JPS5658255A - Mos type semiconductor memory device - Google Patents
Mos type semiconductor memory deviceInfo
- Publication number
- JPS5658255A JPS5658255A JP13280979A JP13280979A JPS5658255A JP S5658255 A JPS5658255 A JP S5658255A JP 13280979 A JP13280979 A JP 13280979A JP 13280979 A JP13280979 A JP 13280979A JP S5658255 A JPS5658255 A JP S5658255A
- Authority
- JP
- Japan
- Prior art keywords
- film
- memory capacity
- substrate
- impurities
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C7/00—Parts, details, or accessories of chairs or stools
- A47C7/62—Accessories for chairs
- A47C7/68—Arm-rest tables ; or back-rest tables
- A47C7/70—Arm-rest tables ; or back-rest tables of foldable type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Semiconductor Memories (AREA)
- Static Random-Access Memory (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain a larger memory capacity along with smaller dimensions as a whole by shaping the memory capacity section formed on a semiconductor substrate three dimensional in the construction. CONSTITUTION:A thin dielectric insulator film 3 is applied on an active layer of the semiconductor substrate 1 and an opening is etched in the center thereof to form an impurities diffused region 8 within the substrate 1 exposed. An opening is provided through a dielectric insulator film 3' extended into one of the film 3 to form impurities diffused regions 5 and 5' and both regions are entirely wrapped with a thick oxide film 2. The first impurities containing polycrystal line Si body 6 composing a memory capacity section is so constructed to have a pillarlike part on the undersurface thereof and is fixed with the bottom of the pillarlike body bearing on the region 8 while the outside thereof is wrapped with the film 3. In this manner, the polycrystal Si body is integrated with the film 3 on the substrate 1. Subsequently, the Si body 6 is surrounded by a memory capacity section comprising the second polycrystal line Si 7 containing impurities similarly and a polycrystal line Si gate electrode 7' is applied on the substrate 1 between the regions 5 and 5' through a transmission gate insulator film 3' comprising the film 3' previously provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13280979A JPS5658255A (en) | 1979-10-17 | 1979-10-17 | Mos type semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13280979A JPS5658255A (en) | 1979-10-17 | 1979-10-17 | Mos type semiconductor memory device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5658255A true JPS5658255A (en) | 1981-05-21 |
JPS6410948B2 JPS6410948B2 (en) | 1989-02-22 |
Family
ID=15090079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13280979A Granted JPS5658255A (en) | 1979-10-17 | 1979-10-17 | Mos type semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5658255A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61208255A (en) * | 1985-03-13 | 1986-09-16 | Toshiba Corp | Semiconductor memory device |
EP0194682A2 (en) * | 1985-03-13 | 1986-09-17 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
JPS63208263A (en) * | 1987-02-25 | 1988-08-29 | Toshiba Corp | Semiconductor device |
US4974040A (en) * | 1987-06-17 | 1990-11-27 | Fujitsu Limited | Dynamic random access memory device and method of producing same |
JPH03270162A (en) * | 1990-03-20 | 1991-12-02 | Toshiba Corp | Semiconductor device and its manufacture |
US5071783A (en) * | 1987-06-17 | 1991-12-10 | Fujitsu Limited | Method of producing a dynamic random access memory device |
US5650647A (en) * | 1987-06-17 | 1997-07-22 | Fujitsu Limited | Dynamic random access memory device and method of producing same |
US5939746A (en) * | 1995-12-14 | 1999-08-17 | Nec Corporation | Semiconductor memory device and manufacturing method of the same |
US6046468A (en) * | 1987-11-25 | 2000-04-04 | Fujitsu Limited | Dynamic random access memory device and method for producing the same |
US6617205B1 (en) | 1995-11-20 | 2003-09-09 | Hitachi, Ltd. | Semiconductor storage device and process for manufacturing the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52104088A (en) * | 1976-02-27 | 1977-09-01 | Hitachi Ltd | Mis capacitor |
-
1979
- 1979-10-17 JP JP13280979A patent/JPS5658255A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52104088A (en) * | 1976-02-27 | 1977-09-01 | Hitachi Ltd | Mis capacitor |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0194682A2 (en) * | 1985-03-13 | 1986-09-17 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
JPS61208255A (en) * | 1985-03-13 | 1986-09-16 | Toshiba Corp | Semiconductor memory device |
JPS63208263A (en) * | 1987-02-25 | 1988-08-29 | Toshiba Corp | Semiconductor device |
US4974040A (en) * | 1987-06-17 | 1990-11-27 | Fujitsu Limited | Dynamic random access memory device and method of producing same |
US5021357A (en) * | 1987-06-17 | 1991-06-04 | Fujitsu Limited | Method of making a dram cell with stacked capacitor |
US5071783A (en) * | 1987-06-17 | 1991-12-10 | Fujitsu Limited | Method of producing a dynamic random access memory device |
US5650647A (en) * | 1987-06-17 | 1997-07-22 | Fujitsu Limited | Dynamic random access memory device and method of producing same |
US6046468A (en) * | 1987-11-25 | 2000-04-04 | Fujitsu Limited | Dynamic random access memory device and method for producing the same |
US6114721A (en) * | 1987-11-25 | 2000-09-05 | Fujitsu Limited | Dynamic random access memory device and method for producing the same |
JPH03270162A (en) * | 1990-03-20 | 1991-12-02 | Toshiba Corp | Semiconductor device and its manufacture |
US6617205B1 (en) | 1995-11-20 | 2003-09-09 | Hitachi, Ltd. | Semiconductor storage device and process for manufacturing the same |
US6791134B2 (en) | 1995-11-20 | 2004-09-14 | Hitachi, Ltd. | Semiconductor memory device and manufacturing method thereof |
US6798005B2 (en) | 1995-11-20 | 2004-09-28 | Hitachi, Ltd. | Semiconductor memory device having large storage capacity and minimal step height between memory cell and peripheral circuits |
US7196368B2 (en) | 1995-11-20 | 2007-03-27 | Renesas Technology Corp. | Semiconductor memory arrangements with crown shaped capacitor arrangements trenched in interlayer dielectric film |
US5953609A (en) * | 1995-12-14 | 1999-09-14 | Nec Corporation | Method of manufacturing a semiconductor memory device |
US5939746A (en) * | 1995-12-14 | 1999-08-17 | Nec Corporation | Semiconductor memory device and manufacturing method of the same |
Also Published As
Publication number | Publication date |
---|---|
JPS6410948B2 (en) | 1989-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6421967A (en) | Semiconductor device and manufacture thereof | |
JPS5658254A (en) | Manufacture of mos type semiconductor memory device | |
JPS5658255A (en) | Mos type semiconductor memory device | |
JPS57133668A (en) | Semiconductor memory storage | |
JPS5519820A (en) | Semiconductor device | |
JPS5521102A (en) | Semiconductor memory cell | |
JPS5658253A (en) | Capacitor for integrated circuit | |
JPS5632757A (en) | Insulated gate type transistor and integrated circuit | |
JPS5627942A (en) | Semiconductor device and its manufacturing method | |
JPS5522885A (en) | Insulation gate type field effect semiconductor device | |
JPS561558A (en) | Dynamic memory cell | |
JPS57100760A (en) | Manufacture of semiconductor device | |
JPS55154759A (en) | Manufacture of semiconductor memory device | |
JPS6435958A (en) | Thin film transistor | |
JPS5376771A (en) | Insulated gate type field effect transistor | |
JPS55160455A (en) | Manufacture of insulated gate type field effect semiconductor device | |
JPS5591166A (en) | Semiconductor memory | |
JPS57128957A (en) | Semiconductor integrated circuit device and manufacture thereof | |
JPS6436062A (en) | Large scale integratable memory cell | |
JPS6425465A (en) | Semiconductor storage device | |
JPS564279A (en) | Insulated gate type field effect transistor | |
JPS55160456A (en) | Semiconductor device | |
JPS57103349A (en) | Semiconductor memory device | |
JPS5642372A (en) | Manufacture of semiconductor device | |
JPS566464A (en) | Semiconductor device and manufacture thereof |