CN102301469A - 具有焊球和管脚的集成电路附接结构 - Google Patents

具有焊球和管脚的集成电路附接结构 Download PDF

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CN102301469A
CN102301469A CN2009801557607A CN200980155760A CN102301469A CN 102301469 A CN102301469 A CN 102301469A CN 2009801557607 A CN2009801557607 A CN 2009801557607A CN 200980155760 A CN200980155760 A CN 200980155760A CN 102301469 A CN102301469 A CN 102301469A
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J.S.西尔威斯特
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Abstract

一种集成电路附接结构包括集成电路和封装组件。该封装组件包括包含该集成电路的封装。该封装在其角落处具有管脚并且在其底面上具有至少主要是焊球的栅格。

Description

具有焊球和管脚的集成电路附接结构
背景技术
集成电路典型地使用管脚栅格阵列或焊球阵列安装到印刷电路板上。管脚栅格阵列更早出现，提供安全的物理的和电的连接。然而，由于管脚延伸通过印刷电路中的孔，因而它们消耗印刷电路板的每层上的区域。焊球阵列结合到顶层上的结合焊盘，保持下面的层完好无损，从而减轻了用于这些下面的层上的导体的布线约束。
附图说明
图1为依照本发明实施例的第一集成电路附接结构的示意性组合底视图和剖视图。在图1的底视图部分中，点线限定了限定IC封装的底面的象限和角落区的十字和菱形。这些点线并不代表物理特征。
图2为组装诸如图1的集成电路附接结构之类的集成附接结构的方法的流程图。
图3为依照本发明实施例的第二集成电路附接结构的示意图。
图4为依照本发明实施例的第三集成电路附接结构的示意图。
图5为组装集成附接结构的可替换方法的流程图。
具体实施方式
本发明的实施例提供了具有焊球和管脚二者的集成电路（IC）封装。焊球提供IC封装与印刷电路板（PCB）之间的大多数物理和电连接，而管脚连接用在IC封装的角落处。焊球和管脚的组合使用解决了本发明人发现的问题：就它们发生故障（例如由于PCB的挠曲）而言，焊球连接首先在焊球栅格的角落处发生故障。在封装处使用管脚连接很大程度上消除了这个问题。
因此，如图1中所示，一种IC附接结构AP1包括IC封装组件101和电路板103，该电路板在这种情况下为PCB。IC封装组件101包括专用集成电路（ASIC）105和封装107。封装107为具有方形顶面109和方形底面111的长方体。在可替换的实施例中，封装的顶面和底面限定非方形矩形；其他实施例也提供其他封装几何结构。
底面111支撑基本上为焊球115的二维方形阵列113的阵列，其中在底面角落125处笔直管脚121-124代替焊球。封装107提供每个球115和管脚121到集成电路105之间的电连接。对于管脚122-124没有提供这样的电连接。在一个可替换的实施例中，封装提供所有管脚到集成电路的电连接；在另一个实施例中，没有任何管脚电连接到集成电路。
电路板103被示出带有具有层L11-L14的柔性衬底；可替换的实施例可以具有更多或更少的层。电路板103承载结合焊盘127和导体131-134。封装107的每个管脚121-124通过电路板103插入到相应的孔135中并且在那里通过焊料137（包括嵌条139）被保持在适当的位置。本发明的实施例提供了使用零个、一些或者所有管脚作为电连接。在所示的实施例中，管脚121与第二层L12的导体131电接触，使得在使用期间，它可以用于在IC 105与电路板103之间传输功率或信号。另一方面，没有这样的导体接触管脚122-124，这些管脚因而仅仅用来加强封装107与电路板103之间的物理连接以便提供用于焊球115与结合焊盘127之间的结合部的应变消除。
图2中绘出了依照本发明实施例的方法ME1的流程图。在方法段M1处，形成具有焊球栅格和角落管脚的IC封装组件。在方法段M2处，将封装组件附接到电路板。当使用诸如图1结构之类的结构应用方法ME1时，这可能涉及通过穿过电路板的孔插入笔直的管脚。可以熔化焊球并且然后可以焊接管脚以便形成封装组件与电路板之间的物理连接和电连接。在方法段M3处，在操作期间，电功率和信号在封装组件的集成电路与电路板之间被传输。取决于实施例，零个、一个、一些或者所有管脚可以用于传输功率或信号；未这样使用的管脚用于物理连接并且不用作电通路。
在方法ME1的一种变型中，方法段M2涉及在封装底面的周界之外将鸥翼型管脚结合到结合焊盘（而在结构AP1中，管脚附接到底面111的周界内）。这种方法导致如图3中所示的IC附接结构AP3。
因此，如图3中所示，IC附接结构AP3包括集成电路封装组件301和电路板303。组件301包括集成电路305和封装307。封装307具有承载焊球316的方形阵列313的底面311。此外，封装307在其角落325处承载鸥翼管脚321和322。
电路板303具有层L31-L34；层L31包括（底面311的）“周界内”结合焊盘焊球以及“周界外”结合焊盘329。焊球315结合到“周界内”结合焊盘327。鸥翼管脚321和322结合到“周界外”表面安装结合焊盘329以便提供用于到结合焊盘327的焊球连接的应变消除。鸥翼管脚321提供在集成电路305与电路板303之间传输功率或信号，而鸥翼管脚322则不然。该实施例的变型可以将零个至所有（例如四个）鸥翼管脚用于集成电路与电路板之间的功率或信号传输。
另一实施例提供了一种IC附接结构，其中管脚直接地附接到支架而不是直接地附接到封装。在这种情况下，集成电路附接结构AP4包括IC封装组件401和电路板403，如图4中所示。组件401包括集成电路405、封装407和支架410。封装407具有承载焊球415的整个（没有角落替换物）方形阵列413的底面411。
焊球415结合到电路板403的表面安装结合焊盘427。支架410的笔直管脚421延伸通过电路板403的周界外孔435并且焊接在适当位置。在这种情况下，管脚用于应变消除而不是用于功率或数据传输。此外，管脚421处于封装407的底面411的周界之外。
支架410的部分紧夹封装407的顶部表面409，将封装407保持在适当位置并且实现管脚421与焊球415的适当对齐。大部分封装顶部409通过支架410暴露以便允许热辐射或者附接散热器。
图5为可替换的IC附接方法ME2的流程图。方法段S1提供获得或者形成具有管脚和焊球栅格的IC封装组件。方法段S2提供将焊球和管脚焊接到电路板。对于所示实施例的这些和其他变型以及修改处于由以下权利要求书限定的本发明的范围之内。

Claims (15)

1.一种集成电路附接结构，包括：
集成电路；
封装组件，其包括包含所述集成电路的封装，所述封装具有底面，所述底面具有角落，所述封装在所述面处包括至少主要是焊球的栅格，所述封装组件在所述角落处包括管脚。
2.如权利要求1所述的集成电路附接结构，其中所述管脚是笔直的管脚。
3.如权利要求2所述的集成电路附接结构，其中所述管脚附接到所述封装。
4.如权利要求3所述的集成电路封装，进一步包括具有通孔的电路板，所述笔直的管脚插入且焊接到所述通孔。
5.如权利要求4所述的集成电路封装，其中所述管脚中的至少一个提供在所述集成电路与所述电路板之间传输功率或信号。
6.如权利要求2所述的集成电路附接结构，其中所述笔直的管脚数量正好为四个。
7.如权利要求1所述的集成电路附接结构，其中所述管脚为附接到所述封装的鸥翼型管脚。
8.如权利要求7所述的集成电路附接结构，进一步包括具有多个层的电路板，所述多个层包括顶层和其他层，所述顶层具有结合焊盘，所述焊球焊接到所述结合焊盘中的至少一些，所述管脚焊接到所述结合焊盘中的其他结合焊盘。
9.如权利要求1所述的集成电路附接结构，其中所述封装组件也包括用于安装到所述封装上的支架，所述支架包括所述管脚。
10.如权利要求7所述的集成电路附接结构，进一步包括电路板，所述电路板具有通孔，所述笔直的管脚插入且焊接到所述通孔，使得所述支架附接到所述封装。
11.一种集成电路附接方法，包括：
获得或者形成具有管脚和焊球栅格的集成电路封装组件；
将所述球和管脚焊接到电路板。
12.如权利要求11所述的集成电路附接方法，进一步包括通过所述管脚中的至少一个在所述集成电路封装与所述印刷电路板之间传输功率或信号。
13.如权利要求11所述的集成电路附接方法，进一步包括通过所述球但不通过所述管脚在所述集成电路封装与所述印刷电路板之间传输功率或信号。
14.如权利要求11所述的集成电路附接方法，其中所述焊接涉及将所述管脚焊接到所述电路板中的孔中。
15.如权利要求11所述的集成电路附接方法，其中所述焊接涉及将所述管脚焊接到所述印刷电路板上的表面安装焊盘上。
CN2009801557607A 2009-01-30 2009-01-30 具有焊球和管脚的集成电路附接结构 Pending CN102301469A (zh)

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