JPH1174637A - 電子回路基板 - Google Patents

電子回路基板

Info

Publication number
JPH1174637A
JPH1174637A JP9234213A JP23421397A JPH1174637A JP H1174637 A JPH1174637 A JP H1174637A JP 9234213 A JP9234213 A JP 9234213A JP 23421397 A JP23421397 A JP 23421397A JP H1174637 A JPH1174637 A JP H1174637A
Authority
JP
Japan
Prior art keywords
circuit board
lands
connection
solder
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9234213A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1174637A5 (https=
Inventor
Kazuhiko Arakawa
和彦 荒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP9234213A priority Critical patent/JPH1174637A/ja
Publication of JPH1174637A publication Critical patent/JPH1174637A/ja
Publication of JPH1174637A5 publication Critical patent/JPH1174637A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/237—Multiple bump connectors having different shapes

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9234213A 1997-08-29 1997-08-29 電子回路基板 Pending JPH1174637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9234213A JPH1174637A (ja) 1997-08-29 1997-08-29 電子回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9234213A JPH1174637A (ja) 1997-08-29 1997-08-29 電子回路基板

Publications (2)

Publication Number Publication Date
JPH1174637A true JPH1174637A (ja) 1999-03-16
JPH1174637A5 JPH1174637A5 (https=) 2004-11-04

Family

ID=16967475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9234213A Pending JPH1174637A (ja) 1997-08-29 1997-08-29 電子回路基板

Country Status (1)

Country Link
JP (1) JPH1174637A (https=)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346679B1 (en) 1999-08-27 2002-02-12 Nec Corporation Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate
US6736306B2 (en) 2001-02-05 2004-05-18 Samsung Electronics Co., Ltd. Semiconductor chip package comprising enhanced pads
US6756666B2 (en) 1999-12-24 2004-06-29 Nec Corporation Surface mount package including terminal on its side
US6927491B1 (en) 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
JP2006114777A (ja) * 2004-10-15 2006-04-27 Toshiba Corp プリント配線基板及びこの基板を搭載する情報処理装置
JP2006120977A (ja) * 2004-10-25 2006-05-11 Fujitsu Ltd プリント基板
JP2007027582A (ja) * 2005-07-20 2007-02-01 Brother Ind Ltd 配線基板及び配線基板の製造方法
EP1548825A3 (en) * 2003-12-24 2007-07-04 Seiko Epson Corporation Semiconductor device, manufacturing method thereof and electronic equipment
JP2010074032A (ja) * 2008-09-22 2010-04-02 Kyocer Slc Technologies Corp 配線基板およびその製造方法
US8319115B2 (en) 2008-09-22 2012-11-27 Kyocera Slc Technologies Corporation Wiring board and manufacturing method thereof
CN103839838A (zh) * 2012-11-27 2014-06-04 全视科技有限公司 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列
US10181437B2 (en) 2017-06-12 2019-01-15 Fujitsu Limited Package substrate and method of manufacturing package substrate
CN116705740A (zh) * 2022-09-05 2023-09-05 荣耀终端有限公司 一种芯片、芯片封装结构、芯片封装方法及电子设备

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927491B1 (en) 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
US6346679B1 (en) 1999-08-27 2002-02-12 Nec Corporation Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate
US6756666B2 (en) 1999-12-24 2004-06-29 Nec Corporation Surface mount package including terminal on its side
US6736306B2 (en) 2001-02-05 2004-05-18 Samsung Electronics Co., Ltd. Semiconductor chip package comprising enhanced pads
EP1548825A3 (en) * 2003-12-24 2007-07-04 Seiko Epson Corporation Semiconductor device, manufacturing method thereof and electronic equipment
JP2006114777A (ja) * 2004-10-15 2006-04-27 Toshiba Corp プリント配線基板及びこの基板を搭載する情報処理装置
JP2006120977A (ja) * 2004-10-25 2006-05-11 Fujitsu Ltd プリント基板
JP2007027582A (ja) * 2005-07-20 2007-02-01 Brother Ind Ltd 配線基板及び配線基板の製造方法
JP2010074032A (ja) * 2008-09-22 2010-04-02 Kyocer Slc Technologies Corp 配線基板およびその製造方法
US8319115B2 (en) 2008-09-22 2012-11-27 Kyocera Slc Technologies Corporation Wiring board and manufacturing method thereof
CN103839838A (zh) * 2012-11-27 2014-06-04 全视科技有限公司 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列
CN111653543A (zh) * 2012-11-27 2020-09-11 豪威科技股份有限公司 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列
US10181437B2 (en) 2017-06-12 2019-01-15 Fujitsu Limited Package substrate and method of manufacturing package substrate
CN116705740A (zh) * 2022-09-05 2023-09-05 荣耀终端有限公司 一种芯片、芯片封装结构、芯片封装方法及电子设备
CN116705740B (zh) * 2022-09-05 2024-08-16 荣耀终端有限公司 一种芯片、芯片封装结构、芯片封装方法及电子设备

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