG.
4 and the conductive film 15a in contact with it, and the lead electrode 105 and the lower insulator 1 in contact with it.
1 conductive film 15C of the upper insulator 11. At the same time, the ]-shaped metal clip 106 is inserted between
1] and solder both of them (= I Lt if. Like this / J structure (,: Therefore, both excitation voltage + (12
, 103 is an insulator on the + side +l f7) Conductive film 15a,
15[1] respectively.

]-shaped metal clip with a wire 17 (11 connections may also be made. Also, connect the electrode to the side surface of the piezoelectric substrate M tf) 1
! Alternatively, holes may be provided in the corners of the piezoelectric substrate to form electrode holes to provide a shape metal clip or 97170 function. Such a structure can be applied not only to the two-terminal resonator as described above, but also to three-terminal resonators, filters, and other devices using piezoelectric vibration.

From the above detailed explanation, it is clear that the present invention is based on an insulating plate with cutouts formed in at least two places and a conductive film formed thereon, which is laminated on an F" type vibration unit. When making a piezoelectric vibrating component into a chip by connecting the extraction electrode to a conductive film, the insulating plate 1-) made of synthetic resin is used, and the conductive film is also attached to this synthetic resin plate. [Insulator base material and piezoelectric vibrating unit ffJ are used.
It is possible to easily obtain Oma's piezoelectric vibrating parts by simply laminating materials and cutting them. ■The simple manufacturing process results in low prices, fewer defective products, and reliable products. ■It has the same structure as chip-shaped resistors and capacitors without lead wires, so
Its effects are very unique, such as easy mounting on circuit boards, etc., and easy formation of conductive films using through-hole plating techniques. In addition, this invention has the advantage of being easy to manufacture and can be made at a lower cost, making a great contribution to the practical application of this type of chip-shaped piezoelectric vibrating component.

In addition, 2nd, 3rd, 5th, 9th, 15th, 16th (b)
, No. 18 are for clarifying the connection relationships between the various parts, and the cross sections are shown at appropriate locations, so please note that they are different from so-called cross-sectional views.

[Brief explanation of the drawing]

FIG. 1(a) is a perspective view of the insulator of the -16- embodiment of the piezoelectric vibrating component according to the present invention, and FIG.
Figure 2 is a perspective view of the piezoelectric vibrating part of the piezoelectric vibrating part shown in Fig. Explanatory diagram,
Figure 3 shows the installation of the low-voltage vibration components shown in Figure 2 onto the circuit board 1.
4 is a perspective view of an insulator in which a shield electrode is provided on the insulator shown in FIG. , Fig. 6(a) is a perspective view of the insulating dynamic unit H, and Fig. 6(b) is a piezoelectric vibration unit l.
Fig. 7 is a cross-sectional view of the insulator base material of Fig. 6 (a), Fig. 8 is a perspective view of the piezoelectric vibration unit of the terminal resonator of the bulk wave energy confinement type, and Fig. 7 is a perspective view of Frog H. Figure 9 is an explanatory diagram of the structure of a two-terminal resonator with pulse wave energy confinement.
Fig. 10 is an equivalent circuit diagram of the resonator shown in Fig. 9, Fig. 11 is a perspective view of a piezoelectric vibrating unit 7 of a bulk wave energy confinement type two-terminal resonator, and Fig. 12 is an equivalent circuit diagram of the resonator shown in Fig. 11. The circuit diagram, Fig. 13 is a perspective view of the piezoelectric vibration of the bulk wave energy confinement type filter -1Nitsu I-, and Fig. 14 is the perspective view of the
Fig. 15 is an explanatory diagram of the structure of a non-1 energy confinement type filter, Fig. 16 (a) and Fig. 1
6(b) is a plan view of a piezoelectric vibrating conite of a modified example of the filter shown in FIG. 15, an explanatory view of the structure of the filter, and a first
FIG. 7 is a perspective view of a piezoelectric vibration unit of an energy trap type resonator, and FIG. 18 is an explanatory diagram of an M4 structure of a resonator using the unit shown in FIG. 11. 11.11-...Insulator, 12...Piezoelectric vibration knit, 13...=...Notch, 15a
, 1511.15c, 15d...-=-conductive film,
17.18, 19.20... Extraction electrode, 26
...Solder, 31...Insulator f? ) material,
34...Piezoelectric vibration unit base material, 41.51.
61...Piezoelectric vibration unit, 71...
Resonant element, 76... Radix. Patent applicant Murata Manufacturing Co., Ltd. 19- 1st entry (＾) 2nd dent 3rd figure ((1) 7th figure 3rd figure figure 4th figure Δ1 Rigiku rt
cn Fig. 13 (θ) (I:))

Claims (1)

[Claims] A partial through ball made by cutting a synthetic resin tree root with a through hole formed therein, and a lead electrode of the piezoelectric vibrating chive 1- are electrically connected with the blade and the substrate and the piezoelectric vibrating unit are connected to each other. A chip-shaped piezoelectric vibrating component characterized by laminating and fixing /j.