CN109360808A - 多层封装集成电路芯片的叠层集成电路封装结构 - Google Patents
多层封装集成电路芯片的叠层集成电路封装结构 Download PDFInfo
- Publication number
- CN109360808A CN109360808A CN201810936567.8A CN201810936567A CN109360808A CN 109360808 A CN109360808 A CN 109360808A CN 201810936567 A CN201810936567 A CN 201810936567A CN 109360808 A CN109360808 A CN 109360808A
- Authority
- CN
- China
- Prior art keywords
- layer
- chip
- multilayer encapsulation
- thickness
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 34
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 13
- 230000005611 electricity Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810936567.8A CN109360808B (zh) | 2016-07-17 | 2016-07-17 | 多层封装集成电路芯片的叠层集成电路封装结构 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810936567.8A CN109360808B (zh) | 2016-07-17 | 2016-07-17 | 多层封装集成电路芯片的叠层集成电路封装结构 |
CN201610560316.5A CN106206458B (zh) | 2016-07-17 | 2016-07-17 | 一种叠层集成电路封装结构 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610560316.5A Division CN106206458B (zh) | 2016-07-17 | 2016-07-17 | 一种叠层集成电路封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109360808A true CN109360808A (zh) | 2019-02-19 |
CN109360808B CN109360808B (zh) | 2021-07-23 |
Family
ID=57475277
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610560316.5A Active CN106206458B (zh) | 2016-07-17 | 2016-07-17 | 一种叠层集成电路封装结构 |
CN201810937368.9A Withdrawn CN109360809A (zh) | 2016-07-17 | 2016-07-17 | 叠层集成电路芯片封装结构 |
CN201810936567.8A Active CN109360808B (zh) | 2016-07-17 | 2016-07-17 | 多层封装集成电路芯片的叠层集成电路封装结构 |
CN201810937371.0A Pending CN109360810A (zh) | 2016-07-17 | 2016-07-17 | 一种多层封装集成电路芯片的叠层集成电路封装结构 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610560316.5A Active CN106206458B (zh) | 2016-07-17 | 2016-07-17 | 一种叠层集成电路封装结构 |
CN201810937368.9A Withdrawn CN109360809A (zh) | 2016-07-17 | 2016-07-17 | 叠层集成电路芯片封装结构 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810937371.0A Pending CN109360810A (zh) | 2016-07-17 | 2016-07-17 | 一种多层封装集成电路芯片的叠层集成电路封装结构 |
Country Status (1)
Country | Link |
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CN (4) | CN106206458B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107889355B (zh) * | 2017-11-10 | 2020-12-01 | Oppo广东移动通信有限公司 | 一种电路板组件以及电子设备 |
CN110299329A (zh) * | 2018-03-21 | 2019-10-01 | 华为技术有限公司 | 一种封装结构及其制作方法、电子设备 |
CN112435995A (zh) * | 2020-09-30 | 2021-03-02 | 日月光半导体制造股份有限公司 | 半导体封装结构及其制造方法 |
CN112435966B (zh) * | 2020-11-27 | 2021-09-14 | 上海易卜半导体有限公司 | 封装件及其形成方法 |
US20220173074A1 (en) | 2020-11-27 | 2022-06-02 | Yibu Semiconductor Co., Ltd. | Chip Package and Method of Forming Chip Packages |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731166A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
US5646828A (en) * | 1995-02-24 | 1997-07-08 | Lucent Technologies Inc. | Thin packaging of multi-chip modules with enhanced thermal/power management |
JP2001237362A (ja) * | 2000-02-22 | 2001-08-31 | Toshiba Corp | 半導体装置 |
TWI311359B (en) * | 2005-07-05 | 2009-06-21 | Samsung Electro Mech | Semiconductor multi-chip package |
US20110180919A1 (en) * | 2010-01-27 | 2011-07-28 | Honeywell International Inc. | Multi-tiered integrated circuit package |
CN105546366A (zh) * | 2015-12-29 | 2016-05-04 | 中国科学院半导体研究所 | 一种光色可调的led叠层光源模块 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297548B1 (en) * | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
CN102332410A (zh) * | 2011-09-29 | 2012-01-25 | 山东华芯半导体有限公司 | 一种芯片的封装方法及其封装结构 |
TWI490960B (zh) * | 2012-01-17 | 2015-07-01 | Chipmos Technologies Inc | 半導體封裝結構及其製作方法 |
JP5846187B2 (ja) * | 2013-12-05 | 2016-01-20 | 株式会社村田製作所 | 部品内蔵モジュール |
US9209138B2 (en) * | 2013-12-09 | 2015-12-08 | Aeroflex Colorado Springs, Inc. | Integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion |
CN104332413A (zh) * | 2014-05-30 | 2015-02-04 | 中国电子科技集团公司第十研究所 | 一体化集成t/r组件芯片的3d组装方法 |
-
2016
- 2016-07-17 CN CN201610560316.5A patent/CN106206458B/zh active Active
- 2016-07-17 CN CN201810937368.9A patent/CN109360809A/zh not_active Withdrawn
- 2016-07-17 CN CN201810936567.8A patent/CN109360808B/zh active Active
- 2016-07-17 CN CN201810937371.0A patent/CN109360810A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731166A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
US5646828A (en) * | 1995-02-24 | 1997-07-08 | Lucent Technologies Inc. | Thin packaging of multi-chip modules with enhanced thermal/power management |
JP2001237362A (ja) * | 2000-02-22 | 2001-08-31 | Toshiba Corp | 半導体装置 |
TWI311359B (en) * | 2005-07-05 | 2009-06-21 | Samsung Electro Mech | Semiconductor multi-chip package |
US20110180919A1 (en) * | 2010-01-27 | 2011-07-28 | Honeywell International Inc. | Multi-tiered integrated circuit package |
CN105546366A (zh) * | 2015-12-29 | 2016-05-04 | 中国科学院半导体研究所 | 一种光色可调的led叠层光源模块 |
Also Published As
Publication number | Publication date |
---|---|
CN106206458B (zh) | 2018-09-25 |
CN109360809A (zh) | 2019-02-19 |
CN109360808B (zh) | 2021-07-23 |
CN109360810A (zh) | 2019-02-19 |
CN106206458A (zh) | 2016-12-07 |
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TA01 | Transfer of patent application right |
Effective date of registration: 20210623 Address after: 431700 Xinchuang Electronic Information Industrial Park, Qiaoxiang Development Zone, Tianmen City, Hubei Province (317 Xihu Road) Applicant after: Xinchuang (Tianmen) Electronic Technology Co.,Ltd. Address before: 430070 room 01, R & D No. 3, 4 / F, building C5, phase III, Rongke Zhigu industrial project, Liqiao village, Hongshan District, Wuhan City, Hubei Province Applicant before: Zhongou (Hubei) Intellectual Property Service Co.,Ltd. Effective date of registration: 20210623 Address after: 430070 room 01, R & D No. 3, 4 / F, building C5, phase III, Rongke Zhigu industrial project, Liqiao village, Hongshan District, Wuhan City, Hubei Province Applicant after: Zhongou (Hubei) Intellectual Property Service Co.,Ltd. Address before: 325600 Dongjie village, Hongqiao Town, Yueqing City, Wenzhou City, Zhejiang Province Applicant before: He Fan |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Laminated integrated circuit packaging structure of multilayer packaging integrated circuit chip Effective date of registration: 20220118 Granted publication date: 20210723 Pledgee: Bank of China Limited Tianmen branch Pledgor: Xinchuang (Tianmen) Electronic Technology Co.,Ltd. Registration number: Y2022980000633 |