TW201034145A - Integrated-circuit attachment structure with solder balls and pins - Google Patents

Integrated-circuit attachment structure with solder balls and pins Download PDF

Info

Publication number
TW201034145A
TW201034145A TW098145840A TW98145840A TW201034145A TW 201034145 A TW201034145 A TW 201034145A TW 098145840 A TW098145840 A TW 098145840A TW 98145840 A TW98145840 A TW 98145840A TW 201034145 A TW201034145 A TW 201034145A
Authority
TW
Taiwan
Prior art keywords
integrated circuit
package
pins
circuit board
attachment structure
Prior art date
Application number
TW098145840A
Other languages
English (en)
Inventor
Jeffry Scott Sylvester
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of TW201034145A publication Critical patent/TW201034145A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

201034145 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種具有焊料球和針腳之積體電路附接 結構。 發明背景
疋刊用針腳柵狀陣列或者錫球陣列來 安展於印刷電路板上。針腳栅狀陣列出現得比較早，提伊 牢固的物理與電氣連接。'然而，由於針腳是延伸通過-印 刷電路中的孔洞，它_耗在—印㈣路板之每—層上的 —，球_黏接到在_頂層上的焊塾，保留下層完好 無缺，減少在那些下層上之導體的路徑規劃限制。 C 明内容 依據本發明之一實施例，係特地提出一種一種積體電 附接結構’包含：—個積體電路；及-個封裝體組件， 體組件包括一個包含該積體電路的封裝體，該封裝 括二自下表面’該下表面具有數個角落，該封裝體包 件Hi少主要由錫球形成的柵在該下表面，該封裝體組 件在邊等角落包括針腳。 圖式簡單說明 的厂f目疋為本發明之實施例之第—積體電路附接結構 界合底視與切除圖。在第1圖的底視圖部份中，虛線 十字Γ—個菱形’它們界定-IC封裝體之底面的 和角落區域。請等虛線不代表物理特徵。 3 201034145 第2圖疋為級立像是第1圖之那個般之積體電路附接結 構之方法的流程圖。 第3圖是為本發明之實施例之第二積體電路附接結構 的示意圖。 第4圖是為本發明之實施例之第三積體電路附接結構 的示意圖。 第5圖疋為紐立一積體電路附接結構之另一種方法的 流程圖。 【實施冷式】 較佳實施例之詳細說明 本發明的實施例提供具有錫球與針腳的積體電路(1C) 封裝體。該等錫球提供該1C封裝體與一印刷電路板(PCB) 間大部份的物理和電氣連接，而針腳連接是在該IC封裝體 的角落使用。錫球與針腳的結合使用是針對由發明人所發 現的問題：在它們故障的程度上（例如，因PCB的屈曲而 起），錫球連接首先在錫球柵的角落故障。在封裝體使用針 腳連接大大地消除這問題。 因此，一種1C附接結構API包括一個圯封裴體組件1〇1 和一個電路板1〇3,在這情;兄中為-PCB，如在以圖中所 示。ic封裝體組件ι〇1包括一個特定用途積體電路 105和—個封裝體1〇7。封裝體1〇7是為—個具有—方形上表 面109和一方形下表面111的矩形平行六面體。在其他 例中，—封裝體的上和下表面界定非方形矩形；其他實施 施例也提供其他的封裝體幾何。 、的實 201034145 下表面111主要支承錫球115的二維方形陣列U3的陣 列，筆直針腳121-124替換在下表面角落125處的錫球。封 裝體107提供每個球115與針腳121到積體電路1〇5之間的電 氣連接。無如此的電氣連接是提供給針腳122_124。在另一 實施例中’一個封裝體提供電氣連接給所有的針腳到該積 體電路；在另一實施例中，無針腳是電氣連接到該積體電 路。 φ 電路板103是顯示有一個具有數個層L11-L14的撓性基 板，其他實施例可以具有更多或者更少層。電路板1〇3具有 連接焊墊127和導體131-134。封裝體1〇7的每個針腳121-124 疋通過電路板103插入到一對應的孔洞135内而且是由焊料 137，包括填角（fmets) 139，來保持在適當位置。本發明的 實施例使用零個、-些、或者全部針腳作為電氣連接。在 所描緣的實施例令，針腳121達成與第二層U2的導體131 電氣接觸以致於，在使用期間，能夠被用於在IC 1〇5與電 ❹ 路板1G3之間傳輸電力或者訊號。另-方面，無如此之導體 接觸的針腳122-124疋因此僅是用來力〇強封裝體浙與電路 板103之間的物理連接來提供在錫球115與連接焊塾127之 間之黏接的張力緩和。 本發月之實施例的—種方法ME1是在第2圖以流程圖 方式表示在S法段]νπ，__個1(：封裝體組件是形成有一錫 球栅和角落針腳。在方法段Μ2，該封裝體組件是連接到電 路板《方法ΜΕ1是利用像是第！圖之那些般的結構來被施 夺這此夠包含把筆直的針腳插入通過孔洞貫穿電路 5 201034145 板。該等錫球會被熔化而針腳然後能夠被焊接來形成在封 裝體组件與電路板之_物理和電㈣接。在方法段M3， 於運作期㈤電力與誠是在㈣舰件_體電路與電路 板之間傳送。端視該實施例而定，零、一個、一些、或者 全部針腳是可以被用於電力或訊號的傳送；未如此使用的 針腳是用於物理連接而非作為電氣路徑。 在方法ME1的變化中，方法段M2包含把鷗翼式 (gull-wing type)針腳黏接到位在封裝體下表面之邊緣外部 的黏接焊墊(反之，在結構AP1中，該等針腳是連接在下表 面111的周邊(perimeter)之内）。如此的方法得到如在第3圖 中所示的1C附接結構AP3。 據此，如在第3圖中所示，冗附接結構Ap3包括一個積 體電路封裝體組件301和一個電路板3〇3。組件3〇1包括一個 積體電路305和一個封裝體3〇7。封裝體307具有一個設有一 由錫球316形成之方形陣列313的下表面311。此外，封裝體 307在其之角落325處具有鷗翼式針腳321和322。 電路板303具有層L31-L34 ;層L31包括，，(下表面311的） 周邊内部（inside perimeter)，，黏接焊墊錫球和，，周邊外部 (outside perimeter)’’黏接焊墊329。錫球3丨5是黏接到，，周邊内 部”黏接焊墊327。鷗翼式針腳321和322是黏接到”周邊外 部”表面安裝黏接焊墊329來提供到黏接焊墊327之錫球連 接的張力緩和。鷗翼式針腳321提供在積體電路305與電路 板303之間的電力或訊號傳送，而鷗翼式針腳322並不。這 實施例的變化能夠利用零個到全部（例如，四個）鷗翼式針腳 201034145 « • 在積體電路與電路板之間的電力或訊號傳送。 另一個實施例提供一種忙附接結構，在其中，針腳是 直接連接到-個托架而不是直接連接到封裝體。在這情^ 中，積體電路附接結構ΑΡ4包括-_料體組件4〇ι和— 個電路板403，如在第4圖中所示。組件4〇1包括一個積體電 路405、一個封裝體407、和一個托架41〇。封裝體4〇7具有 —個承載—個㈣球化形成之全转（無角料代物）陣列 413的下表面411。 錫球415黏接到電路板403的表面安裝黏著焊墊427。托 架410的筆直針腳421延伸通過電路板403的周邊外部孔洞 435而且是被焊接在適當位置。在這情況中，針腳是用於張 力緩和而不是電力或資料傳送。而且，針腳421是位在封裝 體407之下表面411的周邊外部。 部份的托架410夾住封裝體407的上表面409、保持封裝 體407在適當位置並且造成針腳421與錫球415的適當對 φ 準。大部份的封裝體頂部409是露出托架410外以允許散熱 或者散熱器的連接。 第5圖是為另一ic附接方法ΜΕ2的流程圖。方法段si得 到或形成一個具一錫球和針腳柵的IC封裝體組件。方法段 S2把錫球和針腳焊接到電路板。這些和其他對所描繪之實 施例的變化與修改是在本發明之由後附申請專利範圍所界 定的範圍之内。 【圖式簡單說明】 第1圖是為本發明之實施例之第一積體電路附接結構 7 201034145 的示意組合底視與切除圖。在第1圖的底視圖部份中，虛線 界定一十字和一菱形，它們界定一 1C封裝體之底面的四分 之一和角落面積。該等虛線不代表物理特徵。 第2圖是為組立像是第1圖之那個般之積體電路附接結 構之方法的流程圖。 第3圖是為本發明之實施例之第二積體電路附接結構 的示意圖。 第4圖是為本發明之實施例之第三積體電路附接結構 的示意圖。 第5圖是為組立一積體電路附接結構之另一種方法的 流程圖。 【主要元件符號說明】 101 1C封裝體組件 125 角落 103 電路板 127 焊墊 105 特定用途積體電路 131 導體 107 封裝體 132 導體 109 表面 133 導體 111 表面 134 導體 113 錫球陣列 135 孔洞 115 鍚球 137 焊料 121 針腳 139 填角 122 針腳 301 積體電路封裝體組件 123 針腳 303 電路板 124 針腳 305 積體電路 201034145
307 封裝體 435 孔洞 311 表面 API IC附接結構 313 陣列 AP3 1C附接結構 316 錫球 AP4 1C附接結構 321 針腳 L11 層 322 針腳 L12 層 325 角落 L13 層 327 焊墊 L14 層 329 焊墊 L31 層 401 1C封裝體組件 L32 層 403 電路板 L33 層 405 積體電路 L34 層 407 封裝體 ME1 方法 409 上表面 Ml 方法段 410 托架 M2 方法段 411 表面 M3 方法段 413 陣列 SI 方法段 415 錫球 S2 方法段 421 針腳 427 焊墊 9

Claims (1)

  1. 201034145 七、申請專利範圍： 1. 一種積體電路附接結構，包含： 一個積體電路；及 一個封裝體組件，該封裝體組件包括一個包含該積體 電路的封裝體，該封裝體具有一個下表面，該下表面具 有數個角落，該封裝體包括一個至少主要由錫球形成的 柵在該下表面，該封裝體組件在該等角落包括針腳。 其中 參 2. 如申請專利範圍第1項所述之積體電路附接結構 該等針腳是為筆直針腳。 其中 3. 如申請專利範圍第2項所述之積體電路附接結構 該等針腳是連接到該封裝體。 4. 如申請專利範圍第3項所述之積體電路封裝體，更包含一 個具有貫孔的電路板，該等筆直針腳是插入並焊接至該 等貫孔内。 5. 如申請專利範圍第4項所述之積體電路封裝體，其中，該 等針腳中之至少一者提供在該積體電路與該電路板之間 的電力或訊號傳送。 6. —種積體電路附接方法，包含： 得到或者形成一個具有錫球與針腳栅的積體電路封 裝體組件； 把該等錫球和針腳焊接到一電路板。 7. 如申請專利範圍第6項所述之積體電路附接方法，更包含 透過該等針腳中之至少一者來在該積體電路封裝體與該 印刷電路板之間傳送電力或訊號。 10 201034145 親 • 8.如申請專利範圍第6項所述之積體電路附接方法，更包含 透過該等錫球但不透過該等針腳來在該積體電路封裝體 與該印刷電路板之間傳送電力或訊號。 9. 如申請專利範圍第6項所述之積體電路附接方法，其中， 該焊接包含把該等針腳焊接到在該電路板上的孔洞内。 10. 如申請'專利範圍第6項所述之積體電路附接方法，其 中，該焊接包含把該等針腳焊接到在該印刷電路板上的 Α 表面安裝焊墊上。
    11
TW098145840A 2009-01-30 2009-12-30 Integrated-circuit attachment structure with solder balls and pins TW201034145A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2009/032757 WO2010087856A1 (en) 2009-01-30 2009-01-30 Integrated-circuit attachment structure with solder balls and pins

Publications (1)

Publication Number Publication Date
TW201034145A true TW201034145A (en) 2010-09-16

Family

ID=42395905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098145840A TW201034145A (en) 2009-01-30 2009-12-30 Integrated-circuit attachment structure with solder balls and pins

Country Status (7)

Country Link
US (1) US20110266672A1 (zh)
CN (1) CN102301469A (zh)
BR (1) BRPI0920480A2 (zh)
DE (1) DE112009004069T5 (zh)
GB (1) GB2479312B (zh)
TW (1) TW201034145A (zh)
WO (1) WO2010087856A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9064654B2 (en) * 2012-03-02 2015-06-23 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US9075566B2 (en) 2012-03-02 2015-07-07 Microsoft Technoogy Licensing, LLC Flexible hinge spine
US9134807B2 (en) 2012-03-02 2015-09-15 Microsoft Technology Licensing, Llc Pressure sensitive key normalization
US9426905B2 (en) 2012-03-02 2016-08-23 Microsoft Technology Licensing, Llc Connection device for computing devices
US9298236B2 (en) 2012-03-02 2016-03-29 Microsoft Technology Licensing, Llc Multi-stage power adapter configured to provide a first power level upon initial connection of the power adapter to the host device and a second power level thereafter upon notification from the host device to the power adapter
USRE48963E1 (en) 2012-03-02 2022-03-08 Microsoft Technology Licensing, Llc Connection device for computing devices
US9870066B2 (en) 2012-03-02 2018-01-16 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US9360893B2 (en) 2012-03-02 2016-06-07 Microsoft Technology Licensing, Llc Input device writing surface
US20130300590A1 (en) 2012-05-14 2013-11-14 Paul Henry Dietz Audio Feedback
US10031556B2 (en) 2012-06-08 2018-07-24 Microsoft Technology Licensing, Llc User experience adaptation
US9019615B2 (en) 2012-06-12 2015-04-28 Microsoft Technology Licensing, Llc Wide field-of-view virtual image projector
US9073123B2 (en) 2012-06-13 2015-07-07 Microsoft Technology Licensing, Llc Housing vents
US8964379B2 (en) 2012-08-20 2015-02-24 Microsoft Corporation Switchable magnetic lock
US8654030B1 (en) 2012-10-16 2014-02-18 Microsoft Corporation Antenna placement
CN104903026B (zh) 2012-10-17 2017-10-24 微软技术许可有限责任公司 金属合金注射成型溢流口
CN104870123B (zh) 2012-10-17 2016-12-14 微软技术许可有限责任公司 金属合金注射成型突起
WO2014059618A1 (en) 2012-10-17 2014-04-24 Microsoft Corporation Graphic formation via material ablation
US9304549B2 (en) 2013-03-28 2016-04-05 Microsoft Technology Licensing, Llc Hinge mechanism for rotatable component attachment
GB201309211D0 (en) 2013-05-22 2013-07-03 Ibm System and method for manuacturing a product using a soldering process
US9424048B2 (en) 2014-09-15 2016-08-23 Microsoft Technology Licensing, Llc Inductive peripheral retention device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4878611A (en) * 1986-05-30 1989-11-07 American Telephone And Telegraph Company, At&T Bell Laboratories Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
US5490040A (en) * 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
GB9400384D0 (en) * 1994-01-11 1994-03-09 Inmos Ltd Circuit connection in an electrical assembly
JPH08191111A (ja) * 1995-01-12 1996-07-23 Sumitomo Electric Ind Ltd 電子部品パッケージ
US5710071A (en) * 1995-12-04 1998-01-20 Motorola, Inc. Process for underfilling a flip-chip semiconductor device
JP3834426B2 (ja) * 1997-09-02 2006-10-18 沖電気工業株式会社 半導体装置
US6978539B2 (en) * 2002-07-17 2005-12-27 Compal Electronics, Inc. Method for attaching an integrated circuit package to a circuit board
US7242084B2 (en) * 2005-05-27 2007-07-10 Intel Corporation Apparatuses and associated methods for improved solder joint reliability

Also Published As

Publication number Publication date
BRPI0920480A2 (pt) 2015-12-22
DE112009004069T5 (de) 2012-06-21
US20110266672A1 (en) 2011-11-03
GB2479312A (en) 2011-10-05
GB201112700D0 (en) 2011-09-07
CN102301469A (zh) 2011-12-28
GB2479312B (en) 2013-05-29
WO2010087856A1 (en) 2010-08-05

Similar Documents

Publication Publication Date Title
TW201034145A (en) Integrated-circuit attachment structure with solder balls and pins
CN110164901B (zh) 阵列基板及其制备方法、显示面板和显示装置
TWI235469B (en) Thermally enhanced semiconductor package with EMI shielding
WO2020024830A1 (zh) 线路板组件、感光组件、摄像模组及感光组件制作方法
KR100386995B1 (ko) 반도체 장치 및 그 배선 방법
CN100452396C (zh) 半导体装置及其制造方法
US7109575B2 (en) Low-cost flexible film package module and method of manufacturing the same
TW200807774A (en) Cooling device for light emitting diode (LED) module and method for fabricating the same
JP2009015324A (ja) フレキシブルプリント回路基板とこれを用いた液晶表示装置
KR20070058972A (ko) 테이프 캐리어 패키지 및 그것을 탑재한 표시 장치
JP2004179232A (ja) 半導体装置及びその製造方法並びに電子機器
US20070193773A1 (en) Flexible printed circuit board and electronic component assembly
KR20090089239A (ko) Ｃｏｆ 패키징 구조, ｃｏｆ 패키징 구조를 제조하는 방법,및 드라이버 ｉｃ와 그 ｃｏｆ 패키징 구조를어셈블링하기 위한 방법
US7851904B2 (en) Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
WO2019127161A1 (zh) 触控显示屏及其制作方法以及显示设备
JP5078631B2 (ja) 半導体装置
TWI750104B (zh) 印刷電路板結構
TWI766275B (zh) 影像顯示器及其電路承載與控制模組
JPH08191128A (ja) 電子装置
JP7474143B2 (ja) 光モジュール
TWM560607U (zh) 液晶顯示器連接結構
JPH10107091A (ja) 電子部品の実装構造およびその製造方法
JP5107270B2 (ja) 実装基板および電子機器
JP2005217082A (ja) 半導体実装体
JP2004319692A (ja) 電子回路基板