JPS57212224A - Epoxy resin composition for encapsulation of semiconductor - Google Patents

Epoxy resin composition for encapsulation of semiconductor

Info

Publication number
JPS57212224A
JPS57212224A JP9783981A JP9783981A JPS57212224A JP S57212224 A JPS57212224 A JP S57212224A JP 9783981 A JP9783981 A JP 9783981A JP 9783981 A JP9783981 A JP 9783981A JP S57212224 A JPS57212224 A JP S57212224A
Authority
JP
Japan
Prior art keywords
epoxy resin
component
composition
alkali metal
extracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9783981A
Other languages
English (en)
Japanese (ja)
Other versions
JPS627212B2 (enrdf_load_stackoverflow
Inventor
Kazuo Iko
Takahiro Yoshioka
Kazuyuki Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP9783981A priority Critical patent/JPS57212224A/ja
Publication of JPS57212224A publication Critical patent/JPS57212224A/ja
Publication of JPS627212B2 publication Critical patent/JPS627212B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9783981A 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor Granted JPS57212224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9783981A JPS57212224A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9783981A JPS57212224A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Publications (2)

Publication Number Publication Date
JPS57212224A true JPS57212224A (en) 1982-12-27
JPS627212B2 JPS627212B2 (enrdf_load_stackoverflow) 1987-02-16

Family

ID=14202879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9783981A Granted JPS57212224A (en) 1981-06-24 1981-06-24 Epoxy resin composition for encapsulation of semiconductor

Country Status (1)

Country Link
JP (1) JPS57212224A (enrdf_load_stackoverflow)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168244A (ja) * 1982-03-30 1983-10-04 Toshiba Corp ダイボンデイング用銀ペ−スト中の不純物抽出方法
JPS59159640A (ja) * 1983-02-28 1984-09-10 Fujikura Ltd 自己接着性絶縁電線およびこれを用いた密閉形圧縮機用電動機
JPS60180911A (ja) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製造法
JPS60191016A (ja) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The 高純度シリカゲル
JPS617325A (ja) * 1984-06-20 1986-01-14 Sumitomo Bakelite Co Ltd 高純度エポキシ樹脂組成物
JPS6117416A (ja) * 1984-07-03 1986-01-25 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製造方法
JPS6139407A (ja) * 1984-07-31 1986-02-25 株式会社フジクラ 自己接着性絶縁電線およびこれを用いた密閉形圧縮機用電動機
JPS6140811A (ja) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法
JPS6148421A (ja) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製法
JPS6148422A (ja) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The 高純度シリカ及びその製法
JPS61221279A (ja) * 1985-03-28 1986-10-01 Nippon Retsuku Kk 金属及びフレキシブルフイルム用一液型絶縁性接着剤
JPS61243853A (ja) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS61247725A (ja) * 1985-04-26 1986-11-05 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPS627723A (ja) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS6259626A (ja) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS62290720A (ja) * 1986-06-11 1987-12-17 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH0286148A (ja) * 1988-09-21 1990-03-27 Nitto Denko Corp 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition
JPS5626926A (en) * 1979-08-10 1981-03-16 Toshiba Corp Epoxy resin molding material for sealing electronic part

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168244A (ja) * 1982-03-30 1983-10-04 Toshiba Corp ダイボンデイング用銀ペ−スト中の不純物抽出方法
JPS59159640A (ja) * 1983-02-28 1984-09-10 Fujikura Ltd 自己接着性絶縁電線およびこれを用いた密閉形圧縮機用電動機
JPS60180911A (ja) * 1984-02-27 1985-09-14 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製造法
JPS60191016A (ja) * 1984-03-12 1985-09-28 Nippon Chem Ind Co Ltd:The 高純度シリカゲル
JPS617325A (ja) * 1984-06-20 1986-01-14 Sumitomo Bakelite Co Ltd 高純度エポキシ樹脂組成物
JPS6117416A (ja) * 1984-07-03 1986-01-25 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製造方法
JPS6139407A (ja) * 1984-07-31 1986-02-25 株式会社フジクラ 自己接着性絶縁電線およびこれを用いた密閉形圧縮機用電動機
JPS6140811A (ja) * 1984-07-31 1986-02-27 Nippon Chem Ind Co Ltd:The 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法
JPS6148421A (ja) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The 高純度シリカおよびその製法
JPS6148422A (ja) * 1984-08-17 1986-03-10 Nippon Chem Ind Co Ltd:The 高純度シリカ及びその製法
JPS61221279A (ja) * 1985-03-28 1986-10-01 Nippon Retsuku Kk 金属及びフレキシブルフイルム用一液型絶縁性接着剤
JPS61243853A (ja) * 1985-04-19 1986-10-30 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS61247725A (ja) * 1985-04-26 1986-11-05 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPS627723A (ja) * 1985-07-03 1987-01-14 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS6259626A (ja) * 1985-09-10 1987-03-16 Shin Etsu Chem Co Ltd エポキシ樹脂組成物
JPS62290720A (ja) * 1986-06-11 1987-12-17 Hitachi Chem Co Ltd 電子部品封止用エポキシ樹脂成形材料
JPS63269555A (ja) * 1987-04-27 1988-11-07 Nitto Electric Ind Co Ltd 半導体装置
JPS6473652A (en) * 1987-09-14 1989-03-17 Nitto Denko Corp Semiconductor device
JPS6473749A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPS6473748A (en) * 1987-09-16 1989-03-20 Nitto Denko Corp Semiconductor device
JPH0286148A (ja) * 1988-09-21 1990-03-27 Nitto Denko Corp 半導体装置

Also Published As

Publication number Publication date
JPS627212B2 (enrdf_load_stackoverflow) 1987-02-16

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