JPS5731166A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5731166A JPS5731166A JP10591180A JP10591180A JPS5731166A JP S5731166 A JPS5731166 A JP S5731166A JP 10591180 A JP10591180 A JP 10591180A JP 10591180 A JP10591180 A JP 10591180A JP S5731166 A JPS5731166 A JP S5731166A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- pads
- multilayer
- package
- inner pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10591180A JPS5731166A (en) | 1980-07-31 | 1980-07-31 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10591180A JPS5731166A (en) | 1980-07-31 | 1980-07-31 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
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JPS5731166A true JPS5731166A (en) | 1982-02-19 |
JPS6355213B2 JPS6355213B2 (zh) | 1988-11-01 |
Family
ID=14420041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10591180A Granted JPS5731166A (en) | 1980-07-31 | 1980-07-31 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5731166A (zh) |
Cited By (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62283634A (ja) * | 1986-05-31 | 1987-12-09 | Mitsubishi Electric Corp | 半導体装置 |
US4866932A (en) * | 1987-11-09 | 1989-09-19 | Shin Caterpillar Mitsubishi Ltd. | Apparatus for treating particulate emission from diesel engine |
JPH0287635A (ja) * | 1988-09-26 | 1990-03-28 | Nec Corp | セラミック・パッケージ型半導体装置 |
US4956695A (en) * | 1989-05-12 | 1990-09-11 | Rockwell International Corporation | Three-dimensional packaging of focal plane assemblies using ceramic spacers |
WO1992003035A1 (en) * | 1990-08-01 | 1992-02-20 | Staktek Corporation | Ultra high density integrated circuit packages, method and apparatus |
US5239447A (en) * | 1991-09-13 | 1993-08-24 | International Business Machines Corporation | Stepped electronic device package |
US5369056A (en) * | 1993-03-29 | 1994-11-29 | Staktek Corporation | Warp-resistent ultra-thin integrated circuit package fabrication method |
US5367766A (en) * | 1990-08-01 | 1994-11-29 | Staktek Corporation | Ultra high density integrated circuit packages method |
US5377077A (en) * | 1990-08-01 | 1994-12-27 | Staktek Corporation | Ultra high density integrated circuit packages method and apparatus |
US5446620A (en) * | 1990-08-01 | 1995-08-29 | Staktek Corporation | Ultra high density integrated circuit packages |
US5448450A (en) * | 1991-08-15 | 1995-09-05 | Staktek Corporation | Lead-on-chip integrated circuit apparatus |
US5475920A (en) * | 1990-08-01 | 1995-12-19 | Burns; Carmen D. | Method of assembling ultra high density integrated circuit packages |
US5484959A (en) * | 1992-12-11 | 1996-01-16 | Staktek Corporation | High density lead-on-package fabrication method and apparatus |
US5572065A (en) * | 1992-06-26 | 1996-11-05 | Staktek Corporation | Hermetically sealed ceramic integrated circuit heat dissipating package |
US5585668A (en) * | 1995-01-30 | 1996-12-17 | Staktek Corporation | Integrated circuit package with overlapped die on a common lead frame |
US5588205A (en) * | 1995-01-24 | 1996-12-31 | Staktek Corporation | Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails |
US5600183A (en) * | 1994-11-15 | 1997-02-04 | Hughes Electronics | Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate |
US5644161A (en) * | 1993-03-29 | 1997-07-01 | Staktek Corporation | Ultra-high density warp-resistant memory module |
US5783464A (en) * | 1992-06-26 | 1998-07-21 | Staktek Corporation | Method of forming a hermetically sealed circuit lead-on package |
US5801437A (en) * | 1993-03-29 | 1998-09-01 | Staktek Corporation | Three-dimensional warp-resistant integrated circuit module method and apparatus |
US5804004A (en) * | 1992-05-11 | 1998-09-08 | Nchip, Inc. | Stacked devices for multichip modules |
US5886412A (en) * | 1995-08-16 | 1999-03-23 | Micron Technology, Inc. | Angularly offset and recessed stacked die multichip device |
KR19990061323A (ko) * | 1997-12-31 | 1999-07-26 | 윤종용 | 반도체 패키지 |
US5945732A (en) * | 1997-03-12 | 1999-08-31 | Staktek Corporation | Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package |
US6025642A (en) * | 1995-08-17 | 2000-02-15 | Staktek Corporation | Ultra high density integrated circuit packages |
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