JPS5662324A - Semiconductor device position fitting method - Google Patents

Semiconductor device position fitting method

Info

Publication number
JPS5662324A
JPS5662324A JP13854779A JP13854779A JPS5662324A JP S5662324 A JPS5662324 A JP S5662324A JP 13854779 A JP13854779 A JP 13854779A JP 13854779 A JP13854779 A JP 13854779A JP S5662324 A JPS5662324 A JP S5662324A
Authority
JP
Japan
Prior art keywords
silicon nitride
position fitting
melting
nitride membrane
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13854779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6154247B2 (enrdf_load_stackoverflow
Inventor
Yoshihiro Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP13854779A priority Critical patent/JPS5662324A/ja
Publication of JPS5662324A publication Critical patent/JPS5662324A/ja
Publication of JPS6154247B2 publication Critical patent/JPS6154247B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP13854779A 1979-10-26 1979-10-26 Semiconductor device position fitting method Granted JPS5662324A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13854779A JPS5662324A (en) 1979-10-26 1979-10-26 Semiconductor device position fitting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13854779A JPS5662324A (en) 1979-10-26 1979-10-26 Semiconductor device position fitting method

Publications (2)

Publication Number Publication Date
JPS5662324A true JPS5662324A (en) 1981-05-28
JPS6154247B2 JPS6154247B2 (enrdf_load_stackoverflow) 1986-11-21

Family

ID=15224695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13854779A Granted JPS5662324A (en) 1979-10-26 1979-10-26 Semiconductor device position fitting method

Country Status (1)

Country Link
JP (1) JPS5662324A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967632A (ja) * 1982-10-12 1984-04-17 Oki Electric Ind Co Ltd ウエハ−アライメントマ−クの保存方法
JPS59172722A (ja) * 1983-03-23 1984-09-29 Oki Electric Ind Co Ltd アライメントマ−クの製造方法
JPS60110224U (ja) * 1983-12-28 1985-07-26 三菱樹脂株式会社 蓋付容器
JPH0494522A (ja) * 1990-08-10 1992-03-26 Mitsubishi Electric Corp アライメイト・マーク構造

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4722213U (enrdf_load_stackoverflow) * 1971-04-09 1972-11-13
JPS5459889A (en) * 1977-10-21 1979-05-14 Hitachi Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4722213U (enrdf_load_stackoverflow) * 1971-04-09 1972-11-13
JPS5459889A (en) * 1977-10-21 1979-05-14 Hitachi Ltd Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967632A (ja) * 1982-10-12 1984-04-17 Oki Electric Ind Co Ltd ウエハ−アライメントマ−クの保存方法
JPS59172722A (ja) * 1983-03-23 1984-09-29 Oki Electric Ind Co Ltd アライメントマ−クの製造方法
JPS60110224U (ja) * 1983-12-28 1985-07-26 三菱樹脂株式会社 蓋付容器
JPH0494522A (ja) * 1990-08-10 1992-03-26 Mitsubishi Electric Corp アライメイト・マーク構造

Also Published As

Publication number Publication date
JPS6154247B2 (enrdf_load_stackoverflow) 1986-11-21

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