CN106206458A - 一种叠层集成电路封装结构 - Google Patents
一种叠层集成电路封装结构 Download PDFInfo
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- CN106206458A CN106206458A CN201610560316.5A CN201610560316A CN106206458A CN 106206458 A CN106206458 A CN 106206458A CN 201610560316 A CN201610560316 A CN 201610560316A CN 106206458 A CN106206458 A CN 106206458A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
Abstract
Description
Claims (8)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610560316.5A CN106206458B (zh) | 2016-07-17 | 2016-07-17 | 一种叠层集成电路封装结构 |
CN201810936567.8A CN109360808B (zh) | 2016-07-17 | 2016-07-17 | 多层封装集成电路芯片的叠层集成电路封装结构 |
CN201810937368.9A CN109360809A (zh) | 2016-07-17 | 2016-07-17 | 叠层集成电路芯片封装结构 |
CN201810937371.0A CN109360810A (zh) | 2016-07-17 | 2016-07-17 | 一种多层封装集成电路芯片的叠层集成电路封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610560316.5A CN106206458B (zh) | 2016-07-17 | 2016-07-17 | 一种叠层集成电路封装结构 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810936567.8A Division CN109360808B (zh) | 2016-07-17 | 2016-07-17 | 多层封装集成电路芯片的叠层集成电路封装结构 |
CN201810937368.9A Division CN109360809A (zh) | 2016-07-17 | 2016-07-17 | 叠层集成电路芯片封装结构 |
CN201810937371.0A Division CN109360810A (zh) | 2016-07-17 | 2016-07-17 | 一种多层封装集成电路芯片的叠层集成电路封装结构 |
Publications (2)
Publication Number | Publication Date |
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CN106206458A true CN106206458A (zh) | 2016-12-07 |
CN106206458B CN106206458B (zh) | 2018-09-25 |
Family
ID=57475277
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810937371.0A Pending CN109360810A (zh) | 2016-07-17 | 2016-07-17 | 一种多层封装集成电路芯片的叠层集成电路封装结构 |
CN201810937368.9A Withdrawn CN109360809A (zh) | 2016-07-17 | 2016-07-17 | 叠层集成电路芯片封装结构 |
CN201810936567.8A Active CN109360808B (zh) | 2016-07-17 | 2016-07-17 | 多层封装集成电路芯片的叠层集成电路封装结构 |
CN201610560316.5A Active CN106206458B (zh) | 2016-07-17 | 2016-07-17 | 一种叠层集成电路封装结构 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810937371.0A Pending CN109360810A (zh) | 2016-07-17 | 2016-07-17 | 一种多层封装集成电路芯片的叠层集成电路封装结构 |
CN201810937368.9A Withdrawn CN109360809A (zh) | 2016-07-17 | 2016-07-17 | 叠层集成电路芯片封装结构 |
CN201810936567.8A Active CN109360808B (zh) | 2016-07-17 | 2016-07-17 | 多层封装集成电路芯片的叠层集成电路封装结构 |
Country Status (1)
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CN (4) | CN109360810A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107889355A (zh) * | 2017-11-10 | 2018-04-06 | 广东欧珀移动通信有限公司 | 一种电路板组件以及电子设备 |
WO2019179184A1 (zh) * | 2018-03-21 | 2019-09-26 | 华为技术有限公司 | 一种封装结构及其制作方法、电子设备 |
CN112435995A (zh) * | 2020-09-30 | 2021-03-02 | 日月光半导体制造股份有限公司 | 半导体封装结构及其制造方法 |
CN112435966A (zh) * | 2020-11-27 | 2021-03-02 | 上海易卜半导体有限公司 | 封装件及其形成方法 |
US11973061B2 (en) | 2020-11-27 | 2024-04-30 | Yibu Semiconductor Co., Ltd. | Chip package including stacked chips and chip couplers |
Citations (5)
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US20010048152A1 (en) * | 1998-06-30 | 2001-12-06 | Moden Walter L. | Stackable ceramic fbga for high thermal applications |
CN102332410A (zh) * | 2011-09-29 | 2012-01-25 | 山东华芯半导体有限公司 | 一种芯片的封装方法及其封装结构 |
CN103208431A (zh) * | 2012-01-17 | 2013-07-17 | 南茂科技股份有限公司 | 半导体封装结构及其制作方法 |
CN104332413A (zh) * | 2014-05-30 | 2015-02-04 | 中国电子科技集团公司第十研究所 | 一体化集成t/r组件芯片的3d组装方法 |
US20150162283A1 (en) * | 2013-12-09 | 2015-06-11 | Aeroflex Colorado Springs, Inc. | Integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5731166A (en) * | 1980-07-31 | 1982-02-19 | Fujitsu Ltd | Semiconductor device |
TW373308B (en) * | 1995-02-24 | 1999-11-01 | Agere Systems Inc | Thin packaging of multi-chip modules with enhanced thermal/power management |
JP3589928B2 (ja) * | 2000-02-22 | 2004-11-17 | 株式会社東芝 | 半導体装置 |
KR100665217B1 (ko) * | 2005-07-05 | 2007-01-09 | 삼성전기주식회사 | 반도체 멀티칩 패키지 |
US8354743B2 (en) * | 2010-01-27 | 2013-01-15 | Honeywell International Inc. | Multi-tiered integrated circuit package |
JP5846187B2 (ja) * | 2013-12-05 | 2016-01-20 | 株式会社村田製作所 | 部品内蔵モジュール |
CN105546366A (zh) * | 2015-12-29 | 2016-05-04 | 中国科学院半导体研究所 | 一种光色可调的led叠层光源模块 |
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2016
- 2016-07-17 CN CN201810937371.0A patent/CN109360810A/zh active Pending
- 2016-07-17 CN CN201810937368.9A patent/CN109360809A/zh not_active Withdrawn
- 2016-07-17 CN CN201810936567.8A patent/CN109360808B/zh active Active
- 2016-07-17 CN CN201610560316.5A patent/CN106206458B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010048152A1 (en) * | 1998-06-30 | 2001-12-06 | Moden Walter L. | Stackable ceramic fbga for high thermal applications |
CN102332410A (zh) * | 2011-09-29 | 2012-01-25 | 山东华芯半导体有限公司 | 一种芯片的封装方法及其封装结构 |
CN103208431A (zh) * | 2012-01-17 | 2013-07-17 | 南茂科技股份有限公司 | 半导体封装结构及其制作方法 |
US20150162283A1 (en) * | 2013-12-09 | 2015-06-11 | Aeroflex Colorado Springs, Inc. | Integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion |
CN104332413A (zh) * | 2014-05-30 | 2015-02-04 | 中国电子科技集团公司第十研究所 | 一体化集成t/r组件芯片的3d组装方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107889355A (zh) * | 2017-11-10 | 2018-04-06 | 广东欧珀移动通信有限公司 | 一种电路板组件以及电子设备 |
WO2019179184A1 (zh) * | 2018-03-21 | 2019-09-26 | 华为技术有限公司 | 一种封装结构及其制作方法、电子设备 |
CN112435995A (zh) * | 2020-09-30 | 2021-03-02 | 日月光半导体制造股份有限公司 | 半导体封装结构及其制造方法 |
CN112435966A (zh) * | 2020-11-27 | 2021-03-02 | 上海易卜半导体有限公司 | 封装件及其形成方法 |
US11973061B2 (en) | 2020-11-27 | 2024-04-30 | Yibu Semiconductor Co., Ltd. | Chip package including stacked chips and chip couplers |
Also Published As
Publication number | Publication date |
---|---|
CN109360810A (zh) | 2019-02-19 |
CN109360808B (zh) | 2021-07-23 |
CN109360808A (zh) | 2019-02-19 |
CN106206458B (zh) | 2018-09-25 |
CN109360809A (zh) | 2019-02-19 |
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Effective date of registration: 20180828 Address after: 325600 Yuhong Road, Hongqiao Town, Yueqing, Zhejiang Province, No. 14 Applicant after: Gao Yanni Address before: 226300 266 Century Avenue, Nantong hi tech Zone, Nantong, Jiangsu Applicant before: Wang Peipei |
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Effective date of registration: 20190612 Address after: 226000 Xingyuan Road 288, Nantong High-tech Industrial Development Zone, Jiangsu Province Patentee after: Jiangsu Zhuoyu Intelligent Technology Co., Ltd. Address before: 325600 Yuhong Road, Hongqiao Town, Yueqing, Zhejiang Province, No. 14 Patentee before: Gao Yanni |
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