JPS53102671A - Pellet mounting method - Google Patents

Pellet mounting method

Info

Publication number
JPS53102671A
JPS53102671A JP1710977A JP1710977A JPS53102671A JP S53102671 A JPS53102671 A JP S53102671A JP 1710977 A JP1710977 A JP 1710977A JP 1710977 A JP1710977 A JP 1710977A JP S53102671 A JPS53102671 A JP S53102671A
Authority
JP
Japan
Prior art keywords
mounting method
pellet
pellet mounting
semispheres
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1710977A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
Osamu Sumiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1710977A priority Critical patent/JPS53102671A/en
Publication of JPS53102671A publication Critical patent/JPS53102671A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83194—Lateral distribution of the layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To surely mount the semiconductor pellet and to avoid dirt on the pellets, by arranging a plural number of conductor paste semispheres through dropping fluid conductive paste over the entire surface of the pellet fixed region on the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP1710977A 1977-02-21 1977-02-21 Pellet mounting method Pending JPS53102671A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1710977A JPS53102671A (en) 1977-02-21 1977-02-21 Pellet mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1710977A JPS53102671A (en) 1977-02-21 1977-02-21 Pellet mounting method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP15749484A Division JPS60105242A (en) 1984-07-30 1984-07-30 Pellet mounting method

Publications (1)

Publication Number Publication Date
JPS53102671A true JPS53102671A (en) 1978-09-07

Family

ID=11934853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1710977A Pending JPS53102671A (en) 1977-02-21 1977-02-21 Pellet mounting method

Country Status (1)

Country Link
JP (1) JPS53102671A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5752142A (en) * 1980-07-23 1982-03-27 Hitachi Ltd Bonding method for pellet
JPS60210844A (en) * 1984-04-05 1985-10-23 Sanken Electric Co Ltd Method of soldering

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5752142A (en) * 1980-07-23 1982-03-27 Hitachi Ltd Bonding method for pellet
JPS60210844A (en) * 1984-04-05 1985-10-23 Sanken Electric Co Ltd Method of soldering
JPH0239864B2 (en) * 1984-04-05 1990-09-07 Sanken Electric Co Ltd

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