CN103839838A - 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列 - Google Patents
具有经修改的占据面积的球栅格阵列及焊盘栅格阵列 Download PDFInfo
- Publication number
- CN103839838A CN103839838A CN201310409760.3A CN201310409760A CN103839838A CN 103839838 A CN103839838 A CN 103839838A CN 201310409760 A CN201310409760 A CN 201310409760A CN 103839838 A CN103839838 A CN 103839838A
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- Prior art keywords
- shape
- grid array
- bond pads
- island
- scolder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 128
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims description 37
- 238000010992 reflux Methods 0.000 claims description 20
- 238000010276 construction Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 11
- 239000006071 cream Substances 0.000 claims description 5
- 239000003550 marker Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Electromagnetism (AREA)
- Geometry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (23)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010675001.1A CN111653543A (zh) | 2012-11-27 | 2013-09-10 | 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/686,552 | 2012-11-27 | ||
US13/686,552 US9560771B2 (en) | 2012-11-27 | 2012-11-27 | Ball grid array and land grid array having modified footprint |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010675001.1A Division CN111653543A (zh) | 2012-11-27 | 2013-09-10 | 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103839838A true CN103839838A (zh) | 2014-06-04 |
Family
ID=50773121
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010675001.1A Pending CN111653543A (zh) | 2012-11-27 | 2013-09-10 | 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列 |
CN201310409760.3A Pending CN103839838A (zh) | 2012-11-27 | 2013-09-10 | 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010675001.1A Pending CN111653543A (zh) | 2012-11-27 | 2013-09-10 | 具有经修改的占据面积的球栅格阵列及焊盘栅格阵列 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9560771B2 (zh) |
CN (2) | CN111653543A (zh) |
TW (1) | TWI533425B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3190946B1 (en) | 2014-09-10 | 2019-05-08 | Cook Medical Technologies LLC | Low profile circuit board connectors for imaging systems |
EP3030059B1 (en) | 2014-11-12 | 2018-08-15 | OSRAM GmbH | An electronic component and corresponding mounting method |
CN107409471B (zh) * | 2015-03-27 | 2020-07-21 | 京瓷株式会社 | 摄像用部件以及具备该摄像用部件的摄像模块 |
US11033990B2 (en) * | 2018-11-29 | 2021-06-15 | Raytheon Company | Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies |
EP4120326A1 (en) * | 2021-07-14 | 2023-01-18 | Avago Technologies International Sales Pte. Limited | Structure for improved mechanical, electrical, and/or thermal performance |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1174637A (ja) * | 1997-08-29 | 1999-03-16 | Canon Inc | 電子回路基板 |
CN1299518A (zh) * | 1998-09-28 | 2001-06-13 | 株式会社日立制作所 | 半导体封装及其倒装芯片接合法 |
US6268568B1 (en) * | 1999-05-04 | 2001-07-31 | Anam Semiconductor, Inc. | Printed circuit board with oval solder ball lands for BGA semiconductor packages |
CN101370352A (zh) * | 2007-08-13 | 2009-02-18 | 美国博通公司 | 一种印刷电路板及其制作方法和球栅阵列焊盘图案 |
CN101887878A (zh) * | 2009-05-14 | 2010-11-17 | 艾普特佩克股份有限公司 | 光电传感器封装 |
CN101897175A (zh) * | 2007-12-18 | 2010-11-24 | 豪威科技有限公司 | 焊接连接可靠性改进的可回焊相机模块 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6137062A (en) * | 1998-05-11 | 2000-10-24 | Motorola, Inc. | Ball grid array with recessed solder balls |
US6900534B2 (en) | 2000-03-16 | 2005-05-31 | Texas Instruments Incorporated | Direct attach chip scale package |
JP4562579B2 (ja) | 2005-04-06 | 2010-10-13 | パナソニック株式会社 | 半導体装置 |
KR100702969B1 (ko) | 2005-04-19 | 2007-04-03 | 삼성전자주식회사 | 더미 솔더 볼을 갖는 bga형 반도체 칩 패키지의 기판 실장 구조 |
WO2011158069A1 (en) | 2010-06-18 | 2011-12-22 | Nokia Corporation | Sensor |
US8665364B2 (en) | 2010-06-25 | 2014-03-04 | Omnivision Technologies, Inc. | Reinforcement structure for wafer-level camera module |
-
2012
- 2012-11-27 US US13/686,552 patent/US9560771B2/en active Active
-
2013
- 2013-08-15 TW TW102129337A patent/TWI533425B/zh active
- 2013-09-10 CN CN202010675001.1A patent/CN111653543A/zh active Pending
- 2013-09-10 CN CN201310409760.3A patent/CN103839838A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1174637A (ja) * | 1997-08-29 | 1999-03-16 | Canon Inc | 電子回路基板 |
CN1299518A (zh) * | 1998-09-28 | 2001-06-13 | 株式会社日立制作所 | 半导体封装及其倒装芯片接合法 |
US6268568B1 (en) * | 1999-05-04 | 2001-07-31 | Anam Semiconductor, Inc. | Printed circuit board with oval solder ball lands for BGA semiconductor packages |
CN101370352A (zh) * | 2007-08-13 | 2009-02-18 | 美国博通公司 | 一种印刷电路板及其制作方法和球栅阵列焊盘图案 |
CN101897175A (zh) * | 2007-12-18 | 2010-11-24 | 豪威科技有限公司 | 焊接连接可靠性改进的可回焊相机模块 |
CN101887878A (zh) * | 2009-05-14 | 2010-11-17 | 艾普特佩克股份有限公司 | 光电传感器封装 |
Also Published As
Publication number | Publication date |
---|---|
CN111653543A (zh) | 2020-09-11 |
US9560771B2 (en) | 2017-01-31 |
TWI533425B (zh) | 2016-05-11 |
TW201421634A (zh) | 2014-06-01 |
US20140146505A1 (en) | 2014-05-29 |
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