JPH1174637A5 - - Google Patents

Info

Publication number
JPH1174637A5
JPH1174637A5 JP1997234213A JP23421397A JPH1174637A5 JP H1174637 A5 JPH1174637 A5 JP H1174637A5 JP 1997234213 A JP1997234213 A JP 1997234213A JP 23421397 A JP23421397 A JP 23421397A JP H1174637 A5 JPH1174637 A5 JP H1174637A5
Authority
JP
Japan
Prior art keywords
connection terminals
solder balls
bga
bga package
called
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997234213A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1174637A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9234213A priority Critical patent/JPH1174637A/ja
Priority claimed from JP9234213A external-priority patent/JPH1174637A/ja
Publication of JPH1174637A publication Critical patent/JPH1174637A/ja
Publication of JPH1174637A5 publication Critical patent/JPH1174637A5/ja
Pending legal-status Critical Current

Links

JP9234213A 1997-08-29 1997-08-29 電子回路基板 Pending JPH1174637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9234213A JPH1174637A (ja) 1997-08-29 1997-08-29 電子回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9234213A JPH1174637A (ja) 1997-08-29 1997-08-29 電子回路基板

Publications (2)

Publication Number Publication Date
JPH1174637A JPH1174637A (ja) 1999-03-16
JPH1174637A5 true JPH1174637A5 (https=) 2004-11-04

Family

ID=16967475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9234213A Pending JPH1174637A (ja) 1997-08-29 1997-08-29 電子回路基板

Country Status (1)

Country Link
JP (1) JPH1174637A (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927491B1 (en) 1998-12-04 2005-08-09 Nec Corporation Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
JP3343730B2 (ja) 1999-08-27 2002-11-11 埼玉日本電気株式会社 実装基板及び電気部品の実装方法
JP2001185640A (ja) 1999-12-24 2001-07-06 Nec Corp 表面実装型パッケージ及び電子部品並びに電子部品の製造方法
KR20020065045A (ko) 2001-02-05 2002-08-13 삼성전자 주식회사 확장 패드들을 포함하는 반도체 칩 패키지
JP2005183849A (ja) * 2003-12-24 2005-07-07 Seiko Epson Corp 半導体装置及びその製造方法、並びに電子機器
JP4625674B2 (ja) * 2004-10-15 2011-02-02 株式会社東芝 プリント配線基板及びこの基板を搭載する情報処理装置
JP2006120977A (ja) * 2004-10-25 2006-05-11 Fujitsu Ltd プリント基板
JP4797482B2 (ja) * 2005-07-20 2011-10-19 ブラザー工業株式会社 配線基板及び配線基板の製造方法
KR101627574B1 (ko) 2008-09-22 2016-06-21 쿄세라 코포레이션 배선 기판 및 그 제조 방법
JP2010074032A (ja) * 2008-09-22 2010-04-02 Kyocer Slc Technologies Corp 配線基板およびその製造方法
US9560771B2 (en) * 2012-11-27 2017-01-31 Omnivision Technologies, Inc. Ball grid array and land grid array having modified footprint
JP6866778B2 (ja) 2017-06-12 2021-04-28 富士通株式会社 パッケージ基板及びパッケージ基板の製造方法
CN116705740B (zh) * 2022-09-05 2024-08-16 荣耀终端有限公司 一种芯片、芯片封装结构、芯片封装方法及电子设备

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